SCHEMBL144020

SCHEMBL144020

CC(C)(c1ccccc1Oc1ccc(N)cc1)c1ccccc1Oc1ccc(N)cc1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NCOA1 Q15788 1/20 0.51
NCOA3 Q9Y6Q9 1/20 0.51
MAOA P21397 2/20 0.50
ALDH1A1 P00352 7/20 0.48
MAPT P10636 5/20 0.48
NPC1 O15118 3/20 0.48
RAB9A P51151 3/20 0.48
MAPK1 P28482 3/20 0.48
HPGD P15428 1/20 0.48
TDP1 Q9NUW8 3/20 0.46
CYP3A4 P08684 1/20 0.46
TSHR P16473 1/20 0.46
TEAD4 Q15561 1/20 0.44
HTT P42858 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.44
RIPK1 Q13546 1/20 0.43
MEN1 O00255 3/20 0.42
KMT2A Q03164 3/20 0.42
SMN1; SMN2 Q16637 3/20 0.42
POLB P06746 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9418327 0.98 MAOA (0.53) NCOA1NCOA3MAOAALDH1A1MAPT
SCHEMBL1851072 0.90 ALDH1A1 (0.56) NCOA1NCOA3MAOAALDH1A1MAPT
SCHEMBL1501443 0.90 NCOA1 (0.50) NCOA1NCOA3MAOAALDH1A1MAPT
SCHEMBL7218477 0.89 NCOA1 (0.43) NCOA1NCOA3MAOAALDH1A1MAPT
SCHEMBL1683784 0.89 MAOB (0.53) NCOA1NCOA3MAOAALDH1A1MAPT
SCHEMBL28367828 0.89 ALDH1A1 (0.53) NCOA1NCOA3MAOAALDH1A1MAPT
SCHEMBL29726520 0.89 NCOA1 (0.51) NCOA1NCOA3MAOAALDH1A1MAPT
SCHEMBL20339915 0.89 NCOA1 (0.51) NCOA1NCOA3MAOAALDH1A1MAPT
SCHEMBL8542704 0.89 MAOA (0.52) NCOA1NCOA3MAOAALDH1A1MAPT
SCHEMBL6832307 0.87 NCOA1 (0.50) NCOA1NCOA3MAOAALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1039 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114929474-B Flexible metal-clad laminate with microstrip line structure 株式会社钟化 2025-01-07 CN claimed
US-20240352194-A1 POLYIMIDE FOR SPACECRAFT, POLYIMIDE FILM FOR SPACECRAFT, AND SPACECRAFT MEMBER INCLUDING SAME NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2024-10-24 US claimed
EP-4446360-A1 POLYIMIDE FOR SPACECRAFT, POLYIMIDE FILM FOR SPACECRAFT, AND SPACECRAFT MEMBER INCLUDING SAME NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2024-10-16 EP claimed
CN-114695892-B Diamine cross-linked polyimide for negative electrode binder and preparation method thereof 江苏环峰电工材料有限公司 2024-08-02 CN claimed
US-11760838-B2 Polyimide resin precursor ARISAWA MFG. CO., LTD. (JP) 2023-09-19 US claimed
WO-2023106369-A1 POLYIMIDE FOR SPACECRAFT, POLYIMIDE FILM FOR SPACECRAFT, AND SPACECRAFT MEMBER INCLUDING SAME 日鉄ケミカル&マテリアル株式会社 2023-06-15 WO claimed
EP-3394153-B1 POLYIMIDE-BASED POLYMER THICK FILM COMPOSITIONS DU PONT CHINA LTD (US) 2023-05-03 EP claimed
CN-115210077-A Low dielectric composite film for copper-clad laminate and copper-clad laminate comprising same 象牙弗隆泰克株式会社 2022-10-18 CN claimed
CN-114695892-A Diamine cross-linked polyimide for negative binder and preparation method thereof 江苏环峰电工材料有限公司广州分公司 2022-07-01 CN claimed
US-11118013-B2 Polyimide resin precursor ARISAWA MFG. CO., LTD. (JP) 2021-09-14 US claimed
EP-0344594-A1 Thermoplastic aromatic copolyetheramide, process for its preparation and its use to produce molded articles HOECHST AKTIENGESELLSCHAFT (DE) 1989-12-06 EP claimed
US-4847358-A HEAT RESISTANT ELECTRONICS HITACHI CHEMICAL COMPANY, LTD. (JP) 1989-07-11 US claimed
EP-0290909-A1 Use of special polyimides as molded foils and coating material BAYER AG (DE) 1988-11-17 EP claimed
EP-0290910-A1 Special polyimide as thermoplast BAYER AG (DE) 1988-11-17 EP claimed
EP-0260833-A2 Process for producing polyamide acid having siloxane bonds and polyimide having siloxane bonds and isoindoloquinazolinedione rings HITACHI CHEMICAL COMPANY (JP) 1988-03-23 EP claimed
US-4725642-A USING AN ETHER- OR THIOETHER-CONTAINING AROMATIC DIAMINE; AIRCRAFT PANELS; PRINTED CIRCUITS E. I. DU PONT DE NEMOURS AND COMPANY (US) 1988-02-16 US claimed
US-4663401-A POLYSULFONE POLYETHER BLEND WITH DIAMINE CURING AGENT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1987-05-05 US claimed
EP-0200204-A2 Melt-fusible copolyimides E.I. DU PONT DE NEMOURS AND COMPANY (US) 1986-11-05 EP claimed
US-4595745-A Polycondensation product of aromatic dicarboxylic acid component comprising acids and acid halides with organic diamine comprising diamino chalcone and ester or ether containing diamine and nonphotocrosslinkable diamine UBE INDUSTRIES, LTD. (JP) 1986-06-17 US claimed
EP-0161576-A2 Epoxy resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1985-11-21 EP claimed