SCHEMBL14213141

SCHEMBL14213141

Cc1cc(C(=O)O)c(O)cc1-c1cc(O)c(C(=O)O)cc1C

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GRM1 Q13255 1/20 0.55
CSNK2A1 P68400 1/20 0.52
ALDH1A1 P00352 4/20 0.52
MCL1 Q07820 5/20 0.49
KDM4E B2RXH2 4/20 0.48
HPGD P15428 3/20 0.48
HSD17B10 Q99714 3/20 0.48
GAA P10253 2/20 0.48
CA1 P00915 3/20 0.47
CA2 P00918 3/20 0.47
RECQL P46063 2/20 0.46
POLB P06746 1/20 0.46
MAPT P10636 1/20 0.46
G6PD P11413 1/20 0.46
MAPK1 P28482 1/20 0.46
CA12 O43570 2/20 0.45
CA7 P43166 2/20 0.45
CA9 Q16790 2/20 0.45
CA14 Q9ULX7 2/20 0.45
PTGS2 P35354 2/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL975877 0.86 ALDH1A1 (0.66) GRM1CSNK2A1ALDH1A1MCL1KDM4E
SCHEMBL14950611 0.84 HNF4A (0.53) CSNK2A1ALDH1A1MCL1KDM4EGAA
SCHEMBL14950604 0.84 HNF4A (0.53) CSNK2A1ALDH1A1MCL1KDM4EGAA
SCHEMBL14950612 0.84 HNF4A (0.53) CSNK2A1ALDH1A1MCL1KDM4EGAA
SCHEMBL14950615 0.84 HNF4A (0.53) CSNK2A1ALDH1A1MCL1KDM4EGAA
SCHEMBL4893830 0.84 GRM1 (0.56) GRM1CSNK2A1ALDH1A1MCL1KDM4E
SCHEMBL17171674 0.84 GRM1 (0.56) GRM1CSNK2A1ALDH1A1MCL1KDM4E
SCHEMBL5159290 0.83 KDM4E (0.48) GRM1CSNK2A1ALDH1A1MCL1KDM4E
SCHEMBL14182685 0.82 GRM1 (0.41) GRM1CSNK2A1ALDH1A1MCL1KDM4E
SCHEMBL18925247 0.81 CSNK2A1 (0.47) GRM1CSNK2A1ALDH1A1MCL1CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7368216-B2 Photosensitive resin composition and manufacturing method of semiconductor device using the same FUJIFILM CORPORATION (JP) 2008-05-06 US disclosed
US-20070254243-A1 METHOD FOR MANUFACTURING PHOTOSENSITIVE RESIN COMPOSITION AND RELIEF PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2007-11-01 US disclosed
US-20070254243-A1 METHOD FOR MANUFACTURING PHOTOSENSITIVE RESIN COMPOSITION AND RELIEF PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2007-11-01 US disclosed
US-20070172753-A1 Photosensitive resin composition and manufacturing method of semiconductor device using the same FUJIFILM CORPORATION (JP) 2007-07-26 US disclosed