⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12704723 | 0.89 | — | — | |
| SCHEMBL10993458 | 0.88 | — | — | |
| SCHEMBL12650082 | 0.87 | — | — | |
| SCHEMBL2000546 | 0.86 | CTSL (0.36) | — | |
| SCHEMBL13896968 | 0.83 | ALDH1A1 (0.35) | — | |
| SCHEMBL487051 | 0.79 | — | — | |
| SCHEMBL14947972 | 0.78 | — | — | |
| SCHEMBL9431801 | 0.77 | — | — | |
| SCHEMBL28428008 | 0.76 | — | — | |
| Hydrochloric Acid SCHEMBL11684723 | 0.76 | SLC1A3 (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2599814-B1 | COMPOUND, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMING RESIST PATTERN | MITSUBISHI GAS CHEMICAL CO (JP) | 2018-02-14 | — | — | EP | disclosed |
| US-9239517-B2 | Compound, radiation-sensitive composition and resist pattern formation method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2016-01-19 | — | — | US | disclosed |
| US-9239517-B2 | Compound, radiation-sensitive composition and resist pattern formation method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2016-01-19 | — | — | US | disclosed |
| US-8741538-B2 | Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2014-06-03 | — | — | US | disclosed |
| US-8741538-B2 | Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2014-06-03 | — | — | US | disclosed |
| US-8741538-B2 | Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2014-06-03 | — | — | US | disclosed |
| EP-1736485-B1 | POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO LTD (JP) | 2013-07-31 | — | — | EP | disclosed |
| EP-1736485-B1 | POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO LTD (JP) | 2013-07-31 | — | — | EP | disclosed |
| EP-2599814-A1 | COMPOUND, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMING RESIST PATTERN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2013-06-05 | — | — | EP | disclosed |
| US-20130122423-A1 | COMPOUND, RADIATION-SENSITIVE COMPOSITION AND RESIST PATTERN FORMATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2013-05-16 | — | — | US | disclosed |
| US-7700259-B2 | Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-04-20 | — | — | US | disclosed |
| US-7700259-B2 | Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-04-20 | — | — | US | disclosed |
| US-20090081580-A1 | COMPOUND, DISSOLUTION INHIBITOR, POSITIVE TYPE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD (JP) | 2009-03-26 | — | — | US | disclosed |
| US-20090081580-A1 | COMPOUND, DISSOLUTION INHIBITOR, POSITIVE TYPE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD (JP) | 2009-03-26 | — | — | US | disclosed |
| US-20070275328-A1 | Decomposable composition and method for using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-11-29 | — | — | US | disclosed |
| US-20070275328-A1 | Decomposable composition and method for using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-11-29 | — | — | US | disclosed |
| US-20070224520-A1 | Polymer Compound, Photoresist Composition Containing Such Polymer Compound, and Method for Forming Resist Pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-09-27 | — | — | US | disclosed |
| US-20070224520-A1 | Polymer Compound, Photoresist Composition Containing Such Polymer Compound, and Method for Forming Resist Pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-09-27 | — | — | US | disclosed |
| US-20070224520-A1 | Polymer Compound, Photoresist Composition Containing Such Polymer Compound, and Method for Forming Resist Pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-09-27 | — | — | US | disclosed |
| EP-1736485-A1 | POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-12-27 | — | — | EP | disclosed |