SCHEMBL15345276

SCHEMBL15345276

CC(C)CC(=O)CCC(C)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.46
CYP2C19 P33261 1/20 0.45
TDP1 Q9NUW8 1/20 0.42
CA2 P00918 1/20 0.39
CA1 P00915 2/20 0.37
CYP3A4 P08684 1/20 0.36
ACHE P22303 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.34
KISS1R Q969F8 2/20 0.33
TSHR P16473 1/20 0.32
CYP1A2 P05177 1/20 0.31
GABRP O00591 1/20 0.31
GABRD O14764 1/20 0.31
GABRA1 P14867 1/20 0.31
GABRB1 P18505 1/20 0.31
GABRG2 P18507 1/20 0.31
GABRB3 P28472 1/20 0.31
GABRA5 P31644 1/20 0.31
GABRA3 P34903 1/20 0.31
GABRA2 P47869 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4877127 0.86 CYP2C19 (0.42) ALDH1A1CYP2C19TDP1CA2CA1
SCHEMBL110158 0.84 CA1 (0.52) ALDH1A1CYP2C19TDP1CA2CA1
SCHEMBL18161881 0.80 CA1 (0.48) ALDH1A1CYP2C19TDP1CA2CA1
SCHEMBL17971175 0.79 CYP2C19 (0.41) ALDH1A1CYP2C19TDP1CA2CA1
SCHEMBL30643272 0.78 ALDH1A1 (0.40) ALDH1A1CYP2C19TDP1CA2CA1
SCHEMBL13817695 0.78 ALDH1A1 (0.40) ALDH1A1CYP2C19TDP1CA2CA1
SCHEMBL9246597 0.77
SCHEMBL3407325 0.76 CA2 (0.39) ALDH1A1CYP2C19TDP1CA2CA1
SCHEMBL13879345 0.76 ALDH1A1 (0.48) ALDH1A1CYP2C19TDP1CA2CA1
SCHEMBL5713315 0.76 CYP2C19 (0.56) ALDH1A1CYP2C19TDP1CA2ACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114660896-B Composition for forming silicon-containing resist underlayer film, pattern forming method, and silicon compound 信越化学工业株式会社 2024-06-11 CN disclosed
US-12001138-B2 Composition for forming silicon-containing resist underlayer film and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-04 US disclosed
US-11934100-B2 Composition for forming silicon-containing resist underlayer film and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-03-19 US disclosed
EP-3680275-B1 THERMOSETTING SILICON-CONTAINING COMPOUND, COMPOSITION FOR FORMING A SILICON-CONTAINING FILM, AND PATTERNING PROCESS SHINETSU CHEMICAL CO (JP) 2024-03-06 EP disclosed
EP-3796086-B1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS SHINETSU CHEMICAL CO (JP) 2024-02-28 EP disclosed
US-11914295-B2 Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-02-27 US disclosed
US-20230333472-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-19 US disclosed
US-20230305405-A1 COMPOSITION FOR FORMING SILICON-CONTAINING METAL HARD MASK AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-28 US disclosed
EP-4250008-A1 COMPOSITION FOR FORMING SILICON-CONTAINING METAL HARD MASK AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-27 EP disclosed
CN-116804825-A Composition for forming silicon-containing metal hard mask and pattern forming method 信越化学工业株式会社 2023-09-26 CN disclosed
CN-111423587-A Thermosetting silicon-containing compound, composition for forming silicon-containing film, and method for forming pattern 信越化学工业株式会社 2020-07-17 CN disclosed
EP-3680275-A1 THERMOSETTING SILICON-CONTAINING COMPOUND, COMPOSITION FOR FORMING A SILICON-CONTAINING FILM, AND PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2020-07-15 EP disclosed
US-20200216670-A1 THERMOSETTING SILICON-CONTAINING COMPOUND, COMPOSITION FOR FORMING A SILICON-CONTAINING FILM, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-07-09 US disclosed
CN-111208710-A Iodine-containing thermosetting silicon-containing material, resist underlayer film-forming composition for extreme ultraviolet lithography containing the same, and pattern formation method 信越化学工业株式会社 2020-05-29 CN disclosed
EP-3657254-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2020-05-27 EP disclosed
US-20200159120-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-05-21 US disclosed
EP-2657767-B1 Patterning process SHINETSU CHEMICAL CO (JP) 2018-10-10 EP disclosed
US-8992790-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-03-31 US disclosed
US-20130284699-A1 PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-10-31 US disclosed
EP-2657767-A1 Patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2013-10-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20200159120-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS RPS4X, SIK3, MLX ALDH1A1 4644/4885CYP2C19 3505/4885TDP1 2821/4885
US-20230333472-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS RPS4X, SIK3, MLX ALDH1A1 4644/4885CYP2C19 3505/4885TDP1 2821/4885
US-11914295-B2 Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process RPS4X, SIK3, MLX ALDH1A1 4644/4885CYP2C19 3505/4885TDP1 2821/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.