SCHEMBL15613938

SCHEMBL15613938

CCC(C)(C)OC(=O)NCCCCC(=O)O

nearest known ligand 0.49

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
▸ ADRA1A P35348 1/20 0.49
▸ TDP1 Q9NUW8 1/20 0.47
▸ PRMT1 Q99873 1/20 0.47
▸ EPHX2 P34913 11/20 0.46
▸ PLA2G2A P14555 1/20 0.45
▸ MEN1 O00255 1/20 0.45
▸ GAA P10253 1/20 0.45
▸ KMT2A Q03164 1/20 0.45
▸ MAOA P21397 1/20 0.42
▸ MAOB P27338 1/20 0.42
▸ PLA2G4A P47712 1/20 0.41
▸ EPHX1 P07099 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15613928 0.98 ADRA1A (0.51) ADRA1ATDP1PRMT1EPHX2PLA2G2A
SCHEMBL15613901 0.95 MEN1 (0.46) ADRA1ATDP1PRMT1EPHX2PLA2G2A
SCHEMBL15613900 0.88 MEN1 (0.41) TDP1EPHX2PLA2G2AMEN1GAA
SCHEMBL1852564 0.88 TDP1 (0.59) TDP1MEN1GAAKMT2AMAOA
SCHEMBL1849286 0.88 TDP1 (0.59) TDP1MEN1GAAKMT2AMAOA
SCHEMBL1851030 0.88 TDP1 (0.59) TDP1MEN1GAAKMT2AMAOA
SCHEMBL1850304 0.88 TDP1 (0.59) TDP1MEN1GAAKMT2AMAOA
SCHEMBL1851058 0.88 TDP1 (0.59) TDP1MEN1GAAKMT2AMAOA
SCHEMBL9893642 0.88 TDP1 (0.59) TDP1MEN1GAAKMT2AMAOA
SCHEMBL904074 0.84 TDP1 (0.66) ADRA1ATDP1PRMT1EPHX2PLA2G2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023008346-A1 ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE 富士フイルム株式会社 2023-02-02 — — WO disclosed
US-20210165325-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND FUJIFILM CORPORATION (JP) 2021-06-03 — — US disclosed
US-20210103217-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND PHOTO MASK FUJIFILM CORPORATION (JP) 2021-04-08 — — US disclosed
WO-2021065450-A1 ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE 富士フイルム株式会社 2021-04-08 — — WO disclosed
WO-2020045535-A1 ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD, PHOTOMASK, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND COMPOUND 富士フイルム株式会社 2020-03-05 — — WO disclosed
WO-2020045534-A1 ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND 富士フイルム株式会社 2020-03-05 — — WO disclosed
US-9250518-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-02-02 — — US disclosed
US-9250518-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-02-02 — — US disclosed
US-20150125794-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-05-07 — — US disclosed
US-20150125794-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-05-07 — — US disclosed
US-9017922-B2 Chemically amplified resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-04-28 — — US disclosed
US-9017922-B2 Chemically amplified resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-04-28 — — US disclosed
US-20140080055-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-03-20 — — US disclosed
US-20140080055-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-03-20 — — US disclosed
Send feedback