SCHEMBL15914714

SCHEMBL15914714

CCCCCCOOC(OC(=O)OC(OOCCCCCC)C(CC)CCCC)C(CC)CCCC

nearest known ligand 0.39

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
PLA2G2C Q5R387 4/20 0.39
NAAA Q02083 1/20 0.35
CES2 O00748 1/20 0.34
CA2 P00918 3/20 0.33
LMNA P02545 2/20 0.33
CA1 P00915 1/20 0.33
EPHX1 P07099 1/20 0.33
TSHR P16473 2/20 0.33
MAPK1 P28482 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4634756 0.98 PLA2G2C (0.37) PLA2G2CNAAACES2CA2LMNA
SCHEMBL1581727 0.94 CA2 (0.35) PLA2G2CCA2CA1TSHRMAPK1
SCHEMBL15914715 0.90 PLA2G2C (0.35) PLA2G2CNAAACES2CA2LMNA
SCHEMBL4634760 0.88 CA2 (0.36) PLA2G2CNAAACES2CA2CA1
SCHEMBL1581728 0.83 CA2 (0.37) CA2CA1TSHRMAPK1
SCHEMBL3478364 0.83 CA2 (0.37) CA2CA1TSHRMAPK1
SCHEMBL18241671 0.83 CTSK (0.33) CA2CA1MAPK1
SCHEMBL165678 0.77 CA2 (0.38) CA2CA1TSHRMAPK1
SCHEMBL6909026 0.76 USP2 (0.37) PLA2G2CNAAA
SCHEMBL114018 0.75 CA2 (0.36) CA2CA1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9815956-B2 Expandable composite resin bead JSP CORPORATION (JP) 2017-11-14 US disclosed
EP-2860217-B1 EXPANDABLE COMPOSITE RESIN BEAD JSP CORP (JP) 2016-11-30 EP disclosed
US-9505898-B2 Expandable composite resin bead JSP CORPORATION (JP) 2016-11-29 US disclosed
US-9309398-B2 Expanded composite resin beads and molded article thereof JSP CORPORATION (JP) 2016-04-12 US disclosed
US-20160053068-A1 EXPANDABLE COMPOSITE RESIN BEAD JSP CORPORATION (JP) 2016-02-25 US disclosed
US-20150105483-A1 EXPANDABLE COMPOSITE RESIN BEAD JSP CORPORATION (JP) 2015-04-16 US disclosed
EP-2860217-A1 Expandable composite resin bead JSP CORPORATION (JP) 2015-04-15 EP disclosed
US-20140221517-A1 EXPANDED COMPOSITE RESIN BEADS AND MOLDED ARTICLE THEREOF JSP CORPORATION (JP) 2014-08-07 US disclosed