Trifluoromethanesulfonic Acid

Trifluoromethanesulfonic Acid

SCHEMBL1593380

O=S(=O)(O)C(F)(F)F.SC(c1ccccc1)c1ccccc1

nearest known ligand 0.42

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SRC P12931 2/20 0.42
ALDH1A1 P00352 3/20 0.41
PTPN1 P18031 1/20 0.39
ACP1 P24666 1/20 0.38
PTPN7 P35236 1/20 0.38
PTPN12 Q05209 1/20 0.38
PTPN13 Q12923 1/20 0.38
SSU72 Q9NP77 1/20 0.38
LMNA P02545 3/20 0.37
MAPT P10636 2/20 0.37
KMT2A Q03164 2/20 0.37
NPSR1 Q6W5P4 2/20 0.37
KDM4E B2RXH2 1/20 0.37
GMNN O75496 1/20 0.37
POLB P06746 1/20 0.37
HPGD P15428 1/20 0.37
PMP22 Q01453 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
TSHR P16473 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1593675 0.84 ALDH1A1 (0.40) SRCALDH1A1PTPN1ACP1PTPN7
SCHEMBL1593154 0.83 ALDH1A1 (0.39) SRCALDH1A1PTPN1ACP1PTPN7
Trifluoromethanesulfonic Acid SCHEMBL3104597 0.81 SRC (0.40) SRCALDH1A1PTPN1ACP1PTPN7
Trifluoromethanesulfonic Acid SCHEMBL27525495 0.78 NR1I2 (0.49) SRCALDH1A1PTPN1ACP1PTPN7
Phenyl Ethanol SCHEMBL28419508 0.78 NR1I2 (0.49) SRCALDH1A1PTPN1LMNAMAPT
SCHEMBL29871269 0.78 TSHR (0.67) SRCALDH1A1LMNAPOLBTDP1
Trifluoromethanesulfonic Acid SCHEMBL28355288 0.77 LMNA (0.42) SRCALDH1A1LMNAMAPTKMT2A
Trifluoromethanesulfonic Acid SCHEMBL6923670 0.77 CA1 (0.50) SRCALDH1A1PTPN1POLBTSHR
Trifluoromethanesulfonic Acid SCHEMBL29587491 0.77 PTPN1 (0.42) SRCALDH1A1PTPN1POLBTSHR
Trifluoromethanesulfonic Acid SCHEMBL2058739 0.77 PTPN1 (0.42) SRCALDH1A1PTPN1POLBTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116836389-A Low-temperature-curable positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-10-03 CN claimed
EP-2469337-B1 Positive photosensitive resin composition, method for forming pattern, and electronic component HITACHI CHEM DUPONT MICROSYS (JP) 2014-01-22 EP claimed
EP-2469337-A1 Positive photosensitive resin composition, method for forming pattern, and electronic component Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2012-06-27 EP claimed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-12405198-B2 Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device RESONAC CORPORATION (JP) 2025-09-02 US disclosed
US-20240361697-A1 METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2024-10-31 US disclosed
US-20240329525-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-10-03 US disclosed
WO-2024161658-A1 AIRTIGHT STRUCTURE, METHOD FOR MANUFACTURING SAME, AND BASE RESIN COMPOSITION FOR MAINTAINING AIRTIGHTNESS 株式会社レゾナック 2024-08-08 WO disclosed
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 US disclosed
CN-116836389-B Low-temperature-curable positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2024-01-26 CN disclosed
CN-117280447-A Photosensitive resin composition selection method, pattern cured film production method, cured film, semiconductor device, and semiconductor device production method 株式会社力森诺科 2023-12-22 CN disclosed
EP-2469337-B1 Positive photosensitive resin composition, method for forming pattern, and electronic component HITACHI CHEM DUPONT MICROSYS (JP) 2014-01-22 EP disclosed
EP-2469337-A1 Positive photosensitive resin composition, method for forming pattern, and electronic component Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2012-06-27 EP disclosed
US-20110091818-A1 PROCESS FOR PRODUCING PHOTORESIST PATTERN SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2011-04-21 US disclosed
US-20100273112-A1 PROCESS FOR PRODUCING PHOTORESIST PATTERN SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2010-10-28 US disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
EP-1744213-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical DuPont Microsystems Ltd. (JP) 2007-01-17 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 SRC 3613/4885ALDH1A1 3316/4885PTPN1 3250/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.