Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 4/20 | 0.58 |
| ▸ | TSHR | P16473 | 3/20 | 0.57 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.57 |
| ▸ | NFKB1 | P19838 | 2/20 | 0.57 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.57 |
| ▸ | USP2 | O75604 | 1/20 | 0.42 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.39 |
| ▸ | CA1 | P00915 | 3/20 | 0.37 |
| ▸ | SLC1A3 | P43003 | 1/20 | 0.37 |
| ▸ | SLC1A2 | P43004 | 1/20 | 0.37 |
| ▸ | SLC1A1 | P43005 | 1/20 | 0.37 |
| ▸ | FFAR3 | O14843 | 1/20 | 0.36 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.36 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.36 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.36 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1030692 | 0.94 | CA2 (0.58) | CA2TSHRCYP3A4NFKB1NPSR1 | |
| SCHEMBL1506862 | 0.94 | CA2 (0.58) | CA2TSHRCYP3A4NFKB1NPSR1 | |
| SCHEMBL8747771 | 0.94 | CA2 (0.58) | CA2TSHRCYP3A4NFKB1NPSR1 | |
| SCHEMBL8574352 | 0.94 | CA2 (0.58) | CA2TSHRCYP3A4NFKB1NPSR1 | |
| SCHEMBL10670321 | 0.94 | CA2 (0.58) | CA2TSHRCYP3A4NFKB1NPSR1 | |
| SCHEMBL5079455 | 0.94 | CA2 (0.58) | CA2TSHRCYP3A4NFKB1NPSR1 | |
| Potassium Ion SCHEMBL267337 | 0.94 | — | — | |
| SCHEMBL17178412 | 0.94 | CA2 (0.58) | CA2TSHRCYP3A4NFKB1NPSR1 | |
| SCHEMBL3343198 | 0.94 | CA2 (0.58) | CA2TSHRCYP3A4NFKB1NPSR1 | |
| Zinc Ion SCHEMBL2355344 | 0.94 | CA2 (0.58) | CA2TSHRCYP3A4NFKB1NPSR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2431986-B1 | Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORP (JP) | 2017-06-21 | — | — | EP | claimed |
| US-9595393-B2 | Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORPORATION (JP) | 2017-03-14 | — | — | US | claimed |
| US-9018118-B2 | Dielectric thin film-forming composition, method of forming dielectric thin film and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORPORATION (JP) | 2015-04-28 | — | — | US | claimed |
| EP-2608219-B1 | Dielectric thin film-forming composition, method of forming dielectric thin film and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORP (JP) | 2015-03-04 | — | — | EP | claimed |
| EP-2608219-A1 | Dielectric thin film-forming composition, method of forming dielectric thin film and dielectric thin film formed by the method | Mitsubishi Materials Corporation (JP) | 2013-06-26 | — | — | EP | claimed |
| US-20130155571-A1 | DIELECTRIC THIN FILM-FORMING COMPOSITION, METHOD OF FORMING DIELECTRIC THIN FILM AND DIELECTRIC THIN FILM FORMED BY THE METHOD | STMicroelectronics(Tours) SAS (FR) | 2013-06-20 | — | — | US | claimed |
| EP-2431986-A1 | Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method | Mitsubishi Materials Corporation (JP) | 2012-03-21 | — | — | EP | claimed |
| US-20120055372-A1 | DIELECTRIC-THIN-FILM FORMING COMPOSITION, METHOD OF FORMING DIELECTRIC THIN FILM, AND DIELECTRIC THIN FILM FORMED BY THE METHOD | MITSUBISHI MATERIALS CORPORATION (JP) | 2012-03-08 | — | — | US | claimed |
| CN-107073516-B | Method for producing structure having concave pattern, resin composition, method for forming conductive film, electronic circuit, and electronic device | JSR株式会社 | 2020-09-15 | — | — | CN | disclosed |
| CN-105143977-B | Method for producing substrate having concave pattern, composition, method for forming conductive film, electronic circuit, and electronic device | JSR株式会社 | 2020-01-07 | — | — | CN | disclosed |
| EP-3409729-B1 | ELECTROCONDUCTIVE COMPOSITION, PRODUCTION PROCESS THEREFOR, AND ELECTROCONDUCTIVE MATERIAL | TOYO INK SC HOLDINGS CO LTD (JP) | 2019-12-18 | — | — | EP | disclosed |
| US-10392699-B2 | Method for manufacturing structure having recessed pattern, resin composition, method for forming electroconductive film, electronic circuit, and electronic device | JSR CORPORATION (JP) | 2019-08-27 | — | — | US | disclosed |
| US-20190035513-A1 | ELECTROCONDUCTIVE COMPOSITION, METHOD FOR PRODUCING THE SAME, AND ELECTROCONDUCTIVE MATERIAL | TOYO INK SC HOLDINGS CO., LTD. (JP) | 2019-01-31 | — | — | US | disclosed |
| EP-3409729-A1 | ELECTROCONDUCTIVE COMPOSITION, PRODUCTION PROCESS THEREFOR, AND ELECTROCONDUCTIVE MATERIAL | Toyo Ink SC Holdings Co., Ltd. (JP) | 2018-12-05 | — | — | EP | disclosed |
| EP-2608219-B1 | Dielectric thin film-forming composition, method of forming dielectric thin film and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORP (JP) | 2015-03-04 | — | — | EP | disclosed |
| EP-2608219-A1 | Dielectric thin film-forming composition, method of forming dielectric thin film and dielectric thin film formed by the method | Mitsubishi Materials Corporation (JP) | 2013-06-26 | — | — | EP | disclosed |
| US-20130155571-A1 | DIELECTRIC THIN FILM-FORMING COMPOSITION, METHOD OF FORMING DIELECTRIC THIN FILM AND DIELECTRIC THIN FILM FORMED BY THE METHOD | STMicroelectronics(Tours) SAS (FR) | 2013-06-20 | — | — | US | disclosed |
| EP-2431986-A1 | Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method | Mitsubishi Materials Corporation (JP) | 2012-03-21 | — | — | EP | disclosed |
| US-20120055372-A1 | DIELECTRIC-THIN-FILM FORMING COMPOSITION, METHOD OF FORMING DIELECTRIC THIN FILM, AND DIELECTRIC THIN FILM FORMED BY THE METHOD | MITSUBISHI MATERIALS CORPORATION (JP) | 2012-03-08 | — | — | US | disclosed |
| EP-2426684-A1 | Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method | MITSUBISHI MATERIALS CORPORATION (JP) | 2012-03-07 | — | — | EP | disclosed |