SCHEMBL1506862

SCHEMBL1506862

CCC(CC)C(=O)[O-].CCC(CC)C(=O)[O-].CCC(CC)C(=O)[O-].[Sm+3]

nearest known ligand 0.58

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
CA2 P00918 4/20 0.58
TSHR P16473 3/20 0.57
CYP3A4 P08684 2/20 0.57
NFKB1 P19838 2/20 0.57
NPSR1 Q6W5P4 2/20 0.57
USP2 O75604 1/20 0.42
MAPK1 P28482 1/20 0.39
CA1 P00915 3/20 0.37
SLC1A3 P43003 1/20 0.37
SLC1A2 P43004 1/20 0.37
SLC1A1 P43005 1/20 0.37
FFAR3 O14843 1/20 0.36
HDAC3 O15379 1/20 0.36
HDAC1 Q13547 1/20 0.36
HDAC2 Q92769 1/20 0.36
HDAC8 Q9BY41 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Zinc Ion SCHEMBL2355344 0.94 CA2 (0.58) CA2TSHRCYP3A4NFKB1NPSR1
SCHEMBL3343198 0.94 CA2 (0.58) CA2TSHRCYP3A4NFKB1NPSR1
SCHEMBL9396196 0.94 CA2 (0.58) CA2TSHRCYP3A4NFKB1NPSR1
SCHEMBL17178412 0.94 CA2 (0.58) CA2TSHRCYP3A4NFKB1NPSR1
SCHEMBL98742 0.94 CA2 (0.58) CA2TSHRCYP3A4NFKB1NPSR1
Potassium Ion SCHEMBL267337 0.94
SCHEMBL5079455 0.94 CA2 (0.58) CA2TSHRCYP3A4NFKB1NPSR1
SCHEMBL8574352 0.94 CA2 (0.58) CA2TSHRCYP3A4NFKB1NPSR1
SCHEMBL10670321 0.94 CA2 (0.58) CA2TSHRCYP3A4NFKB1NPSR1
SCHEMBL1030692 0.94 CA2 (0.58) CA2TSHRCYP3A4NFKB1NPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2298714-B1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FERROELECTRIC THIN FILM FORMATION, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD MITSUBISHI MATERIALS CORP (JP) 2017-07-05 EP disclosed
US-9502636-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2016-11-22 US disclosed
US-9005358-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2015-04-14 US disclosed
US-20140349834-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORP (JP) 2014-11-27 US disclosed
US-20140349139-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORPORATION (JP) 2014-11-27 US disclosed
US-8859051-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2014-10-14 US disclosed
US-8790538-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2014-07-29 US disclosed
US-20130295414-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORP (JP) 2013-11-07 US disclosed
US-20110177235-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORPORATION (JP) 2011-07-21 US disclosed
EP-2343268-A1 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof Mitsubishi Materials Corporation (JP) 2011-07-13 EP disclosed
US-20110098173-A1 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof STMicroelectronics(Tours) SAS (FR) 2011-04-28 US disclosed
EP-2298714-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FERROELECTRIC THIN FILM FORMATION, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD Mitsubishi Materials Corporation (JP) 2011-03-23 EP disclosed