SCHEMBL14844490

SCHEMBL14844490

NCCC(N)OC(=O)CCC(=O)OC(N)CCN

nearest known ligand 0.34

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GABRR1 P24046 2/20 0.34
GSR P00390 2/20 0.32
CYP1A2 P05177 2/20 0.31
KDM4E B2RXH2 1/20 0.31
LMNA P02545 1/20 0.31
TSHR P16473 1/20 0.31
GABRP O00591 2/20 0.30
GABRD O14764 2/20 0.30
GABRA1 P14867 2/20 0.30
GABRB1 P18505 2/20 0.30
GABRG2 P18507 2/20 0.30
GABRB3 P28472 2/20 0.30
GABRA5 P31644 2/20 0.30
GABRA3 P34903 2/20 0.30
GABRA2 P47869 2/20 0.30
GABRB2 P47870 2/20 0.30
GABRA4 P48169 2/20 0.30
GABRE P78334 2/20 0.30
GABRA6 Q16445 2/20 0.30
GABRG1 Q8N1C3 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9453442 0.91 CYP1A2 (0.38) GABRR1GSRCYP1A2LMNATSHR
SCHEMBL11135840 0.86 GABRR1 (0.34) GABRR1GSR
SCHEMBL5376257 0.85 GSR (0.47) GABRR1GSRCYP1A2LMNATSHR
SCHEMBL8577082 0.83 GSR (0.45) GABRR1GSRCYP1A2LMNATSHR
SCHEMBL2450014 0.83 GSR (0.45) GABRR1GSRCYP1A2LMNATSHR
SCHEMBL28247886 0.82 FAAH (0.40) LMNATSHR
SCHEMBL28882100 0.82 GABRR1 (0.32) GABRR1GSR
SCHEMBL3626317 0.81 LMNA (0.58) CYP1A2LMNATSHR
SCHEMBL29002313 0.81 LMNA (0.58) CYP1A2LMNATSHR
SCHEMBL28677192 0.81 GABRP (0.34) GSRCYP1A2TSHRGABRPGABRD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9650718-B2 Electroless copper plating solution ATOTECH DEUTSCHLAND GMBH (DE) 2017-05-16 US disclosed
US-20160053379-A1 ELECTROLESS COPPER PLATING SOLUTION ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2016-02-25 US disclosed
EP-2784181-B1 Electroless copper plating solution ATOTECH DEUTSCHLAND GMBH (DE) 2015-12-09 EP disclosed
CN-104968835-A Electroless copper plating solution ATOTECH DEUTSCHLAND GMBH 2015-10-07 CN disclosed
WO-2014154689-A1 ELECTROLESS COPPER PLATING SOLUTION ATOTECH DEUTSCHLAND GMBH (DE) 2014-10-02 WO disclosed
EP-2784181-A1 Electroless copper plating solution ATOTECH Deutschland GmbH (DE) 2014-10-01 EP disclosed
US-20140242264-A1 FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION ATOTECH DEUTSCHLAND GMBH (DE) 2014-08-28 US disclosed
EP-2764135-A2 FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION Atotech Deutschland GmbH (DE) 2014-08-13 EP disclosed
WO-2013050332-A2 FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION ATOTECH DEUTSCHLAND GMBH (DE) 2013-04-11 WO disclosed