SCHEMBL15914715

SCHEMBL15914715

CCCCCCOOC(OC(=O)O)C(CC)CCCC

nearest known ligand 0.38

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
PLA2G2C Q5R387 2/20 0.35
CA2 P00918 2/20 0.35
MAPK1 P28482 1/20 0.35
GPR84 Q9NQS5 5/20 0.34
NAAA Q02083 1/20 0.34
FFAR1 O14842 1/20 0.34
CES2 O00748 1/20 0.33
MAPT P10636 1/20 0.33
HCAR2 Q8TDS4 1/20 0.33
LCK P06239 1/20 0.33
PPARD Q03181 1/20 0.33
ZDHHC20 Q5W0Z9 1/20 0.33
ZDHHC2 Q9UIJ5 1/20 0.33
LMNA P02545 1/20 0.33
CA1 P00915 1/20 0.33
EPHX1 P07099 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4634760 0.98 CA2 (0.36) PLA2G2CCA2MAPK1GPR84NAAA
SCHEMBL3478364 0.94 CA2 (0.37) CA2MAPK1HCAR2CA1
SCHEMBL1581728 0.94 CA2 (0.37) CA2MAPK1HCAR2CA1
SCHEMBL15914714 0.90 PLA2G2C (0.39) PLA2G2CCA2MAPK1NAAACES2
SCHEMBL4634756 0.88 PLA2G2C (0.37) PLA2G2CCA2MAPK1NAAACES2
SCHEMBL1581727 0.83 CA2 (0.35) PLA2G2CCA2MAPK1CA1
SCHEMBL30595889 0.80 LMNA (0.37) NAAACES2HCAR2LMNAEPHX1
SCHEMBL165679 0.78 CA2 (0.40) CA2MAPK1CA1
SCHEMBL15661587 0.77 CA2 (0.35) CA2MAPK1MAPTCA1
SCHEMBL18241671 0.76 CTSK (0.33) CA2MAPK1CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9815956-B2 Expandable composite resin bead JSP CORPORATION (JP) 2017-11-14 US disclosed
EP-2860217-B1 EXPANDABLE COMPOSITE RESIN BEAD JSP CORP (JP) 2016-11-30 EP disclosed
US-9505898-B2 Expandable composite resin bead JSP CORPORATION (JP) 2016-11-29 US disclosed
US-9309398-B2 Expanded composite resin beads and molded article thereof JSP CORPORATION (JP) 2016-04-12 US disclosed
US-20160053068-A1 EXPANDABLE COMPOSITE RESIN BEAD JSP CORPORATION (JP) 2016-02-25 US disclosed
US-20150105483-A1 EXPANDABLE COMPOSITE RESIN BEAD JSP CORPORATION (JP) 2015-04-16 US disclosed
EP-2860217-A1 Expandable composite resin bead JSP CORPORATION (JP) 2015-04-15 EP disclosed
US-20140221517-A1 EXPANDED COMPOSITE RESIN BEADS AND MOLDED ARTICLE THEREOF JSP CORPORATION (JP) 2014-08-07 US disclosed