SCHEMBL1597576

SCHEMBL1597576

CC(C)(C)c1cc(C(c2ccc(O)c(C(C)(C)C)c2)C(c2ccc(O)c(C(C)(C)C)c2)c2ccc(O)c(C(C)(C)C)c2)ccc1O

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.59
ALOX15 P16050 5/20 0.59
HSD17B10 Q99714 2/20 0.59
LMNA P02545 2/20 0.59
NR1I2 O75469 1/20 0.59
CYP2C9 P11712 1/20 0.59
MIF P14174 1/20 0.59
TYR P14679 1/20 0.59
HTT P42858 1/20 0.59
NFE2L2 Q16236 1/20 0.59
SMN1; SMN2 Q16637 2/20 0.52
KDM4E B2RXH2 1/20 0.52
CYP1A2 P05177 1/20 0.52
MAPT P10636 1/20 0.52
ATP2A2 P16615 1/20 0.52
ATP2A3 Q93084 1/20 0.52
TDP1 Q9NUW8 3/20 0.46
TSHR P16473 2/20 0.46
HSP90AA1 P07900 4/20 0.42
HSP90AB1 P08238 4/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30343447 1.00 ALDH1A1 (0.59) ALDH1A1ALOX15HSD17B10LMNANR1I2
SCHEMBL31388034 0.85 ALDH1A1 (0.57) ALDH1A1ALOX15HSD17B10LMNANR1I2
SCHEMBL5164240 0.85 ALDH1A1 (0.57) ALDH1A1ALOX15HSD17B10LMNANR1I2
SCHEMBL1596482 0.85 ALDH1A1 (0.57) ALDH1A1ALOX15HSD17B10LMNANR1I2
SCHEMBL3287976 0.85 ALDH1A1 (0.57) ALDH1A1ALOX15HSD17B10LMNANR1I2
SCHEMBL28973724 0.84 ALDH1A1 (0.47) ALDH1A1ALOX15HSD17B10LMNANR1I2
SCHEMBL11588725 0.83 ALDH1A1 (0.55) ALDH1A1ALOX15HSD17B10LMNANR1I2
SCHEMBL28937714 0.83 ALDH1A1 (0.55) ALDH1A1ALOX15HSD17B10LMNANR1I2
SCHEMBL11590553 0.82 ALDH1A1 (0.53) ALDH1A1ALOX15HSD17B10LMNANR1I2
SCHEMBL1597262 0.82 ALDH1A1 (0.53) ALDH1A1ALOX15HSD17B10LMNANR1I2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12187843-B2 Liquid compression molding or encapsulant compositions HENKEL AG & CO. KGAA (DE) 2025-01-07 US disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20210163674-A1 LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS Henkel IP & Holding GmbH (DE) 2021-06-03 US disclosed
US-10851201-B2 Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering HUNTSMAN INTERNATIONAL LLC (US) 2020-12-01 US disclosed
EP-3298061-B1 A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING HUNTSMAN ADVANCED MAT LICENSING (SWITZERLAND) GMBH (CH) 2020-09-09 EP disclosed
US-20180142058-A1 A Curing Agent For Thermosetting Epoxy Resins, and a Process for the Preparation of Insulation Systems for Electrical Engineering HUNTSMAN INTERNATIONAL LLC (US) 2018-05-24 US disclosed
US-20170362376-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2017-12-21 US disclosed
EP-3230339-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL Toray Industries, Inc. (JP) 2017-10-18 EP disclosed
EP-3031611-B1 THERMAL RECORDING MATERIAL MITSUBISHI PAPER MILLS LTD (JP) 2017-09-27 EP disclosed
EP-2489689-B1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NIPPON SODA CO (JP) 2017-05-10 EP disclosed
US-20050030366-A1 Thermal recording material MITSUBISHI PAPER MILLS LTD. (JP) 2005-02-10 US disclosed
US-20040106764-A1 Curatives for epoxy resin, curing accelerator, and epoxy resin composition SUZUKI HIROSHI (JP) 2004-06-03 US disclosed
US-6727325-B1 HEAT RESISTANCE, STABILITY, POT LIFE; ONE-PACK MIXTURES; LOW TEMPERATURE CURABILITY NIPPON SODA CO. LTD. (JP) 2004-04-27 US disclosed
US-20020193528-A1 Molecular compound comprising polymer having hydrogen bond as component compound NIPPON SODA CO., LTD. (JP) 2002-12-19 US disclosed
EP-1241230-A1 MOLECULAR COMPOUND COMPRISING POLYMER HAVING HYDROGEN BOND AS COMPONENT COMPOUND NIPPON SODA CO., LTD. (JP) 2002-09-18 EP disclosed
US-6147169-A LOW TEMPERATURE CURING MIXTURE OF REACTIVE BASE RESIN AND A CLATHRATE COMPRISING A TETRAKISPHENOL HOSTING A CURING AGENT OR CURING CATALYST; STORAGE STABILITY, CORROSION RESISTANCE, ADHESION KANSAI PAINT CO., LTD. (JP) 2000-11-14 US disclosed
EP-0949286-A1 CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION NIPPON SODA CO., LTD. (JP) 1999-10-13 EP disclosed
EP-0589044-B1 NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST NIPPON SODA CO (JP) 1996-10-23 EP disclosed
US-5364977-A Chemical stabilization and powder processing NIPPON SODA CO., LTD. (JP) 1994-11-15 US disclosed
EP-0589044-A1 NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST NIPPON SODA CO., LTD. (JP) 1994-03-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20020193528-A1 Molecular compound comprising polymer having hydrogen bond as component compound PIEZO1, PARN, PARG ALDH1A1 1999/4885ALOX15 2840/4885HSD17B10 3191/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.