Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 11/20 | 1.00 |
| ▸ | HTT | P42858 | 2/20 | 1.00 |
| ▸ | KMT2A | Q03164 | 1/20 | 1.00 |
| ▸ | HSP90AA1 | P07900 | 2/20 | 0.94 |
| ▸ | RAD52 | P43351 | 2/20 | 0.94 |
| ▸ | PLA2G1B | P04054 | 1/20 | 0.61 |
| ▸ | ATG4B | Q9Y4P1 | 1/20 | 0.61 |
| ▸ | SLC22A1 | O15245 | 1/20 | 0.58 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL372738 | 1.00 | DNM1 (1.00) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL8381473 | 1.00 | DNM1 (1.00) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL8386909 | 1.00 | DNM1 (1.00) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL1172093 | 1.00 | DNM1 (1.00) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL8383501 | 1.00 | DNM1 (1.00) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL668301 | 1.00 | DNM1 (1.00) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL1171874 | 1.00 | DNM1 (1.00) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL6375709 | 1.00 | DNM1 (1.00) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL8386779 | 1.00 | DNM1 (1.00) | DNM1HTTKMT2AHSP90AA1RAD52 | |
| SCHEMBL37593 | 1.00 | DNM1 (1.00) | DNM1HTTKMT2AHSP90AA1RAD52 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11914295-B2 | Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230333472-A1 | THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-10-19 | — | — | US | disclosed |
| US-20230244149-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-08-03 | — | — | US | disclosed |
| CN-114728092-A | Edge block with improved odor performance | 西姆莱斯股份公司 | 2022-07-08 | — | — | CN | disclosed |
| CN-114728254-A | Polyurea microcapsules and liquid surfactant system containing the same | 西姆莱斯股份公司 | 2022-07-08 | — | — | CN | disclosed |
| CN-114364773-A | Aromatic oil mixture | 西姆莱斯股份公司 | 2022-04-15 | — | — | CN | disclosed |
| US-9315670-B2 | Composition for forming resist underlayer film and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-04-19 | — | — | US | disclosed |
| US-20140235796-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-08-21 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20230333472-A1 | THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS | RPS4X, SIK3, MLX | DNM1 4060/4885HTT 2857/4885KMT2A 1118/4885 |
| US-11914295-B2 | Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process | RPS4X, SIK3, MLX | DNM1 4060/4885HTT 2857/4885KMT2A 1118/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.