SCHEMBL156107

SCHEMBL156107

CCCCCCCCCCCCc1cccc2sc3ccccc3c(=O)c12

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.44
NPC1 O15118 1/20 0.44
CYP1A2 P05177 1/20 0.44
CYP3A4 P08684 1/20 0.44
CYP2C9 P11712 1/20 0.44
HPGD P15428 1/20 0.44
CYP2C19 P33261 1/20 0.44
RAB9A P51151 1/20 0.44
CNR1 P21554 1/20 0.43
CNR2 P34972 1/20 0.43
LIPG Q9Y5X9 1/20 0.42
FAAH O00519 1/20 0.42
MGLL Q99685 1/20 0.42
NR1H2 P55055 1/20 0.42
NR1H3 Q13133 1/20 0.42
CYSLTR2 Q9NS75 2/20 0.41
CYSLTR1 Q9Y271 2/20 0.41
MEN1 O00255 1/20 0.41
ALDH1A1 P00352 1/20 0.41
POLB P06746 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28756839 1.00 MAPT (0.44) MAPTNPC1CYP1A2CYP3A4CYP2C9
SCHEMBL29447754 1.00 MAPT (0.44) MAPTNPC1CYP1A2CYP3A4CYP2C9
SCHEMBL4912934 1.00 MAPT (0.44) MAPTNPC1CYP1A2CYP3A4CYP2C9
SCHEMBL29904752 1.00 MAPT (0.44) MAPTNPC1CYP1A2CYP3A4CYP2C9
SCHEMBL2419726 0.94 MAPT (0.46) MAPTNPC1CYP1A2CYP3A4CYP2C9
SCHEMBL31192989 0.88 MAPT (0.48) MAPTNPC1CYP1A2CYP3A4CYP2C9
SCHEMBL9299449 0.88 LIPG (0.46) CNR1CNR2LIPGFAAHMGLL
SCHEMBL3727803 0.88 LIPG (0.46) CNR1CNR2LIPGFAAHMGLL
SCHEMBL2401853 0.88 MAPT (0.48) MAPTNPC1CYP1A2CYP3A4CYP2C9
SCHEMBL5591011 0.87 GPR3 (0.45) CNR1CNR2LIPGCYSLTR2CYSLTR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1820 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11702571-B2 Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same LG CHEM, LTD. (KR) 2023-07-18 US claimed
EP-3750967-B1 ADHESIVE COMPOSITION LG CHEMICAL LTD (KR) 2023-03-08 EP claimed
US-11466184-B2 Adhesive composition LG CHEM, LTD. (KR) 2022-10-11 US claimed
CN-111836867-B Adhesive composition 株式会社LG化学 2022-09-30 CN claimed
CN-111225963-B Adhesive sheet for temporary fixation and method for manufacturing semiconductor device using the same 株式会社LG化学 2022-02-22 CN claimed
US-20210171802-A1 ADHESIVE SHEET FOR TEMPORARY FIXATION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME LG CHEM, LTD. (KR) 2021-06-10 US claimed
US-20210155831-A1 ADHESIVE COMPOSITION LG CHEM, LTD. (KR) 2021-05-27 US claimed
EP-3750967-A1 ADHESIVE COMPOSITION LG CHEM, LTD. (KR) 2020-12-16 EP claimed
CN-111836867-A Adhesive composition 株式会社LG化学 2020-10-27 CN claimed
CN-111225963-A Adhesive sheet for temporary fixation and method for manufacturing semiconductor device using the same 株式会社LG化学 2020-06-02 CN claimed
WO-2019190242-A1 ADHESIVE SHEET FOR TEMPORARY FIXING, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE BY USING SAME 주식회사 엘지화학 2019-10-03 WO claimed
US-8003292-B2 Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer INFINEON TECHNOLOGIES AG (DE) 2011-08-23 US claimed
WO-2006023790-A1 CURABLE THIOCARBONATE COMPOUNDS AND COMPOSITIONS NOVEON, INC. (US) 2006-03-02 WO claimed
US-5637395-A PHOTOCURABLE RUBBER OR ACRYL-BASED PRESSURE SENSITIVE ADHESIVE; THREE DIMENSIONAL NETWORK NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1997-06-10 US claimed
EP-0157508-B1 THIN ADHESIVE SHEET FOR USE IN WORKING SEMICONDUCTOR WAFERS NITTO DENKO CORPORATION (JP) 1992-07-15 EP claimed
EP-0157508-A2 Thin adhesive sheet for use in working semiconductor wafers NITTO DENKO CORPORATION (JP) 1985-10-09 EP claimed
CN-122095277-A Optical laminate, image display panel, and image display device 2026-05-26 CN disclosed
CN-122095276-A Optical laminate, image display panel, and image display device 2026-05-26 CN disclosed
EP-0157508-A2 Thin adhesive sheet for use in working semiconductor wafers NITTO DENKO CORPORATION (JP) 1985-10-09 EP disclosed
EP-0081323-A1 Curable ink or paint containing electrically conductive metal particles JOHNSON MATTHEY PUBLIC LIMITED COMPANY (GB) 1983-06-15 EP disclosed