SCHEMBL15580882

SCHEMBL15580882

COc1ccc(NC(=O)c2ccc3cc(N)ccc3c2)cc1

nearest known ligand 0.74

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 9/20 0.74
RAB9A P51151 9/20 0.74
CASP3 P42574 1/20 0.74
SENP7 Q9BQF6 1/20 0.74
PLAU P00749 10/20 0.72
SMN1; SMN2 Q16637 4/20 0.67
TP53 P04637 3/20 0.67
ALOX15 P16050 1/20 0.67
PLAT P00750 4/20 0.61
PLG P00747 4/20 0.61
MAPT P10636 1/20 0.58
MEN1 O00255 1/20 0.57
ALDH1A1 P00352 1/20 0.57
CYP1A2 P05177 1/20 0.57
CYP3A4 P08684 1/20 0.57
GAA P10253 1/20 0.57
CYP2D6 P10635 1/20 0.57
CYP2C9 P11712 1/20 0.57
CYP2C19 P33261 1/20 0.57
KMT2A Q03164 1/20 0.57

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12268549 0.90 NPC1 (0.61) NPC1RAB9ACASP3SENP7PLAU
SCHEMBL6816201 0.86 RAB9A (0.83) NPC1RAB9ACASP3SENP7SMN1; SMN2
SCHEMBL11462217 0.86 RAB9A (0.83) NPC1RAB9ACASP3SENP7SMN1; SMN2
SCHEMBL3788361 0.85 NPC1 (1.00) NPC1RAB9ACASP3SENP7PLAU
SCHEMBL22695574 0.85 POLB (0.75) NPC1RAB9ACASP3SENP7PLAU
SCHEMBL3454483 0.84 NPC1 (0.77) NPC1RAB9ACASP3SENP7PLAU
SCHEMBL15031541 0.84 NPC1 (0.76) NPC1RAB9ACASP3SENP7PLAU
SCHEMBL1352307 0.84 NPC1 (0.68) NPC1RAB9ACASP3SENP7SMN1; SMN2
SCHEMBL3036351 0.83 NPC1 (0.79) NPC1RAB9ACASP3SENP7PLAU
SCHEMBL27764460 0.82 NPC1 (0.71) NPC1RAB9ACASP3SENP7PLAU

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8822832-B2 Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-09-02 US disclosed
US-20140077129-A1 EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-03-20 US disclosed