SCHEMBL15544196

SCHEMBL15544196

C=C[Si](C)(O[Si](C)(C)c1ccccc1)c1ccccc1

nearest known ligand 0.32

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.32
ESR2 Q92731 1/20 0.32
ALDH1A1 P00352 1/20 0.30
TSHR P16473 1/20 0.30
MAPT P10636 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL94078 0.90 ESR1 (0.35) ESR1ESR2ALDH1A1TSHRMAPT
SCHEMBL6889166 0.88 ESR1 (0.34) ESR1ESR2ALDH1A1TSHRMAPT
SCHEMBL9900064 0.86 ESR1 (0.33) ESR1ESR2ALDH1A1TSHRMAPT
SCHEMBL28879222 0.86 ESR1 (0.33) ESR1ESR2ALDH1A1TSHRMAPT
SCHEMBL12032189 0.86 ESR1 (0.33) ESR1ESR2ALDH1A1TSHRMAPT
SCHEMBL336006 0.84 ESR1 (0.32) ESR1ESR2ALDH1A1TSHRMAPT
SCHEMBL31344407 0.84 ESR1 (0.32) ESR1ESR2ALDH1A1TSHRMAPT
SCHEMBL13038467 0.84 ESR1 (0.32) ESR1ESR2ALDH1A1TSHRMAPT
SCHEMBL842155 0.84 ESR1 (0.32) ESR1ESR2ALDH1A1TSHRMAPT
SCHEMBL19398250 0.82 ESR1 (0.31) ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11066552-B2 Resin composition and article made therefrom ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD. (CN) 2021-07-20 US disclosed
US-20210108074-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD. (CN) 2021-04-15 US disclosed
US-20150252220-A1 Curable Silicone Composition, And Semiconductor Sealing Material And Optical Semiconductor Device Using The Same DOW CORNING TORAY CO., LTD. (JP) 2015-09-10 US disclosed
EP-2898011-A1 CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR SEALING MATERIAL AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME Dow Corning Toray Co., Ltd. (JP) 2015-07-29 EP disclosed
US-20140191161-A1 Curable Silicon Composition, Cured Product Thereof, And Optical Semiconductor Device DOW CORNING TORAY CO., LTD. (JP) 2014-07-10 US disclosed
US-20140187733-A1 Organopolysiloxane, And Method For Producing Same DOW CORNING TORAY CO., LTD. (JP) 2014-07-03 US disclosed
EP-2733160-A1 ORGANO POLYSILOXANE, AND METHOD FOR PRODUCING SAME Dow Corning Toray Co., Ltd. (JP) 2014-05-21 EP disclosed
EP-2730620-A1 CURABLE SILICON COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE Dow Corning Toray Co., Ltd. (JP) 2014-05-14 EP disclosed
WO-2014046309-A1 CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR SEALING MATERIAL AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME DOW CORNING TORAY CO., LTD. (JP) 2014-03-27 WO disclosed
WO-2014002919-A1 COATING AGENT, ELECTRICAL-ELECTRONIC EQUIPMENT, AND METHOD FOR PROTECTING METAL PARTS OF ELECTRICAL-ELECTRONIC EQUIPMENT DOW CORNING TORAY CO., LTD. (JP) 2014-01-03 WO disclosed