SCHEMBL1573975

SCHEMBL1573975

O=C([O-])C(F)(F)C(F)(F)C(F)(F)C(F)(F)F.c1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.39

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.39
CA2 P00918 11/20 0.35
CA1 P00915 10/20 0.35
HDAC1 Q13547 3/20 0.35
HDAC7 Q8WUI4 3/20 0.35
HDAC8 Q9BY41 3/20 0.35
HDAC6 Q9UBN7 3/20 0.35
HDAC3 O15379 1/20 0.35
HDAC4 P56524 1/20 0.35
HDAC2 Q92769 1/20 0.35
HDAC10 Q969S8 1/20 0.35
HDAC11 Q96DB2 1/20 0.35
HDAC9 Q9UKV0 1/20 0.35
HDAC5 Q9UQL6 1/20 0.35
CES1 P23141 2/20 0.33
KDM4E B2RXH2 1/20 0.32
CA4 P22748 1/20 0.31
MAPK1 P28482 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29746113 1.00 THRB (0.39) THRBCA2CA1HDAC1HDAC7
SCHEMBL4962404 0.98 THRB (0.42) THRBCA2CA1HDAC1HDAC7
SCHEMBL4962222 0.98 THRB (0.42) THRBCA2CA1HDAC1HDAC7
SCHEMBL4962900 0.98 THRB (0.42) THRBCA2CA1HDAC1HDAC7
SCHEMBL4962460 0.98 THRB (0.42) THRBCA2CA1HDAC1HDAC7
SCHEMBL545780 0.95 CES1 (0.34) THRBCA2CA1HDAC1HDAC7
SCHEMBL29745841 0.95 CES1 (0.34) THRBCA2CA1HDAC1HDAC7
SCHEMBL4962904 0.93 HDAC1 (0.40) THRBCA2CA1HDAC1HDAC7
SCHEMBL4961195 0.90 GAA (0.41) THRBCA2CA1HDAC1HDAC7
SCHEMBL4964156 0.90 GAA (0.41) THRBCA2CA1HDAC1HDAC7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2384457-B1 COATING COMPOSITIONS MERCK PATENT GMBH (DE) 2022-07-06 EP disclosed
EP-2278399-B1 Positive-working resist composition FUJIFILM CORP (JP) 2013-05-15 EP disclosed
EP-1626309-B1 Hologram recording material, hologram recording method and holographic optical element FUJIFILM CORP (JP) 2011-07-27 EP disclosed
EP-1492092-B1 Two-photon absorbing optical recording material and two-photon absorbing optical recording and reproducing method FUJIFILM CORP (JP) 2011-04-13 EP disclosed
US-20100239962-A1 TWO-PHOTON ABSORBING OPTICAL RECORDING MATERIAL AND TWO-PHOTON ABSORBING OPTICAL RECORDING AND REPRODUCING METHOD FUJIFILM CORPORATION (JP) 2010-09-23 US disclosed
US-7771915-B2 Two-photon absorbing optical recording material and two-photon absorbing optical recording and reproducing method FUJIFILM CORPORATION (JP) 2010-08-10 US disclosed
EP-2180467-A1 Photon-mode recording method Fujifilm Corporation (JP) 2010-04-28 EP disclosed
US-7588863-B2 Hologram recording method and hologram recording material FUJIFILM CORPORATION (JP) 2009-09-15 US disclosed
US-7582390-B2 Two-photon absorbing polymerization method, two-photon absorbing optical recording material and two-photon absorbing optical recording method FUJIFILM CORPORATION (JP) 2009-09-01 US disclosed
US-7582391-B2 Two-photon absorption decolorizable material, two-photon absorption refractive index modulation material, two-photon absorption polymerization material, two-photon absorption polymerization method and three-dimensional optical recording material FUJIFILM CORPORATION (JP) 2009-09-01 US disclosed
EP-1480079-A2 Photosensitive resin composition FUJI PHOTO FILM CO., LTD. (JP) 2004-11-24 EP disclosed
US-6811947-B2 RESIN, WHICH IS DECOMPOSED BY THE ACTION OF AN ACID TO INCREASE SOLUBILITY IN AN ALKALI DEVELOPING SOLUTION FUJI PHOTO FILM CO., LTD. (JP) 2004-11-02 US disclosed
US-20040009430-A1 Photosensitive resin composition FUJI PHOTO FILM CO., LTD. 2004-01-15 US disclosed
US-20040005512-A1 Positive-working resist composition FUJI PHOTO FILM CO., LTD. 2004-01-08 US disclosed
EP-1376232-A1 Photosensitive resin composition FUJI PHOTO FILM CO., LTD. (JP) 2004-01-02 EP disclosed
EP-1367440-A2 Positive-working resist composition Fuji Photo Film Co., Ltd. (JP) 2003-12-03 EP disclosed
US-20030203308-A1 Photosensitive resin composition FUJI PHOTO FILM CO., LTD. 2003-10-30 US disclosed
US-20030194641-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-10-16 US disclosed
US-6485883-B2 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 2002-11-26 US disclosed
US-20010041300-A1 Positive photoresist composition FUJIFILM CORPORATION (JP) 2001-11-15 US disclosed