⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL456737 | 0.74 | ALDH1A1 (0.33) | — | |
| SCHEMBL10710919 | 0.70 | — | — | |
| SCHEMBL1080809 | 0.69 | — | — | |
| SCHEMBL3809971 | 0.69 | ALDH1A1 (0.42) | — | |
| SCHEMBL9280230 | 0.69 | ALDH1A1 (0.35) | — | |
| SCHEMBL11815688 | 0.69 | — | — | |
| SCHEMBL8756956 | 0.67 | ALDH1A1 (0.34) | — | |
| SCHEMBL2117543 | 0.67 | — | — | |
| SCHEMBL81829 | 0.65 | KDM4E (0.32) | — | |
| SCHEMBL1349091 | 0.65 | XDH (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5100762-A | Radiation-sensitive polymer and radiation-sensitive composition containing the same | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1992-03-31 | — | — | US | claimed |
| US-8268540-B2 | Method of manufacturing light receiving device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2012-09-18 | — | — | US | disclosed |
| EP-2477215-A2 | Resin composition, embedding material, insulating layer and semiconductor device | Sumitomo Bakelite Company Limited (JP) | 2012-07-18 | — | — | EP | disclosed |
| US-7999354-B2 | Resin composition, filling material, insulating layer and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-08-16 | — | — | US | disclosed |
| US-7915467-B2 | layer contains a cyclic olefin resin having an epoxy group and a photoacid generator; low stress properties and adhesion; prevent breakage of the semiconductor wafer in a process for grinding the backside to make them thinner | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-03-29 | — | — | US | disclosed |
| US-7808083-B2 | Semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2010-10-05 | — | — | US | disclosed |
| US-20100193122-A1 | PROCESS FOR MANUFACTURING ELECTRONIC DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-08-05 | — | — | US | disclosed |
| US-20100181684-A1 | RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2010-07-22 | — | — | US | disclosed |
| US-20100120937-A1 | SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-05-13 | — | — | US | disclosed |
| EP-2166036-A1 | RESIN COMPOSITION, EMBEDDING MATERIAL, INSULATING LAYER, AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company Limited (JP) | 2010-03-24 | — | — | EP | disclosed |
| EP-1804291-A1 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-07-04 | — | — | EP | disclosed |
| EP-1801872-A1 | SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-06-27 | — | — | EP | disclosed |
| US-20060228562-A1 | Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2006-10-12 | — | — | US | disclosed |
| US-5731126-A | BLEND OF POLYSILOXANE AND PHOTOACID GENERATOR | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1998-03-24 | — | — | US | disclosed |
| US-5565304-A | ALKALI SOLUBLE BINDER RESIN FROM HYDROXYSTYRENEAND METHYLOLATED PHENOLIC COMPOUND | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-10-15 | — | — | US | disclosed |
| US-5550004-A | RESIN BINDER HAVING HYDROXYSTYRENE AND MONOMETHYLOLATED PHENOLIC COMPOUNDS | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-08-27 | — | — | US | disclosed |
| EP-0727711-A2 | Photoresist compositions containing supercritical fluid fractionated polymeric binder resins | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-08-21 | — | — | EP | disclosed |
| EP-0697632-A2 | Chemically amplified radiation-sensitive composition | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-02-21 | — | — | EP | disclosed |
| US-5346803-A | Chemical amplification type; large scale integrated microcircuits | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1994-09-13 | — | — | US | disclosed |
| US-5100762-A | Radiation-sensitive polymer and radiation-sensitive composition containing the same | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1992-03-31 | — | — | US | disclosed |