SCHEMBL14719145

SCHEMBL14719145

CC(=CCC(O)COC1CCCCC1)C(=O)O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.39
KDM4E B2RXH2 5/20 0.39
MAPT P10636 1/20 0.36
HTT P42858 4/20 0.35
LMNA P02545 2/20 0.35
NPSR1 Q6W5P4 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
CRHBP P24387 1/20 0.35
CRHR2 Q13324 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
PRMT5 O14744 2/20 0.34
WDR77 Q9BQA1 2/20 0.34
RGS12 O14924 1/20 0.34
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
APOBEC3A P31941 2/20 0.33
APOBEC3G Q9HC16 2/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
CTDSP1 Q9GZU7 1/20 0.32
CD81 P60033 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23830103 1.00 ALDH1A1 (0.39) ALDH1A1KDM4EMAPTHTTLMNA
SCHEMBL465988 0.78 EPHX1 (0.36) HTTLMNACD81EPHX1
SCHEMBL720062 0.75 CD81 (0.37) KDM4EHTTCD81EPHX1
SCHEMBL226416 0.75 CD81 (0.34) CD81EPHX1
SCHEMBL21404629 0.74 NAAA (0.33) SMN1; SMN2EPHX1
SCHEMBL5050873 0.74 MAPT (0.33) ALDH1A1KDM4EMAPTCD81
SCHEMBL2763358 0.74 MAPT (0.33) ALDH1A1KDM4EMAPTCD81
SCHEMBL22845686 0.73 KDM4E (0.43) ALDH1A1KDM4EMAPTHTTLMNA
SCHEMBL13907638 0.73 KDM4E (0.49) ALDH1A1KDM4EMAPTHTTLMNA
SCHEMBL9339953 0.73 CD81 (0.36) CD81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115850596-A Transparent photosensitive polyimide resin and preparation method and application thereof 中国科学院化学研究所 2023-03-28 CN claimed
US-20250341778-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-11-06 US disclosed
US-12386259-B2 Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-08-12 US disclosed
US-20240045329-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND TORAY INDUSTRIES, INC. (JP) 2024-02-08 US disclosed
CN-115850596-A Transparent photosensitive polyimide resin and preparation method and application thereof 中国科学院化学研究所 2023-03-28 CN disclosed
CN-115236938-B Negative photosensitive polyamic acid ester resin composition and use thereof 明士(北京)新材料开发有限公司 2023-01-10 CN disclosed
US-20210294213-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-09-23 US disclosed
US-20130049264-A1 PROCESS FOR PRODUCING FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR MAKING FLEXOGRAPHIC PRINTING PLATE FUJIFILM CORPORATION (JP) 2013-02-28 US disclosed