SCHEMBL158363

SCHEMBL158363

CCCC(C)(C)OOOC(=O)CC(C)(C)C

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
MIF P14174 1/20 0.34
LMNA P02545 2/20 0.32
HSD17B10 Q99714 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10694782 0.89 LMNA (0.32) LMNAHSD17B10
SCHEMBL19548467 0.89 LMNA (0.33) MIFLMNAHSD17B10
SCHEMBL22773839 0.83 ALDH1A1 (0.41) LMNAHSD17B10
SCHEMBL9842720 0.81 TSHR (0.35) MIFLMNAHSD17B10
SCHEMBL22773963 0.80
SCHEMBL465271 0.80 DGKA (0.36) MIFLMNA
SCHEMBL29525716 0.80 ALDH1A1 (0.35) LMNA
SCHEMBL22773835 0.79 MIF (0.36) MIFLMNAHSD17B10
SCHEMBL28476790 0.79 GAA (0.34) LMNAHSD17B10
SCHEMBL15758715 0.78 DGKA (0.36) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2011046942-A1 METAL COMPLEXES OF N-HETEROCYCLIC CARBENES THE UNIVERSITY OF AKRON (US) 2011-04-21 WO claimed
WO-2011032159-A1 METHODS TO PREVENT A HAIR-RELATED SIDE EFFECT OF TREATMENT WITH A CHEMOTHERAPEUTIC AGENT META COMESTICS, LLC (US) 2011-03-17 WO claimed
US-5362828-A One of which does not have benzene ring or alkoxy group; emulsion polymerization SHIN-ETSU CHEMICAL CO., LTD. (JP) 1994-11-08 US claimed
EP-3438208-B1 THERMOPLASTIC RESIN COMPOSITION, CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, CELLULOSE-REINFORCED RESIN MOLDED ARTICLE, AND METHOD FOR PRODUCING CELLULOSE-REINFORCED RESIN MOLDED ARTICLE FURUKAWA ELECTRIC CO LTD (JP) 2026-01-07 EP disclosed
US-11629244-B2 Thermoplastic resin composition, cellulose-reinforced thermoplastic resin composition, method of producing cellulose-reinforced thermoplastic resin composition, molded article of cellulose-reinforced resin, and method of producing molded article of cellulose-reinforced resin FURUKAWA ELECTRIC CO., LTD. (JP) 2023-04-18 US disclosed
EP-3730555-A1 THERMOPLASTIC RESIN COMPOSITION, CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, METHOD OF PRODUCING CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN, AND METHOD OF PRODUCING MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN FURUKAWA ELECTRIC CO., LTD. (JP) 2020-10-28 EP disclosed
EP-3438208-A1 THERMOPLASTIC RESIN COMPOSITION, CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, CELLULOSE-REINFORCED RESIN MOLDED ARTICLE, AND METHOD FOR PRODUCING CELLULOSE-REINFORCED RESIN MOLDED ARTICLE Furukawa Electric Co., Ltd. (JP) 2019-02-06 EP disclosed
US-20190023882-A1 THERMOPLASTIC RESIN COMPOSITION, CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, METHOD OF PRODUCING CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN, AND METHOD OF PRODUCING MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN FURUKAWA ELECTRIC CO., LTD. (JP) 2019-01-24 US disclosed
US-9481756-B2 Curable composition THREEBOND FINE CHEMICAL CO., LTD. (JP) 2016-11-01 US disclosed
EP-2703420-B1 PHOTOCURABLE COMPOSITION THREE BOND FINE CHEMICAL CO LTD (JP) 2016-06-22 EP disclosed
US-9029435-B2 Photocurable composition THREE BOND FINE CHEMICAL CO., LTD. (JP) 2015-05-12 US disclosed
US-5449723-A Catalytic suspension polymerization of monomers, heat exchanging, fluid flow, pumping and circulation SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-09-12 US disclosed
US-5391664-A Having hydroxyl groups at both terminals NIPPON SHOKUBAI CO., LTD. (JP) 1995-02-21 US disclosed
US-5362828-A One of which does not have benzene ring or alkoxy group; emulsion polymerization SHIN-ETSU CHEMICAL CO., LTD. (JP) 1994-11-08 US disclosed
EP-0610515-A1 PROCESS FOR PRODUCING POLYMER NIPPON SHOKUBAI CO., LTD. (JP) 1994-08-17 EP disclosed
US-5286796-A Adding to polymerization mixture water insoluble partially saponified polyvinyl acetate SHIN-ETSU CHEMICAL CO., LTD. (JP) 1994-02-15 US disclosed
US-5160670-A METHOD OF MANUFACTURING SILICONE RUBBER MOLDINGS DOW CORNING TORAY SILICONE CO., LTD. (JP) 1992-11-03 US disclosed
US-5116670-A Composed of polybasic acid and polyhydric alcohol; ester bonded to one terminal; electronics SHOWA DENKO K.K. (JP) 1992-05-26 US disclosed
EP-0465906-A2 Method of manufacturing silicone rubber moldings Dow Corning Toray Silicone Company, Limited (JP) 1992-01-15 EP disclosed
EP-0420208-A2 Allyl ester resin composition and laminated sheet using the same SHOWA DENKO KABUSHIKI KAISHA (JP) 1991-04-03 EP disclosed