SCHEMBL24245300

SCHEMBL24245300

C=C(C)C(=O)CCCOC(=O)c1ccc(Oc2ccc(C(=O)O)c(C(=O)OCCOC(=O)C(=C)C)c2)cc1C(=O)O

nearest known ligand 0.45

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ POLB P06746 4/20 0.45
▸ TDP1 Q9NUW8 4/20 0.45
▸ APEX1 P27695 2/20 0.45
▸ HTT P42858 1/20 0.45
▸ TSHR P16473 6/20 0.36
▸ L3MBTL1 Q9Y468 3/20 0.36
▸ ALDH1A1 P00352 3/20 0.36
▸ CYP3A4 P08684 2/20 0.34
▸ MAPK1 P28482 2/20 0.34
▸ HPSE Q9Y251 1/20 0.34
▸ CTDSP1 Q9GZU7 1/20 0.33
▸ TP53 P04637 1/20 0.33
▸ MEN1 O00255 1/20 0.32
▸ KMT2A Q03164 1/20 0.32
▸ LMNA P02545 1/20 0.32
▸ THRB P10828 1/20 0.32
▸ PYGL P06737 1/20 0.32
▸ PYGM P11217 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20061898 0.91 TDP1 (0.46) POLBTDP1APEX1HTTTSHR
SCHEMBL20061899 0.89 POLB (0.48) POLBTDP1APEX1HTTTSHR
SCHEMBL19795529 0.89 TDP1 (0.48) POLBTDP1APEX1HTTTSHR
SCHEMBL14502945 0.84 TDP1 (0.44) POLBTDP1APEX1HTTTSHR
SCHEMBL22292253 0.82 TDP1 (0.41) POLBTDP1APEX1HTTTSHR
SCHEMBL23520516 0.81 TDP1 (0.41) POLBTDP1APEX1HTTTSHR
SCHEMBL20110987 0.79 TDP1 (0.42) POLBTDP1APEX1HTTTSHR
SCHEMBL17272662 0.79 TDP1 (0.48) POLBTDP1APEX1HTTTSHR
SCHEMBL11575811 0.79 TSHR (0.58) POLBTDP1TSHRL3MBTL1ALDH1A1
SCHEMBL1556947 0.77 THRB (0.47) POLBTDP1APEX1HTTTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3951498-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2022-02-09 — — EP disclosed
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