Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 2/20 | 0.44 |
| ▸ | NPC1 | O15118 | 1/20 | 0.44 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.44 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.44 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.44 |
| ▸ | HPGD | P15428 | 1/20 | 0.44 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.44 |
| ▸ | RAB9A | P51151 | 1/20 | 0.44 |
| ▸ | CNR1 | P21554 | 1/20 | 0.43 |
| ▸ | CNR2 | P34972 | 1/20 | 0.43 |
| ▸ | LIPG | Q9Y5X9 | 1/20 | 0.42 |
| ▸ | FAAH | O00519 | 1/20 | 0.42 |
| ▸ | MGLL | Q99685 | 1/20 | 0.42 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.42 |
| ▸ | NR1H3 | Q13133 | 1/20 | 0.42 |
| ▸ | CYSLTR2 | Q9NS75 | 2/20 | 0.41 |
| ▸ | CYSLTR1 | Q9Y271 | 2/20 | 0.41 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.41 |
| ▸ | POLB | P06746 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28756839 | 1.00 | MAPT (0.44) | MAPTNPC1CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL29447754 | 1.00 | MAPT (0.44) | MAPTNPC1CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL29904752 | 1.00 | MAPT (0.44) | MAPTNPC1CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL156107 | 1.00 | MAPT (0.44) | MAPTNPC1CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL2419726 | 0.94 | MAPT (0.46) | MAPTNPC1CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL31192989 | 0.88 | MAPT (0.48) | MAPTNPC1CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL9299449 | 0.88 | LIPG (0.46) | CNR1CNR2LIPGFAAHMGLL | |
| SCHEMBL3727803 | 0.88 | LIPG (0.46) | CNR1CNR2LIPGFAAHMGLL | |
| SCHEMBL2401853 | 0.88 | MAPT (0.48) | MAPTNPC1CYP1A2CYP3A4CYP2C9 | |
| SCHEMBL5591011 | 0.87 | GPR3 (0.45) | CNR1CNR2LIPGCYSLTR2CYSLTR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11149171-B2 | Thermally-conductive pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2021-10-19 | — | — | US | disclosed |
| US-20160152872-A1 | THERMALLY-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2016-06-02 | — | — | US | disclosed |
| CN-103347971-B | Flame-retardant heat-conductive adhesive sheet | NITTO DENKO CORP. (JP) | 2016-03-23 | — | — | CN | disclosed |
| CN-105264031-A | Thermally Conductive Adhesive Sheet | NITTO DENKO CORP | 2016-01-20 | — | — | CN | disclosed |
| US-20150299531-A1 | PRESSURE-SENSITIVE ADHESIVE MATERIAL AND THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2015-10-22 | — | — | US | disclosed |
| CN-103459532-B | Flame-retardant heat-conductive adhesive sheet | NITTO DENKO CORP. (JP) | 2015-10-14 | — | — | CN | disclosed |
| CN-104817971-A | Thermal conductive two-sides pasting sheet | NITTO DENKO CORP | 2015-08-05 | — | — | CN | disclosed |
| CN-103210028-B | Bubble-containing thermally-conductive resin-composition layer, manufacturing method therefor, and pressure-sensitive adhesive sheet using said resin-composition layer | NITTO DENKO CORP | 2015-07-01 | — | — | CN | disclosed |
| CN-104755574-A | Thermally conductive adhesive sheet and method for producing same | NITTO DENKO CORP | 2015-07-01 | — | — | CN | disclosed |
| CN-104487531-A | Heat-conductive adhesive sheet | NITTO DENKO CORP | 2015-04-01 | — | — | CN | disclosed |
| US-20140004342-A1 | FLAME-RETARDANT THERMALLY-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2014-01-02 | — | — | US | disclosed |
| EP-2674464-A1 | FLAME-RETARDANT THERMALLY-CONDUCTIVE ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2013-12-18 | — | — | EP | disclosed |
| CN-103459532-A | Flame-retardant heat-conductive adhesive sheet | NITTO DENKO CORP | 2013-12-18 | — | — | CN | disclosed |
| WO-2013169702-A1 | BASECOAT WITH IMPROVED ADHESION TO BIOPLASTIC | PPG INDUSTRIES OHIO, INC. (US) | 2013-11-14 | — | — | WO | disclosed |
| CN-103347971-A | Flame-retardant thermally-conductive adhesive sheet | NITTO DENKO CORP | 2013-10-09 | — | — | CN | disclosed |
| US-20130244020-A1 | BUBBLE-CONTAINING THERMALLY CONDUCTIVE RESIN COMPOSITION LAYER, PRODUCING METHOD THEREOF, AND PRESSURE-SENSITIVE ADHESIVE SHEET USING BUBBLE-CONTAINING THERMALLY CONDUCTIVE RESIN COMPOSITION LAYER | NITTO DENKO CORPORATION (JP) | 2013-09-19 | — | — | US | disclosed |
| EP-2639259-A1 | BUBBLE-CONTAINING THERMALLY-CONDUCTIVE RESIN-COMPOSITION LAYER, MANUFACTURING METHOD THEREFOR, AND PRESSURE-SENSITIVE ADHESIVE SHEET USING SAID RESIN-COMPOSITION LAYER | Nitto Denko Corporation (JP) | 2013-09-18 | — | — | EP | disclosed |
| CN-103210028-A | Bubble-containing thermally-conductive resin-composition layer, manufacturing method therefor, and pressure-sensitive adhesive sheet using said resin-composition layer | NITTO DENKO CORP | 2013-07-17 | — | — | CN | disclosed |
| US-20080271842-A1 | Methods of Reducing Surface Checking on Wood Compositions | CHEMCRAFT INTERNATIONAL, INC. (US) | 2008-11-06 | — | — | US | disclosed |
| WO-2006081346-A2 | METHODS OF REDUCING SURFACE CHECKING ON WOOD COMPOSITIONS | CHEMCRAFT INTERNATIONAL, INC. (US) | 2006-08-03 | — | — | WO | disclosed |