SCHEMBL15422862

SCHEMBL15422862

O=C(O)CC(=O)CC(=O)O.[Ag]

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LDHA P00338 1/20 0.61
SRR Q9GZT4 1/20 0.61
EGLN1 Q9GZT9 3/20 0.40
LMNA P02545 3/20 0.40
ALKBH5 Q6P6C2 1/20 0.40
SUCNR1 Q9BXA5 1/20 0.40
TSHR P16473 4/20 0.38
FFAR3 O14843 1/20 0.38
GLRA1 P23415 1/20 0.38
SLC6A9 P48067 1/20 0.38
OR51E2 Q9H255 1/20 0.38
KDM4E B2RXH2 3/20 0.36
KDM6B O15054 2/20 0.36
KDM5C P41229 2/20 0.36
PHF8 Q9UPP1 2/20 0.36
KDM2A Q9Y2K7 2/20 0.36
SLC22A6 Q4U2R8 1/20 0.35
MMP12 P39900 1/20 0.34
CYP2D6 P10635 3/20 0.33
ALOX15 P16050 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28522 0.96 LDHA (0.67) LDHASRREGLN1LMNAALKBH5
SCHEMBL2184678 0.96 LDHA (0.67) LDHASRREGLN1LMNAALKBH5
SCHEMBL11603188 0.92 LDHA (0.61) LDHASRREGLN1LMNAALKBH5
SCHEMBL320485 0.92 LDHA (0.61) LDHASRREGLN1LMNAALKBH5
SCHEMBL320091 0.92 LDHA (0.61) LDHASRREGLN1LMNAALKBH5
SCHEMBL28480654 0.92 LDHA (0.61) LDHASRREGLN1LMNAALKBH5
Hydrazine SCHEMBL28819948 0.88 LDHA (0.57) LDHASRREGLN1LMNAALKBH5
Malonic Acid SCHEMBL220733 0.82
Malonic Acid SCHEMBL7694178 0.82
SCHEMBL7673665 0.80 LDHA (0.57) LDHASRREGLN1LMNAALKBH5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10040960-B2 Silver ink composition, conductor and communication device TOPPAN FORMS CO., LTD. (JP) 2018-08-07 US claimed
CN-104662109-B Silver-colored ink composite, electric conductor and communication equipment 凸版资讯股份有限公司 2017-08-01 CN claimed
US-9371465-B2 Silver ink composition TOPPAN FORMS CO., LTD. (JP) 2016-06-21 US claimed
US-20150259557-A1 SILVER INK COMPOSITION, CONDUCTOR AND COMMUNICATION DEVICE TOPPAN FORMS CO., LTD (JP) 2015-09-17 US claimed
US-20150008376-A1 Silver Ink Composition TOPPAN FORMS CO., LTD (JP) 2015-01-08 US claimed
CN-118159373-A Sintered material, metal sintered body, method for producing sintered material, method for producing joined body, and joined body 凸版控股株式会社 2024-06-07 CN disclosed
US-20240045331-A1 PHOTOSENSITIVE RESIN COMPOSITION, BOARD WITH CONDUCTIVE PATTERN, ANTENNA ELEMENT, PRODUCTION METHOD FOR IMAGE DISPLAY DEVICE, AND PRODUCTION METHOD FOR TOUCH PANEL TORAY INDUSTRIES, INC. (JP) 2024-02-08 US disclosed
CN-116018655-B Photosensitive resin composition, substrate with conductive pattern, antenna element, method for manufacturing image display device, and method for manufacturing touch panel 东丽株式会社 2024-02-02 CN disclosed
WO-2023074580-A1 SINTERED MATERIAL, METAL SINTERED COMPACT, MANUFACTURING METHOD FOR SINTERED MATERIAL, MANUFACTURING METHOD FOR JOINED BODY, AND JOINED BODY トッパン・フォームズ株式会社 2023-05-04 WO disclosed
CN-116018655-A Photosensitive resin composition, substrate with conductive pattern, antenna element, method for manufacturing image display device, and method for manufacturing touch panel 东丽株式会社 2023-04-25 CN disclosed
US-20230112036-A1 COMPOSITIONS AND METHODS FOR PARTICLE THREE-DIMENSIONAL PRINTING HOLO, INC. (US) 2023-04-13 US disclosed
CN-112301346-B Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part 千住金属工业株式会社 2023-02-28 CN disclosed
CN-104471652-A Silver-containing composition and silver component-forming substrate NIPPON OIL CORP 2015-03-25 CN disclosed
CN-104471652-A Silver-containing composition and silver component-forming substrate NIPPON OIL CORP 2015-03-25 CN disclosed
CN-104470659-A Silver nanoparticles, method for producing same, silver nanoparticle dispersion liquid, and base provided with silver material NIPPON OIL CORP 2015-03-25 CN disclosed
CN-104350550-A Silver-containing composition and silver component forming base material NOF CORP 2015-02-11 CN disclosed
US-20150008376-A1 Silver Ink Composition TOPPAN FORMS CO., LTD (JP) 2015-01-08 US disclosed
CN-203812217-U Touch panel PANASONIC CORP 2014-09-03 CN disclosed
US-20140168146-A1 TOUCH PANEL PANASONIC CORPORATION (JP) 2014-06-19 US disclosed
WO-2014013557-A1 SILVER-CONTAINING COMPOSITION, AND BASE FOR USE IN FORMATION OF SILVER ELEMENT 日油株式会社 (JP) 2014-01-23 WO disclosed