SCHEMBL15914957

SCHEMBL15914957

CCCC[Si](CCCC)(O[Si](CCCC)(CCCC)C1CCCC1)C1CCCC1

nearest known ligand 0.37

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.37
CNR2 P34972 10/20 0.37
CNR1 P21554 9/20 0.37
NAAA Q02083 3/20 0.32
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
NOS1 P29475 1/20 0.31
NOS2 P35228 1/20 0.31
SIGMAR1 Q99720 1/20 0.30
EPHX1 P07099 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18208004 0.98 CYP1A2 (0.40) CYP1A2CNR2CNR1NAAASIGMAR1
SCHEMBL15915362 0.86 CYP1A2 (0.30) CYP1A2
SCHEMBL15915192 0.84 CYP1A2 (0.33) CYP1A2CNR2CNR1EPHX1
SCHEMBL15915243 0.78 CYP1A2 (0.37) CYP1A2CNR2CNR1NAAAMEN1
SCHEMBL15915699 0.77 CYP1A2 (0.40) CYP1A2CNR2CNR1NAAAEPHX1
SCHEMBL15914633 0.77
SCHEMBL15915260 0.75 SHBG (0.32) CYP1A2
SCHEMBL15914934 0.75 CYP1A2 (0.41) CYP1A2CNR2CNR1NAAAMEN1
SCHEMBL15915019 0.73 CYP1A2 (0.44) CYP1A2CNR2CNR1NAAAMEN1
SCHEMBL3898468 0.73 CYP1A2 (0.44) CYP1A2CNR2CNR1NAAAMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9970103-B2 Film deposition material, sealing film using the same and use thereof TOSOH CORPORATION (JP) 2018-05-15 US disclosed
CN-103781937-B Filmogen, the diaphragm seal using the filmogen, and application thereof 东曹株式会社 2017-05-31 CN disclosed
US-20160326642-A1 FILM DEPOSITION MATERIAL, SEALING FILM USING THE SAME AND USE THEREOF TOSOH CORPORATION (JP) 2016-11-10 US disclosed
US-20140219903-A1 FILM DEPOSITION MATERIAL, SEALING FILM USING THE SAME AND USE THEREOF TOSOH CORPORATION (JP) 2014-08-07 US disclosed