Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALOX15 | P16050 | 2/20 | 0.39 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.39 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.39 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.39 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.39 |
| ▸ | TSHR | P16473 | 2/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.39 |
| ▸ | CA1 | P00915 | 2/20 | 0.39 |
| ▸ | CA2 | P00918 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.37 |
| ▸ | HPGD | P15428 | 1/20 | 0.37 |
| ▸ | CASP1 | P29466 | 1/20 | 0.37 |
| ▸ | RECQL | P46063 | 1/20 | 0.37 |
| ▸ | NQO2 | P16083 | 1/20 | 0.36 |
| ▸ | CA4 | P22748 | 1/20 | 0.36 |
| ▸ | CA6 | P23280 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30343449 | 1.00 | ALOX15 (0.39) | ALOX15ALOX12HIF1AHSD17B10CYP1A2 | |
| SCHEMBL15998074 | 0.84 | PTGS1 (0.43) | ALOX15ALOX12HIF1AHSD17B10CYP1A2 | |
| SCHEMBL1597612 | 0.83 | CYP3A4 (0.55) | ALOX15ALOX12HIF1AHSD17B10CYP1A2 | |
| SCHEMBL735656 | 0.83 | CA1 (0.55) | ALOX15ALOX12HIF1AHSD17B10CYP1A2 | |
| SCHEMBL1596658 | 0.81 | GAA (0.37) | ALOX15ALOX12HIF1AHSD17B10CYP2C19 | |
| SCHEMBL4782428 | 0.79 | ESR1 (0.35) | ALOX15ALOX12HIF1AHSD17B10CYP1A2 | |
| SCHEMBL16788662 | 0.77 | CYP3A4 (0.34) | ALOX15ALOX12HIF1AHSD17B10CYP3A4 | |
| SCHEMBL18855315 | 0.74 | TTR (0.46) | ALOX15ALOX12HIF1AHSD17B10CYP1A2 | |
| SCHEMBL1597804 | 0.74 | CYP2C9 (0.61) | ALOX15ALOX12HIF1AHSD17B10CYP1A2 | |
| SCHEMBL30343456 | 0.74 | CYP2C9 (0.61) | ALOX15ALOX12HIF1AHSD17B10CYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12187843-B2 | Liquid compression molding or encapsulant compositions | HENKEL AG & CO. KGAA (DE) | 2025-01-07 | — | — | US | disclosed |
| EP-3230339-B1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES (JP) | 2022-03-23 | — | — | EP | disclosed |
| US-20210163674-A1 | LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS | Henkel IP & Holding GmbH (DE) | 2021-06-03 | — | — | US | disclosed |
| US-10851201-B2 | Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering | HUNTSMAN INTERNATIONAL LLC (US) | 2020-12-01 | — | — | US | disclosed |
| EP-3298061-B1 | A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING | HUNTSMAN ADVANCED MAT LICENSING (SWITZERLAND) GMBH (CH) | 2020-09-09 | — | — | EP | disclosed |
| US-20180142058-A1 | A Curing Agent For Thermosetting Epoxy Resins, and a Process for the Preparation of Insulation Systems for Electrical Engineering | HUNTSMAN INTERNATIONAL LLC (US) | 2018-05-24 | — | — | US | disclosed |
| US-20170362376-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2017-12-21 | — | — | US | disclosed |
| EP-3230339-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | Toray Industries, Inc. (JP) | 2017-10-18 | — | — | EP | disclosed |
| EP-2489689-B1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | NIPPON SODA CO (JP) | 2017-05-10 | — | — | EP | disclosed |
| CN-102455597-B | X-ray sensitive resin composition, cured film and forming method thereof, liquid crystal display cells array base palte and forming method thereof | JSR株式会社 | 2016-06-29 | — | — | CN | disclosed |
| EP-1520867-A2 | Curatives for epoxy resin, curing accelerator, and epoxy resin composition | NIPPON SODA CO., LTD. (JP) | 2005-04-06 | — | — | EP | disclosed |
| EP-0949286-B1 | CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION | NIPPON SODA CO (JP) | 2005-03-02 | — | — | EP | disclosed |
| US-20040106764-A1 | Curatives for epoxy resin, curing accelerator, and epoxy resin composition | SUZUKI HIROSHI (JP) | 2004-06-03 | — | — | US | disclosed |
| US-6727325-B1 | HEAT RESISTANCE, STABILITY, POT LIFE; ONE-PACK MIXTURES; LOW TEMPERATURE CURABILITY | NIPPON SODA CO. LTD. (JP) | 2004-04-27 | — | — | US | disclosed |
| US-20020193528-A1 | Molecular compound comprising polymer having hydrogen bond as component compound | NIPPON SODA CO., LTD. (JP) | 2002-12-19 | — | — | US | disclosed |
| EP-1241230-A1 | MOLECULAR COMPOUND COMPRISING POLYMER HAVING HYDROGEN BOND AS COMPONENT COMPOUND | NIPPON SODA CO., LTD. (JP) | 2002-09-18 | — | — | EP | disclosed |
| EP-0949286-A1 | CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION | NIPPON SODA CO., LTD. (JP) | 1999-10-13 | — | — | EP | disclosed |
| EP-0589044-B1 | NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST | NIPPON SODA CO (JP) | 1996-10-23 | — | — | EP | disclosed |
| US-5364977-A | Chemical stabilization and powder processing | NIPPON SODA CO., LTD. (JP) | 1994-11-15 | — | — | US | disclosed |
| EP-0589044-A1 | NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST | NIPPON SODA CO., LTD. (JP) | 1994-03-30 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20020193528-A1 | Molecular compound comprising polymer having hydrogen bond as component compound | PIEZO1, PARN, PARG | ALOX15 2840/4885ALOX12 2116/4885HIF1A 553/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.