SCHEMBL14502945

SCHEMBL14502945

C=C(C)C(=O)OCCOC(=O)c1ccc(Oc2ccc(C(=O)OCC)c(C(=O)O)c2)cc1C(=O)O

nearest known ligand 0.44

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
▸ TDP1 Q9NUW8 3/20 0.44
▸ POLB P06746 2/20 0.44
▸ APEX1 P27695 1/20 0.44
▸ HTT P42858 1/20 0.44
▸ THRB P10828 1/20 0.42
▸ TSHR P16473 5/20 0.41
▸ CA1 P00915 3/20 0.39
▸ CA2 P00918 3/20 0.39
▸ CA12 O43570 2/20 0.39
▸ CA7 P43166 2/20 0.39
▸ CA9 Q16790 2/20 0.39
▸ CA14 Q9ULX7 2/20 0.39
▸ ALDH1A1 P00352 3/20 0.38
▸ L3MBTL1 Q9Y468 1/20 0.38
▸ PTGS2 P35354 3/20 0.37
▸ KDM4E B2RXH2 1/20 0.37
▸ HPGD P15428 1/20 0.37
▸ SMN1; SMN2 Q16637 1/20 0.37
▸ HSD17B10 Q99714 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19795529 0.95 TDP1 (0.48) TDP1POLBAPEX1HTTTHRB
SCHEMBL20061898 0.93 TDP1 (0.46) TDP1POLBAPEX1HTTTHRB
SCHEMBL20061899 0.90 POLB (0.48) TDP1POLBAPEX1HTTTHRB
SCHEMBL23520516 0.86 TDP1 (0.41) TDP1POLBAPEX1HTTTHRB
SCHEMBL24245300 0.84 POLB (0.45) TDP1POLBAPEX1HTTTHRB
SCHEMBL9906831 0.83 POLB (0.46) TDP1POLBAPEX1HTTTHRB
SCHEMBL17272662 0.82 TDP1 (0.48) TDP1POLBAPEX1HTTTHRB
SCHEMBL13132121 0.82 TDP1 (0.44) TDP1POLBAPEX1HTTTHRB
SCHEMBL14262508 0.81 TDP1 (0.49) TDP1POLBAPEX1HTTTHRB
SCHEMBL544688 0.81 TDP1 (0.56) TDP1POLBAPEX1HTTTHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7214455-B2 Photosensitive resin composition and process for producing heat-resistant resin film TORAY INDUSTRIES, INC. (JP) 2007-05-08 — — US disclosed
US-7214455-B2 Photosensitive resin composition and process for producing heat-resistant resin film TORAY INDUSTRIES, INC. (JP) 2007-05-08 — — US disclosed
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