Known targets — ChEMBL curated mechanism
ABL1ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB2AGTR1BCL2BCL2A1BCL2L1BCL2L10BCL2L2BCRBRAFCHRM1CHRNA10CHRNA9DRD1DRD2DRD3DRD4DRD5EGFRF2FLT1FLT4GCKGHSRGNRHRGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHTR1AHTR1BHTR1DHTR2AHTR2CHTR3AIDH2KDRKITMAOBMCL1MTTPPP4HBPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PIKFYVEROCK1ROCK2SLC18A2SLC6A2SLC6A3SLC6A4TACR1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8gyrAgyrBparCparEpol
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28150215 | 0.95 | — | — | |
| SCHEMBL28264462 | 0.95 | — | — | |
| SCHEMBL128169 | 0.94 | — | — | |
| SCHEMBL8596055 | 0.94 | CA2 (0.58) | — | |
| SCHEMBL105 | 0.94 | — | — | |
| SCHEMBL25599 | 0.94 | CA2 (0.58) | — | |
| SCHEMBL15109974 | 0.94 | — | — | |
| SCHEMBL246838 | 0.94 | CA2 (0.58) | — | |
| SCHEMBL4074218 | 0.89 | CA2 (0.54) | — | |
| SCHEMBL20570964 | 0.89 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 186 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12606743-B2 | Quantum dot structure, manufacturing method thereof, and quantum dot light-emitting device | BOE TECHNOLOGY GROUP CO., LTD. (CN) | 2026-04-21 | — | — | US | claimed |
| CN-120051044-A | Heterojunction solar cell and preparation method thereof | 苏州迈为科技股份有限公司 | 2025-05-27 | — | — | CN | claimed |
| CN-119504514-A | Preparation method of indium methylsulfonate solution | 广东臻鼎环境科技有限公司 | 2025-02-25 | — | — | CN | claimed |
| CN-119307156-A | Non-zinc-rich water-based primer, preparation method and application | 江苏德威涂料有限公司 | 2025-01-14 | — | — | CN | claimed |
| CN-119144970-A | Method for preparing indium methylsulfonate solution by electrolytic process | 广东臻鼎环境科技有限公司 | 2024-12-17 | — | — | CN | claimed |
| CN-118848334-A | Double-layer solder bump structure for low-temperature brazing and electroplating preparation method | 云南锡业集团（控股）有限责任公司研发中心 | 2024-10-29 | — | — | CN | claimed |
| CN-113795566-B | Quantum dot structure, manufacturing method thereof and quantum dot light-emitting device | 京东方科技集团股份有限公司 | 2024-04-09 | — | — | CN | claimed |
| US-20230416604-A1 | QUANTUM DOT STRUCTURE, MANUFACTURING METHOD THEREOF, AND QUANTUM DOT LIGHT-EMITTING DEVICE | BOE TECHNOLOGY GROUP CO., LTD. (CN) | 2023-12-28 | — | — | US | claimed |
| US-11795393-B2 | Quantum dot structure, manufacturing method thereof, and quantum dot light-emitting device | BOE TECHNOLOGY GROUP CO., LTD. (CN) | 2023-10-24 | — | — | US | claimed |
| CN-116682895-A | Method for improving diffusion coating during electroplating of solar cell | 通威太阳能（成都）有限公司 | 2023-09-01 | — | — | CN | claimed |
| US-10407791-B2 | Selective solder plating | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2019-09-10 | — | — | US | claimed |
| EP-2820108-B1 | LUMINESCENT, CADMIUM-FREE CORE/MULTI-SHELL QUANTUM DOTS ON THE BASIS OF INDIUM PHOSPHIDE | FRAUNHOFER GES FORSCHUNG (DE) | 2019-08-28 | — | — | EP | claimed |
| CN-108559979-A | A kind of chemical nickel-plating liquid and preparation method thereof | 永星化工(上海)有限公司 | 2018-09-21 | — | — | CN | claimed |
| CN-108165959-A | Chemical bronze plating liquid | 永星化工(上海)有限公司 | 2018-06-15 | — | — | CN | claimed |
| US-20180135197-A1 | Selective Solder Plating | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2018-05-17 | — | — | US | claimed |
| US-20170167042-A1 | SELECTIVE SOLDER PLATING | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2017-06-15 | — | — | US | claimed |
| EP-1544164-B1 | Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy | TELEDYNE DALSA SEMICONDUCTOR INC (CA) | 2015-04-01 | — | — | EP | claimed |
| US-7291513-B2 | Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy | DALSA SEMICONDUCTOR INC. (CA) | 2007-11-06 | — | — | US | claimed |
| US-20050142685-A1 | Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy | DALSA SEMICONDUCTOR INC. (CA) | 2005-06-30 | — | — | US | claimed |
| EP-1544164-A2 | Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy | Dalsa Semiconductor Inc. (CA) | 2005-06-22 | — | — | EP | claimed |