SCHEMBL1521399

SCHEMBL1521399

CN(C)C(=O)C(C)(C)N=NC(C)(C)C(=O)N(C)C

nearest known ligand 0.36

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.36
TSHR P16473 2/20 0.36
MAPT P10636 2/20 0.36
NFKB1 P19838 1/20 0.36
THPO P40225 1/20 0.36
HSD17B10 Q99714 1/20 0.36
APEX1 P27695 1/20 0.36
PMP22 Q01453 1/20 0.36
CYP3A4 P08684 1/20 0.32
CYP2D6 P10635 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19773658 0.78 TSHR (0.33) ALDH1A1TSHRMAPTNFKB1THPO
SCHEMBL19773660 0.74 TSHR (0.31) ALDH1A1TSHRMAPTNFKB1THPO
SCHEMBL1106444 0.74
SCHEMBL16944043 0.71 ALDH1A1 (0.39) ALDH1A1TSHRMAPTNFKB1THPO
SCHEMBL2136594 0.71 MAPT (0.40) MAPT
SCHEMBL635332 0.69
SCHEMBL4071999 0.69
SCHEMBL2745822 0.67
SCHEMBL15793305 0.67
SCHEMBL10903390 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160178813-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2016-06-23 US claimed
US-10591816-B2 Photosensitive resin composition, color filter, and liquid crystal display element thereof CHI MEI CORPORATION (TW) 2020-03-17 US disclosed
US-20170235224-A1 PHOTOSENSITIVE RESIN COMPOSITION, COLOR FILTER, AND LIQUID CRYSTAL DISPLAY ELEMENT THEREOF CHI MEI CORPORATION (TW) 2017-08-17 US disclosed
US-20160178813-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2016-06-23 US disclosed
US-8980506-B2 Photosensitive resin composition and application thereof CHI MEI CORPORATION (TW) 2015-03-17 US disclosed
US-20140051017-A1 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2014-02-20 US disclosed
US-20130310497-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-11-21 US disclosed
US-20110049444-A1 COLORED RESIN COMPOSITIONS FOR COLOR FILTER, COLOR FILTER, ORGANIC EL DISPLAY, AND LIQUID-CRYSTAL DISPLAY DEVICE MITSUBISHI CHEMICAL CORPORATION (JP) 2011-03-03 US disclosed