SCHEMBL14458098

SCHEMBL14458098

COc1cnc(C(C)=O)c(O)c1OC

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.43
MAPT P10636 3/20 0.42
TDP1 Q9NUW8 1/20 0.42
PPARG P37231 1/20 0.39
PPARD Q03181 1/20 0.39
PPARA Q07869 1/20 0.39
CYP3A4 P08684 3/20 0.39
HTT P42858 2/20 0.38
CA12 O43570 2/20 0.35
CA1 P00915 2/20 0.35
CA7 P43166 2/20 0.35
CA9 Q16790 2/20 0.35
CA2 P00918 1/20 0.35
CA3 P07451 1/20 0.35
PKM P14618 1/20 0.35
CA4 P22748 1/20 0.35
CA6 P23280 1/20 0.35
CA5A P35218 1/20 0.35
CA14 Q9ULX7 1/20 0.35
CA5B Q9Y2D0 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14284230 0.73 LMNA (0.44) LMNAMAPTTDP1CYP3A4HTT
SCHEMBL14458095 0.71 PDE4D (0.50) LMNASMN1; SMN2GAAKCNA3
SCHEMBL18860720 0.70 ALDH1A1 (0.44) LMNAMAPTSMN1; SMN2
SCHEMBL15373320 0.69 BCHE (0.41) LMNAMAPTTDP1SMN1; SMN2
SCHEMBL20855865 0.69 HCRTR1 (0.42) LMNAMAPTCYP3A4HTTCA9
SCHEMBL23267686 0.69 LMNA (0.40) LMNAMAPTCYP3A4HTTSMN1; SMN2
SCHEMBL18864947 0.69 CYP3A4 (0.47) LMNAMAPTCYP3A4HTTSMN1; SMN2
SCHEMBL12829101 0.69 DYRK1A (0.39)
SCHEMBL21605545 0.68 MAPT (0.40) LMNAMAPTHTTSMN1; SMN2MAPK1
SCHEMBL19196784 0.68 ALDH1A1 (0.46) LMNAMAPTHTTSMN1; SMN2MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7250389-B1 Antifungal compound and process for producing the same MEIJI SEIKA KAISHA, LTD. (JP) 2007-07-31 US disclosed
US-7250389-B1 Antifungal compound and process for producing the same MEIJI SEIKA KAISHA, LTD. (JP) 2007-07-31 US disclosed