SCHEMBL15580594

SCHEMBL15580594

Cc1ccccc1-c1ccccc1Sc1ccc(CCO)cc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.40
FFAR1 O14842 5/20 0.36
SLC6A2 P23975 1/20 0.36
SLC6A4 P31645 1/20 0.36
FFAR4 Q5NUL3 1/20 0.36
CA2 P00918 1/20 0.35
MCHR1 Q99705 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
PLA2G7 Q13093 1/20 0.33
CYP4F2 P78329 1/20 0.33
CYP4A11 Q02928 1/20 0.33
PTGS2 P35354 1/20 0.33
ALDH1A1 P00352 1/20 0.33
MAPT P10636 1/20 0.33
S100A4 P26447 1/20 0.33
CDC25A P30304 1/20 0.33
CDC25B P30305 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.32
HDAC8 Q9BY41 1/20 0.32
HDAC6 Q9UBN7 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14712744 0.83 TDP1 (0.48) TDP1FFAR1SLC6A2SLC6A4FFAR4
SCHEMBL15834156 0.83 TP53 (0.38) TDP1SLC6A2SLC6A4L3MBTL1PTGS2
SCHEMBL15606260 0.79 NR1H2 (0.45) TDP1FFAR1L3MBTL1ALDH1A1MAPT
SCHEMBL19365898 0.79 MAPT (0.50) TDP1L3MBTL1ALDH1A1MAPTSMN1; SMN2
SCHEMBL15368855 0.79 TDP1 (0.56) TDP1SLC6A2SLC6A4CA2L3MBTL1
SCHEMBL12361695 0.78 MAPT (0.47) TDP1L3MBTL1ALDH1A1MAPTCDC25A
SCHEMBL4981917 0.77 TDP1 (0.52) TDP1FFAR1FFAR4CA2HDAC8
SCHEMBL16638368 0.76 CA2 (0.42) TDP1CA2L3MBTL1ALDH1A1MAPT
SCHEMBL18903345 0.74 RAB9A (0.46) TDP1CA2L3MBTL1ALDH1A1MAPT
SCHEMBL3282090 0.74 TSHR (0.43) CA2ALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2721446-B1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM AND METHOD OF FORMING PATTERN FUJIFILM CORP (JP) 2017-11-22 EP disclosed
EP-2090932-B1 Positive resist composition for use with electron beam, X-ray or EUV and pattern forming method using the same FUJIFILM CORP (JP) 2017-05-31 EP disclosed
US-9500951-B2 Actinic ray-sensitive or radiation-sensitive composition, resist film using the same, pattern forming method, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2016-11-22 US disclosed
US-9459531-B2 2016-10-04 US disclosed
US-9291896-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same, pattern forming method, manufacturing method of electronic device, and electronic device FUJIFILM CORPORATION (JP) 2016-03-22 US disclosed
US-20150370170-A1 PATTERN FORMING METHOD, ELECTRON BEAM- OR EXTREME ULTRAVIOLET-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE SAME, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-12-24 US disclosed
US-20150284492-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION, RESIST FILM USING THE SAME, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-10-08 US disclosed
US-20150132687-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE SAME, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-05-14 US disclosed
US-9005870-B2 Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition FUJIFILM CORPORATION (JP) 2015-04-14 US disclosed
US-8865389-B2 Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film therefrom and method of forming pattern FUJIFILM CORPORATION (JP) 2014-10-21 US disclosed
US-8673538-B2 Actinic ray-sensitive or radiation-sensitive resin composition, and actinic ray-sensitive or radiation-sensitive film and pattern forming method using the composition FUJIFILM CORPORATION (JP) 2014-03-18 US disclosed