SCHEMBL14213196

SCHEMBL14213196

O=C(O)c1cc(C(F)(F)F)c(-c2c(C(F)(F)F)cc(C(=O)O)cc2C(F)(F)F)c(C(F)(F)F)c1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TPMT P51580 3/20 0.46
RXRA P19793 3/20 0.42
RXRB P28702 3/20 0.42
RXRG P48443 3/20 0.42
CA12 O43570 2/20 0.42
CA1 P00915 2/20 0.42
CA2 P00918 2/20 0.42
CA7 P43166 2/20 0.42
CA9 Q16790 2/20 0.42
CA14 Q9ULX7 2/20 0.42
SRD5A2 P31213 2/20 0.42
ASPH Q12797 1/20 0.41
LMNA P02545 2/20 0.41
MAPT P10636 2/20 0.41
KDM4E B2RXH2 1/20 0.41
ALDH1A1 P00352 1/20 0.41
TP53 P04637 1/20 0.41
CA3 P07451 1/20 0.41
SELL P14151 1/20 0.41
HPGD P15428 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL817538 0.84 RXRA (0.46) TPMTRXRARXRBRXRGCA12
SCHEMBL7721527 0.84 RXRA (0.41) TPMTRXRARXRBRXRGCA12
SCHEMBL28053969 0.84 RXRA (0.41) TPMTRXRARXRBRXRGCA12
SCHEMBL14182686 0.82 MRGPRX4 (0.35) TPMTRXRARXRBRXRGSRD5A2
Hydrochloric Acid SCHEMBL7981979 0.82 RXRA (0.40) TPMTRXRARXRBRXRGCA12
SCHEMBL29738542 0.79 CES2 (0.45) TPMTRXRARXRBRXRGCA12
SCHEMBL1457766 0.79 CA12 (0.61) TPMTRXRARXRBRXRGCA12
SCHEMBL627998 0.79 CES2 (0.45) TPMTRXRARXRBRXRGCA12
SCHEMBL31319449 0.77 RXRA (0.48) RXRARXRBRXRGCA12CA1
SCHEMBL827082 0.77 RXRA (0.48) RXRARXRBRXRGCA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7368216-B2 Photosensitive resin composition and manufacturing method of semiconductor device using the same FUJIFILM CORPORATION (JP) 2008-05-06 US disclosed
US-20070254243-A1 METHOD FOR MANUFACTURING PHOTOSENSITIVE RESIN COMPOSITION AND RELIEF PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2007-11-01 US disclosed
US-20070254243-A1 METHOD FOR MANUFACTURING PHOTOSENSITIVE RESIN COMPOSITION AND RELIEF PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2007-11-01 US disclosed
US-20070172753-A1 Photosensitive resin composition and manufacturing method of semiconductor device using the same FUJIFILM CORPORATION (JP) 2007-07-26 US disclosed