Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SSTR4 | P31391 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10818151 | 0.86 | SSTR4 (0.34) | SSTR4 | |
| SCHEMBL7357398 | 0.78 | SSTR4 (0.36) | SSTR4 | |
| SCHEMBL1277383 | 0.77 | — | — | |
| SCHEMBL28781524 | 0.77 | SLC6A2 (0.35) | SSTR4 | |
| SCHEMBL2445619 | 0.77 | SSTR4 (0.35) | SSTR4 | |
| SCHEMBL9207735 | 0.77 | SSTR4 (0.38) | SSTR4 | |
| Hydrochloric Acid SCHEMBL23277053 | 0.75 | SSTR4 (0.37) | SSTR4 | |
| Hydrochloric Acid SCHEMBL20599528 | 0.75 | SSTR4 (0.37) | SSTR4 | |
| SCHEMBL7159371 | 0.75 | ALDH1A1 (0.38) | SSTR4 | |
| SCHEMBL7276009 | 0.74 | SSTR4 (0.39) | SSTR4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 120 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4558533-A1 | OLIGOMERS COMPRISING POLYMERIZED HIGH-TG MONOMERS | ARKEMA FRANCE (FR) | 2025-05-28 | — | — | EP | claimed |
| CN-119894947-A | Oligomers comprising polymerized high Tg monomers | 阿科玛法国公司 | 2025-04-25 | — | — | CN | claimed |
| CN-118440241-A | Method for preparing hollow gel tube based on redox system and application thereof | 北京化工大学 | 2024-08-06 | — | — | CN | claimed |
| WO-2024018041-A1 | OLIGOMERS COMPRISING POLYMERIZED HIGH-TG MONOMERS | ARKEMA FRANCE (FR) | 2024-01-25 | — | — | WO | claimed |
| EP-4310115-A1 | OLIGOMERS COMPRISING POLYMERIZED HIGH-TG MONOMERS | ARKEMA FRANCE (FR) | 2024-01-24 | — | — | EP | claimed |
| CN-114634592-A | Preparation method and application of acrylic acid high-initial-viscosity high-strength back adhesive emulsion | 上海保立佳新材料有限公司 | 2022-06-17 | — | — | CN | claimed |
| CN-104650273-B | (meth) acrylic acid-acrylic copolymer and process for producing the same | 罗门哈斯公司 | 2020-10-09 | — | — | CN | claimed |
| CN-108314979-A | Optically transparent adhesive, application method and by its product obtained | 3M创新有限公司 | 2018-07-24 | — | — | CN | claimed |
| CN-104321397-B | Adhesive article | 3M创新有限公司 | 2017-04-05 | — | — | CN | claimed |
| US-9260632-B2 | Primerless multilayer adhesive film for bonding glass substrates | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2016-02-16 | — | — | US | claimed |
| US-20140255679-A1 | PRIMERLESS MULTILAYER ADHESIVE FILM FOR BONDING GLASS SUBSTRATES | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2014-09-11 | — | — | US | claimed |
| CN-103930498-A | Primerless multilayer adhesive film for bonding glass substrates | 3M INNOVATIVE PROPERTIES CO | 2014-07-16 | — | — | CN | claimed |
| CN-103631091-A | Preparation method of photosensitive curing resin composition | LIYANG DONGDA TECHNOLOGY TRANSFER CENTRAL CO LTD | 2014-03-12 | — | — | CN | claimed |
| CN-103616800-A | A light curing resin composition | LIYANG DONGDA TECHNOLOGY TRANSFER CENTRAL CO LTD | 2014-03-05 | — | — | CN | claimed |
| CN-101935494-B | Ultraviolet-cured resin composition and preparation method thereof | LIANG PENGFEI | 2013-11-13 | — | — | CN | claimed |
| CN-101935494-A | Ultraviolet-cured resin composition and preparation method thereof | PENGFEI LIANG | 2011-01-05 | — | — | CN | claimed |
| CN-101281370-A | Photosensitive resin composition with low surface adhesion and application thereof | MURAKAMI KUNSHAN PREC STENCIL (CN) | 2008-10-08 | — | — | CN | claimed |
| CN-101281366-A | Light-sensitive polymer composition not easy to change color and application thereof | MURAKAMI KUNSHAN PREC STENCIL (CN) | 2008-10-08 | — | — | CN | claimed |
| US-7351645-B2 | Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip | LINTEC CORPORATION (JP) | 2008-04-01 | — | — | US | claimed |
| JP-63297369-A | — | — | None | — | — | JP | disclosed |
| US-20260103625-A1 | ADHESIVE COMPOUND, ADHESIVE TAPE, BONDED COMPOSITE, AND METHOD FOR ELECTRICALLY DEBONDING THE BONDED COMPOSITE | TESA SE (DE) | 2026-04-16 | — | — | US | disclosed |
| EP-4558530-A1 | ACRYLIC COPOLYMERS IMPARTING LOW YELLOWING AFTER PHOTOCURING | ARKEMA FRANCE (FR) | 2025-05-28 | — | — | EP | disclosed |
| EP-4558533-A1 | OLIGOMERS COMPRISING POLYMERIZED HIGH-TG MONOMERS | ARKEMA FRANCE (FR) | 2025-05-28 | — | — | EP | disclosed |
| CN-119894947-A | Oligomers comprising polymerized high Tg monomers | 阿科玛法国公司 | 2025-04-25 | — | — | CN | disclosed |
| CN-115298019-B | Three-dimensional object manufacturing apparatus and three-dimensional object manufacturing method | 株式会社理光 | 2025-03-21 | — | — | CN | disclosed |
| CN-118930764-A | Photo-moisture curable urethane compound, photo-moisture curable urethane prepolymer, and photo-moisture curable resin composition | 积水化学工业株式会社 | 2024-11-12 | — | — | CN | disclosed |
| CN-118930765-A | Photo-moisture curable urethane compound, photo-moisture curable urethane prepolymer, and photo-moisture curable resin composition | 积水化学工业株式会社 | 2024-11-12 | — | — | CN | disclosed |
| CN-111837219-B | Method for producing processed product and adhesive laminate | 琳得科株式会社 | 2024-11-01 | — | — | CN | disclosed |
| CN-118742617-A | Window film | 琳得科株式会社 | 2024-10-01 | — | — | CN | disclosed |
| CN-113242869-B | Photo-moisture curable urethane compound, photo-moisture curable urethane prepolymer, and photo-moisture curable resin composition | 积水化学工业株式会社 | 2024-09-10 | — | — | CN | disclosed |
| CN-115943077-B | Crosslinkable composition comprising mono (meth) acrylate having 1, 3-dioxolane ring | 阿科玛法国公司 | 2024-07-16 | — | — | CN | disclosed |
| CN-111295738-B | Method for manufacturing semiconductor device | 琳得科株式会社 | 2024-05-24 | — | — | CN | disclosed |
| CN-117980363-A | Aqueous dispersion and film forming method | 富士胶片株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-117957288-A | Inkjet photocurable composition, method for producing image display device, and image display device | 迪睿合株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-117836834-A | Photocurable material and image display device | 迪睿合株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-110007563-B | Negative photosensitive resin composition, spacer, protective film, and liquid crystal display element | 奇美实业股份有限公司 | 2024-04-02 | — | — | CN | disclosed |
| WO-2024018041-A1 | OLIGOMERS COMPRISING POLYMERIZED HIGH-TG MONOMERS | ARKEMA FRANCE (FR) | 2024-01-25 | — | — | WO | disclosed |
| WO-2024018039-A1 | ACRYLIC COPOLYMERS IMPARTING LOW YELLOWING AFTER PHOTOCURING | ARKEMA FRANCE (FR) | 2024-01-25 | — | — | WO | disclosed |
| EP-4310117-A1 | CURABLE COMPOSITIONS | ARKEMA FRANCE (FR) | 2024-01-24 | — | — | EP | disclosed |
| EP-4310105-A1 | ACRYLIC COPOLYMERS IMPARTING LOW YELLOWING AFTER PHOTOCURING | ARKEMA FRANCE (FR) | 2024-01-24 | — | — | EP | disclosed |
| EP-4310115-A1 | OLIGOMERS COMPRISING POLYMERIZED HIGH-TG MONOMERS | ARKEMA FRANCE (FR) | 2024-01-24 | — | — | EP | disclosed |
| CN-117120482-A | Photocurable material and image display device | 迪睿合株式会社 | 2023-11-24 | — | — | CN | disclosed |
| CN-116997464-A | Glass laminate article and adhesive composition therefor | 康宁股份有限公司 | 2023-11-03 | — | — | CN | disclosed |
| CN-110462816-B | Method for manufacturing semiconductor device and adhesive sheet | 琳得科株式会社 | 2023-09-19 | — | — | CN | disclosed |
| CN-111295739-B | Method for manufacturing semiconductor device | 琳得科株式会社 | 2023-08-25 | — | — | CN | disclosed |
| CN-112203840-B | Adhesive laminate, method for using adhesive laminate, and method for manufacturing semiconductor device | 琳得科株式会社 | 2023-07-14 | — | — | CN | disclosed |
| CN-110476241-B | Method for manufacturing semiconductor device and double-sided adhesive sheet | 琳得科株式会社 | 2023-05-09 | — | — | CN | disclosed |
| CN-116075565-A | Color-changeable adhesive sheet | 日东电工株式会社 | 2023-05-05 | — | — | CN | disclosed |
| CN-115943077-A | Crosslinkable composition comprising mono (meth) acrylate having 1, 3-dioxolane ring | 阿科玛法国公司 | 2023-04-07 | — | — | CN | disclosed |
| CN-115298019-A | Three-dimensional object manufacturing apparatus and three-dimensional object manufacturing method | 株式会社理光 | 2022-11-04 | — | — | CN | disclosed |
| CN-114634592-A | Preparation method and application of acrylic acid high-initial-viscosity high-strength back adhesive emulsion | 上海保立佳新材料有限公司 | 2022-06-17 | — | — | CN | disclosed |
| CN-114585704-A | Conductive adhesive, adhesive structure using same, and electronic component | 日本化学工业株式会社 | 2022-06-03 | — | — | CN | disclosed |
| CN-111448275-B | Adhesive laminate, method for producing object with resin film, and method for producing cured sealing body with cured resin film | 琳得科株式会社 | 2022-04-22 | — | — | CN | disclosed |
| CN-108174616-B | Semiconductor processing sheet | 琳得科株式会社 | 2022-03-29 | — | — | CN | disclosed |
| CN-110461974-B | Adhesive sheet | 琳得科株式会社 | 2022-01-18 | — | — | CN | disclosed |
| CN-110494524-B | Adhesive sheet | 琳得科株式会社 | 2022-01-18 | — | — | CN | disclosed |
| CN-106462011-B | Liquid crystal display element, liquid crystal alignment film, and liquid crystal alignment treatment agent | 日产化学工业株式会社 | 2021-11-12 | — | — | CN | disclosed |
| CN-112203840-A | Adhesive laminate, method for using adhesive laminate, and method for manufacturing semiconductor device | 琳得科株式会社 | 2021-01-08 | — | — | CN | disclosed |
| CN-111837219-A | Method for producing processed product and adhesive laminate | 琳得科株式会社 | 2020-10-27 | — | — | CN | disclosed |
| CN-104650273-B | (meth) acrylic acid-acrylic copolymer and process for producing the same | 罗门哈斯公司 | 2020-10-09 | — | — | CN | disclosed |
| CN-106794684-B | Surface protection sheet substrate and surface protection sheet | 琳得科株式会社 | 2020-09-01 | — | — | CN | disclosed |
| CN-111594117-A | Crosslinking of swellable polymers with PEI | 科诺科菲利浦公司 | 2020-08-28 | — | — | CN | disclosed |
| CN-111448275-A | Adhesive laminate, method for producing object with resin film, and method for producing cured sealing body with cured resin film | 琳得科株式会社 | 2020-07-24 | — | — | CN | disclosed |
| CN-111295739-A | Method for manufacturing semiconductor device | 琳得科株式会社 | 2020-06-16 | — | — | CN | disclosed |
| CN-111295738-A | Method for manufacturing semiconductor device | 琳得科株式会社 | 2020-06-16 | — | — | CN | disclosed |
| CN-107001872-B | Adhesive sheet | 琳得科株式会社 | 2020-04-07 | — | — | CN | disclosed |
| EP-2766442-B1 | PRIMERLESS MULTILAYER ADHESIVE FILM FOR BONDING GLASS SUBSTRATES | 3M INNOVATIVE PROPERTIES CO (US) | 2019-04-10 | — | — | EP | disclosed |
| CN-104321397-B | Adhesive article | 3M创新有限公司 | 2017-04-05 | — | — | CN | disclosed |
| CN-104185665-B | Electronic unit cut-out heat-peelable pressure-sensitive adhesive sheet and electronic unit processing method | 日东电工株式会社 | 2016-09-14 | — | — | CN | disclosed |
| US-9260632-B2 | Primerless multilayer adhesive film for bonding glass substrates | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2016-02-16 | — | — | US | disclosed |
| CN-104185665-A | Heat releasable adhesive sheet for cutting electronic component, and method for machining electronic component | NITTO DENKO CORP | 2014-12-03 | — | — | CN | disclosed |
| US-20140255679-A1 | PRIMERLESS MULTILAYER ADHESIVE FILM FOR BONDING GLASS SUBSTRATES | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2014-09-11 | — | — | US | disclosed |
| EP-2766442-A1 | PRIMERLESS MULTILAYER ADHESIVE FILM FOR BONDING GLASS SUBSTRATES | 3M Innovative Properties Company (US) | 2014-08-20 | — | — | EP | disclosed |
| CN-103930498-A | Primerless multilayer adhesive film for bonding glass substrates | 3M INNOVATIVE PROPERTIES CO | 2014-07-16 | — | — | CN | disclosed |
| CN-103827241-A | Heat-peelable adhesive sheet for cutting electronic component and method for cutting electronic component | NITTO DENKO CORP | 2014-05-28 | — | — | CN | disclosed |
| CN-103631091-A | Preparation method of photosensitive curing resin composition | LIYANG DONGDA TECHNOLOGY TRANSFER CENTRAL CO LTD | 2014-03-12 | — | — | CN | disclosed |
| CN-103616800-A | A light curing resin composition | LIYANG DONGDA TECHNOLOGY TRANSFER CENTRAL CO LTD | 2014-03-05 | — | — | CN | disclosed |
| CN-101935494-B | Ultraviolet-cured resin composition and preparation method thereof | LIANG PENGFEI | 2013-11-13 | — | — | CN | disclosed |
| CN-101472686-B | Coating compositions suitable for use as a wood stain and/or toner | PPG IND OHIO INC | 2013-06-05 | — | — | CN | disclosed |
| WO-2013055581-A1 | PRIMERLESS MULTILAYER ADHESIVE FILM FOR BONDING GLASS SUBSTRATES | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2013-04-18 | — | — | WO | disclosed |
| CN-102005364-B | Method for separating and removing dicing surface protection tape from object to be cut | NITTO DENKO CORP | 2013-01-16 | — | — | CN | disclosed |
| US-8337656-B2 | Pressure-sensitive adhesive sheet, method of processing adherend with the pressure-sensitive adhesive sheet, and apparatus for stripping pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2012-12-25 | — | — | US | disclosed |
| US-8312890-B1 | Dissolvable valve in a fluid processing device | APPLIED BIOSYSTEMS, LLC (US) | 2012-11-20 | — | — | US | disclosed |
| CN-102459364-A | Swellable polymers with anionic sites | AHMAD MORADI-ARAGHI | 2012-05-16 | — | — | CN | disclosed |
| CN-102005364-A | Method for separating and removing dicing surface protection tape from object to be cut | NITTO DENKO CORP | 2011-04-06 | — | — | CN | disclosed |
| US-20110067808-A1 | PRESSURE-SENSITIVE ADHESIVE SHEET, METHOD OF PROCESSING ADHEREND WITH THE PRESSURE-SENSITIVE ADHESIVE SHEET, AND APPARATUS FOR STRIPPING PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2011-03-24 | — | — | US | disclosed |
| CN-101935494-A | Ultraviolet-cured resin composition and preparation method thereof | PENGFEI LIANG | 2011-01-05 | — | — | CN | disclosed |
| CN-101031512-B | Method for producing metal oxide sol | NISSAN CHEMICAL IND LTD | 2010-12-01 | — | — | CN | disclosed |
| CN-101506689-A | Reflection preventing film for display and display using the same | BRIDGESTONE CORP (JP) | 2009-08-12 | — | — | CN | disclosed |
| CN-101472686-A | Coating compositions suitable for use as a wood stain and/or toner | PPG IND OHIO INC (US) | 2009-07-01 | — | — | CN | disclosed |
| CN-101281370-A | Photosensitive resin composition with low surface adhesion and application thereof | MURAKAMI KUNSHAN PREC STENCIL (CN) | 2008-10-08 | — | — | CN | disclosed |
| CN-101281366-A | Light-sensitive polymer composition not easy to change color and application thereof | MURAKAMI KUNSHAN PREC STENCIL (CN) | 2008-10-08 | — | — | CN | disclosed |
| CN-100405093-C | Liquid crystal compound and retardation film using same | NIPPON KAYAKU KK (JP) | 2008-07-23 | — | — | CN | disclosed |
| CN-100379780-C | Curable resin and curable resin composition containing the same | TAIYO INK MFG CO LTD (JP) | 2008-04-09 | — | — | CN | disclosed |
| US-7351645-B2 | Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip | LINTEC CORPORATION (JP) | 2008-04-01 | — | — | US | disclosed |
| CN-101128223-A | Photocurable fixture for orthopedic surgery | ALCARE CO LTD (JP) | 2008-02-20 | — | — | CN | disclosed |
| CN-100350281-C | Radioactive-ray sensitive composition for colour optical filter, colouring-layer for mation method and use | JSR CORP (JP) | 2007-11-21 | — | — | CN | disclosed |
| CN-101065849-A | Easily adhesive polyester film and solar cell back surface protective film using same | TEIJIN DUPONT FILMS JAPAN LTD (JP) | 2007-10-31 | — | — | CN | disclosed |
| CN-101031512-A | Method for producing metal oxide sol | NISSAN CHEMICAL IND LTD (JP) | 2007-09-05 | — | — | CN | disclosed |
| CN-1955207-A | Curable resins and curable resin compositions containing the same | TAIYO INK MFG CO LTD (JP) | 2007-05-02 | — | — | CN | disclosed |
| CN-1799289-A | Flexible wiring board and flex-rigid wiring board | SHOWA DENKO KK (JP) | 2006-07-05 | — | — | CN | disclosed |
| US-20060057209-A1 | Methods, compositions and devices, including microfluidic devices, comprising coated hydrophobic surfaces | PREDICANT BIOSCIENCES, INC. (US) | 2006-03-16 | — | — | US | disclosed |
| CN-1735638-A | Curable resin and curable resin composition containing the same | TAIYO INK MFG CO LTD (JP) | 2006-02-15 | — | — | CN | disclosed |
| WO-2006015306-A2 | METHODS, COMPOSITIONS AND DEVICES, INCLUDING MICROFLUIDIC DEVICES, COMPRISING COATED HYDROPHOBIC SURFACES | PREDICANT BIOSCIENCES, INC. (US) | 2006-02-09 | — | — | WO | disclosed |
| US-20050269717-A1 | Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip | LINTEC CORPORATION (JP) | 2005-12-08 | — | — | US | disclosed |
| US-6878441-B2 | Pressure sensitive adhesive sheet | LINTEC CORPORATION (JP) | 2005-04-12 | — | — | US | disclosed |
| EP-1002845-B1 | Pressure sensitive adhesive sheet and method of use thereof | LINTEC CORP (JP) | 2005-03-02 | — | — | EP | disclosed |
| US-6793762-B1 | Method of using a pressure sensitive adhesive sheet | LINTEC CORPORATION (JP) | 2004-09-21 | — | — | US | disclosed |
| CN-1508574-A | Radioactive-ray sensitive composition for colour optical filter, colouring-layer for mation method and use | JSR株式会社 | 2004-06-30 | — | — | CN | disclosed |
| CN-1507572-A | Liquid crystal compound and retardation film using same | 日本化药株式会社 | 2004-06-23 | — | — | CN | disclosed |
| EP-0999250-B1 | Pressure sensitive adhesive sheet for use in semiconductor wafer working | LINTEC CORP (JP) | 2004-03-31 | — | — | EP | disclosed |
| EP-0962509-B1 | Pressure sensitive adhesive sheet and method of use thereof | LINTEC CORP (JP) | 2004-03-17 | — | — | EP | disclosed |
| US-20030104199-A1 | Pressure sensitive adhesive sheet | LINTEC CORPORATION | 2003-06-05 | — | — | US | disclosed |
| US-6524701-B1 | A substrate with an intermediate layer superimposed on it and a pressure sensitive adhesive layer superimposed on the intermediate layer | LINTEC CORPORATION (JP) | 2003-02-25 | — | — | US | disclosed |
| EP-1002845-A2 | Pressure sensitive adhesive sheet and method of use thereof | Lintec Corporation (JP) | 2000-05-24 | — | — | EP | disclosed |
| EP-0999250-A2 | Pressure sensitive adhesive sheet for use in semiconductor wafer working | Lintec Corporation (JP) | 2000-05-10 | — | — | EP | disclosed |
| EP-0962509-A2 | Pressure sensitive adhesive sheet and method of use thereof | Lintec Corporation (JP) | 1999-12-08 | — | — | EP | disclosed |
| EP-0792756-A2 | Liquid composition laser marking article and marking process | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 1997-09-03 | — | — | EP | disclosed |
| US-5063114-A | Weatherproof, acid and light resistant | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1991-11-05 | — | — | US | disclosed |
| JP-S63297369-A | URETHANE (METH)ACRYLATE MIXTURE, POLYMER COMPOSITION AND COATING AGENT | NIPPON KAYAKU CO LTD | 1988-12-05 | — | — | JP | disclosed |
| JP-S63297369-A | URETHANE (METH)ACRYLATE MIXTURE, POLYMER COMPOSITION AND COATING AGENT | NIPPON KAYAKU CO LTD | 1988-12-05 | — | — | JP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260103625-A1 | ADHESIVE COMPOUND, ADHESIVE TAPE, BONDED COMPOSITE, AND METHOD FOR ELECTRICALLY DEBONDING THE BONDED COMPOSITE | AFF2, AFF1, AFF4 | SSTR4 2760/4885 |
| US-20060057209-A1 | Methods, compositions and devices, including microfluidic devices, comprising coated hydrophobic surfaces | CD44, EPCAM, VCAM1 | SSTR4 4389/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.