⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25295549 | 0.70 | — | — | |
| SCHEMBL8718732 | 0.67 | CA1 (0.31) | — | |
| SCHEMBL27929693 | 0.65 | — | — | |
| SCHEMBL3238308 | 0.61 | — | — | |
| SCHEMBL25966211 | 0.61 | — | — | |
| SCHEMBL708131 | 0.61 | CA5A (0.35) | — | |
| SCHEMBL28516679 | 0.61 | — | — | |
| SCHEMBL29015660 | 0.56 | — | — | |
| SCHEMBL27772655 | 0.56 | CA1 (0.32) | — | |
| SCHEMBL15132313 | 0.56 | CA1 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 325 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3381674-A1 | FOAMABLE PANEL-REINFORCING MATERIAL, PRODUCTION METHOD THEREFOR, AND PANEL-REINFORCING METHOD | Sekisui Plastics Co., Ltd. (JP) | 2018-10-03 | — | — | EP | claimed |
| EP-2907842-A1 | ADHESIVE COMPOSITION AND ADHESIVE FOAM SHEET | Sika Technology AG (CH) | 2015-08-19 | — | — | EP | claimed |
| US-20150191631-A1 | ADHESIVE COMPOSITION AND ADHESIVE FOAM SHEET | SIKA TECHNOLOGY AG (CH) | 2015-07-09 | — | — | US | claimed |
| EP-2268722-A1 | CROOS-LINKED POLYOLEFIN FOAMS COMPRISING CORK PARTICLES | Palziv (IL) | 2011-01-05 | — | — | EP | claimed |
| WO-2009128066-A1 | CROOS-LINKED POLYOLEFIN FOAMS COMPRISING CORK PARTICLES | PALZIV (IL) | 2009-10-22 | — | — | WO | claimed |
| US-20240240470-A1 | POLYMER FOAM SHEET AND BARRIER LAYER COMPOSITE | Palziv Ein Hanaziv Agricultural Cooperative Society Ltd. (IL) | 2024-07-18 | — | — | US | disclosed |
| WO-2024143054-A1 | SEAL MATERIAL | 日東電工株式会社 | 2024-07-04 | — | — | WO | disclosed |
| US-20240209134-A1 | RESIN COMPOSITION, FOAMABLE COMPOSITION, AND CROSSLINKED FOAM BODY | KURARAY CO., LTD. (JP) | 2024-06-27 | — | — | US | disclosed |
| EP-3694895-B1 | RUBBER REPLACEMENT MATERIAL COMPRISING TERPOLYMERS | BOREALIS AG (AT) | 2024-06-26 | — | — | EP | disclosed |
| EP-4332136-A1 | RESIN COMPOSITION, FOAMABLE COMPOSITION, AND CROSSLINKED FOAM BODY | Kuraray Co., Ltd. (JP) | 2024-03-06 | — | — | EP | disclosed |
| US-11913238-B2 | Polymer foam sheet and barrier layer composite | Palziv Ein Hanaziv Agricultural Cooperative Society Ltd. (IL) | 2024-02-27 | — | — | US | disclosed |
| WO-2024029621-A1 | ELECTRICAL CONDUCTIVITY TESTING METHOD, PEELING METHOD, ELECTRICALLY PEELABLE ADHESIVE LAYER, AND ADHESIVE SHEET | 日東電工株式会社 | 2024-02-08 | — | — | WO | disclosed |
| US-6808642-B2 | Method for producing multilayer substrate and electronic part, and multilayer electronic part | TDK CORPORATION (JP) | 2004-10-26 | — | — | US | disclosed |
| EP-1347475-A1 | LAMINATED CIRCUIT BOARD AND PRODUCTION METHOD FOR ELECTRONIC PART, AND LAMINATED ELECTRONIC PART | TDK Corporation (JP) | 2003-09-24 | — | — | EP | disclosed |
| US-20030029830-A1 | Method for producing multilayer substrate and electronic part, and multilayer electronic part | TDK CORP. (JP) | 2003-02-13 | — | — | US | disclosed |
| EP-0612823-B1 | Adhesive sheet | NITTO DENKO CORP (JP) | 1997-05-07 | — | — | EP | disclosed |
| US-5609954-A | Strippable pressure-sensitive adhesive and adhesive material using the same | NITTO DENKO CORPORATION (JP) | 1997-03-11 | — | — | US | disclosed |
| US-5441810-A | Adhesive sheet | NITTO DENKO CORPORATION (JP) | 1995-08-15 | — | — | US | disclosed |
| EP-0612823-A1 | Adhesive sheet | NITTO DENKO CORPORATION (JP) | 1994-08-31 | — | — | EP | disclosed |
| EP-0527505-A2 | Strippable pressure-sensitive adhesive and adhesive material using the same | NITTO DENKO CORPORATION (JP) | 1993-02-17 | — | — | EP | disclosed |