SCHEMBL15380671

SCHEMBL15380671

Cc1[c][c]c2ccccc2c1C

nearest known ligand 0.36

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 3/20 0.36
CYP2A6 P11509 3/20 0.33
TSHR P16473 2/20 0.33
AHR P35869 1/20 0.32
GPR3 P46089 1/20 0.32
KDM4E B2RXH2 1/20 0.31
MAPT P10636 1/20 0.31
ALDH1A1 P00352 1/20 0.31
CYP3A4 P08684 1/20 0.30
HPGD P15428 1/20 0.30
MAPK1 P28482 1/20 0.30
CASP1 P29466 1/20 0.30
RAB9A P51151 1/20 0.30
CASP7 P55210 1/20 0.30
ATM Q13315 1/20 0.30
HIF1A Q16665 1/20 0.30
HSD17B10 Q99714 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1587229 0.76 ALDH1A1 (0.37) CYP1A2CYP2A6TSHRGPR3KDM4E
SCHEMBL2336588 0.72 CYP1A2 (0.41) CYP1A2CYP2A6TSHRAHRGPR3
SCHEMBL718918 0.71 CYP1A2 (0.36) CYP1A2CYP2A6TSHRAHRALDH1A1
SCHEMBL29660297 0.67 CYP1A2 (0.53) CYP1A2CYP2A6TSHRAHRGPR3
SCHEMBL357443 0.67 CYP1A2 (0.53) CYP1A2CYP2A6TSHRAHRGPR3
SCHEMBL293803 0.65 CYP1A2 (0.41) CYP1A2CYP2A6TSHRAHRALDH1A1
SCHEMBL559155 0.65 GPR3 (0.35) CYP1A2CYP2A6TSHRAHRGPR3
SCHEMBL22499794 0.65 CYP1A2 (0.39) CYP1A2CYP2A6TSHRAHRGPR3
Ammonia Solution, Strong SCHEMBL2263911 0.64 CYP1A2 (0.50) CYP1A2CYP2A6TSHRAHRGPR3
SCHEMBL28539881 0.64 CYP1A2 (0.50) CYP1A2CYP2A6TSHRAHRGPR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108807140-B Method for cleaning and drying semiconductor substrate 信越化学工业株式会社 2023-11-07 CN disclosed
US-11572439-B2 Copolycarbonate and polycarbonate composition comprising the same LG CHEM, LTD. (KR) 2023-02-07 US disclosed
CN-112789310-B Copolycarbonates and polycarbonate compositions containing the same 株式会社LG化学 2022-11-15 CN disclosed
CN-112789310-A Copolycarbonates and polycarbonate compositions containing the same 株式会社LG化学 2021-05-11 CN disclosed
US-10811247-B2 Method of cleaning and drying semiconductor substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-10-20 US disclosed
EP-3396702-B1 METHOD OF CLEANING AND DRYING SEMICONDUCTOR SUBSTRATE SHINETSU CHEMICAL CO (JP) 2019-08-28 EP disclosed
US-20180315594-A1 METHOD OF CLEANING AND DRYING SEMICONDUCTOR SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-11-01 US disclosed
EP-3396702-A1 METHOD OF CLEANING AND DRYING SEMICONDUCTOR SUBSTRATE Shin-Etsu Chemical Co., Ltd. (JP) 2018-10-31 EP disclosed
US-9798242-B2 Rinse solution for pattern formation and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-24 US disclosed
EP-2905803-B1 Method for cleaning and drying semiconductor substrate SHINETSU CHEMICAL CO (JP) 2017-07-19 EP disclosed
US-9632416-B2 Rinse solution for pattern formation and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-25 US disclosed
US-9524863-B2 Method for cleaning and drying semiconductor substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-12-20 US disclosed
US-9372404-B2 Organic film composition, method for forming organic film and patterning process using this, and heat-decomposable polymer SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-06-21 US disclosed
US-20160154314-A1 RINSE SOLUTION FOR PATTERN FORMATION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-06-02 US disclosed
US-20160154312-A1 RINSE SOLUTION FOR PATTERN FORMATION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-06-02 US disclosed
EP-2905803-A1 Method for cleaning and drying semiconductor substrate Shin-Etsu Chemical Co., Ltd. (JP) 2015-08-12 EP disclosed
US-20150221500-A1 METHOD FOR CLEANING AND DRYING SEMICONDUCTOR SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-08-06 US disclosed
US-20130302990-A1 ORGANIC FILM COMPOSITION, METHOD FOR FORMING ORGANIC FILM AND PATTERNING PROCESS USING THIS, AND HEAT-DECOMPOSABLE POLYMER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-11-14 US disclosed