SCHEMBL1553835

SCHEMBL1553835

Nc1ccc(Oc2cccc(Oc3ccc(N)c(O)c3)c2)cc1O

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 4/20 0.57
KMT2A Q03164 4/20 0.57
ALDH1A1 P00352 3/20 0.57
MAPT P10636 3/20 0.57
SMN1; SMN2 Q16637 2/20 0.57
GAA P10253 2/20 0.57
MITF O75030 1/20 0.57
GFER P55789 1/20 0.57
NLRP1 Q9C000 1/20 0.57
NOD2 Q9HC29 1/20 0.57
NR4A1 P22736 1/20 0.52
FURIN P09958 2/20 0.48
F2 P00734 1/20 0.48
F10 P00742 1/20 0.48
CYP3A4 P08684 1/20 0.46
ALOX15 P16050 1/20 0.46
HSD17B10 Q99714 1/20 0.46
MMP2 P08253 1/20 0.46
MMP14 P50281 1/20 0.46
MAOB P27338 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29718932 1.00 MEN1 (0.57) MEN1KMT2AALDH1A1MAPTSMN1; SMN2
SCHEMBL564947 0.92 ALDH1A1 (0.48) MEN1KMT2AALDH1A1MAPTSMN1; SMN2
SCHEMBL27510157 0.91 NR4A1 (0.56) MEN1KMT2AALDH1A1MAPTSMN1; SMN2
SCHEMBL436522 0.91 NR4A1 (0.61) MEN1KMT2AALDH1A1MAPTSMN1; SMN2
SCHEMBL30040301 0.91 NR4A1 (0.61) MEN1KMT2AALDH1A1MAPTSMN1; SMN2
SCHEMBL564995 0.90 MAOB (0.60) MEN1KMT2AALDH1A1MAPTSMN1; SMN2
SCHEMBL564952 0.90 LTA4H (0.59) MEN1KMT2AALDH1A1MAPTSMN1; SMN2
SCHEMBL30233344 0.90 LTA4H (0.59) MEN1KMT2AALDH1A1MAPTSMN1; SMN2
Hydrochloric Acid SCHEMBL10770715 0.89 NR4A1 (0.58) MEN1KMT2AALDH1A1MAPTSMN1; SMN2
SCHEMBL19809245 0.89 NR4A1 (0.58) MEN1KMT2AALDH1A1MAPTSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 107 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023202454-A1 POLYMER FOR BLACK MATRIX, AND PREPARATION METHOD THEREFOR AND USE THEREOF 上海交通大学 2023-10-26 WO claimed
US-9975996-B2 Positive photosensitive resin composition and polyhydroxyamide resin NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-05-22 US claimed
US-20160185905-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2016-06-30 US claimed
US-6875554-B2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2005-04-05 US claimed
EP-4660705-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RELIEF PATTERN USING SAME, CURED ARTICLE AND ELECTRONIC COMPONENT Toray Industries, Inc. (JP) 2025-12-10 EP disclosed
EP-4641693-A1 POLYIMIDE COMPOUND, NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERIES THAT USES SAID POLYIMIDE COMPOUND, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERIES, AND LITHIUM ION SECONDARY BATTERY Wingo Technology Co., Ltd. (JP) 2025-10-29 EP disclosed
US-12269949-B2 Polyimide compound and molded article comprising the polyimide compound WINGO TECHNOLOGY CO., LTD. (JP) 2025-04-08 US disclosed
WO-2025063041-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT USING SAME 東レ株式会社 2025-03-27 WO disclosed
CN-119585651-A Composition for forming wavelength conversion film 日产化学株式会社 2025-03-07 CN disclosed
WO-2025047702-A1 COMPOSITION FOR PATTERNING AND USE OF SAME 日産化学株式会社 2025-03-06 WO disclosed
WO-2025047700-A1 COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM AND USE THEREOF 日産化学株式会社 2025-03-06 WO disclosed
US-20250019242-A1 DISPERSION OF CARBON NANOTUBES, COATING LIQUID COMPOSITION FOR ELECTRODE USING SAME, ELECTRODE, AND LITHIUM ION SECONDARY BATTERY DKS CO. LTD. (JP) 2025-01-16 US disclosed
US-20040197699-A1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-10-07 US disclosed
EP-1431822-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2004-06-23 EP disclosed
US-20040048188-A1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-03-11 US disclosed
US-6677099-B1 POLYAMIDEIMIDE DEVELOPED BY AN AQUEOUS ALKALINE SOLUTION AND WHICH IS EXCELLENT IN THE DEVELOPABILITY AND THE ADHESION TO A SUBSTRATE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-01-13 US disclosed
EP-1329769-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2003-07-23 EP disclosed
EP-1241527-A1 POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2002-09-18 EP disclosed
EP-0424940-B1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL IND LTD (JP) 1998-01-14 EP disclosed
EP-0424940-A2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1991-05-02 EP disclosed