SCHEMBL1608798

SCHEMBL1608798

CCCCCCCCCCCCCCCCCC(=O)O[Ti](OC(=O)CCCCCCCCCCCCCCCCC)(OC(=O)CCCCCCCCCCCCCCCCC)OC(=O)CCCCCCCCCCCCCCCCC

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.59
LMNA P02545 2/20 0.55
PAM P19021 2/20 0.53
CES2 O00748 3/20 0.52
CES1 P23141 3/20 0.52
MAPT P10636 1/20 0.52
MAPK1 P28482 1/20 0.52
PPARG P37231 6/20 0.50
PPARD Q03181 6/20 0.50
PPARA Q07869 6/20 0.50
TSHR P16473 5/20 0.50
GPR84 Q9NQS5 5/20 0.50
HDAC11 Q96DB2 5/20 0.50
ALDH1A1 P00352 2/20 0.50
TLR2 O60603 2/20 0.50
TDP1 Q9NUW8 2/20 0.50
FABP4 P15090 2/20 0.50
PTPN1 P18031 2/20 0.50
SLC22A6 Q4U2R8 1/20 0.50
SLC22A8 Q8TCC7 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16394633 1.00 DGKA (0.59) DGKALMNAPAMCES2CES1
SCHEMBL19177142 1.00 DGKA (0.59) DGKALMNAPAMCES2CES1
SCHEMBL7938717 1.00 DGKA (0.59) DGKALMNAPAMCES2CES1
SCHEMBL10773440 0.91 CES1 (0.48) DGKALMNAPAMCES2CES1
SCHEMBL665611 0.89 DGKA (0.52) DGKALMNAPAMPPARGPPARD
SCHEMBL4301631 0.89 TERT (0.59) DGKALMNAMAPTPPARGPPARD
SCHEMBL2162619 0.89 TERT (0.59) DGKALMNAMAPTPPARGPPARD
SCHEMBL241828 0.86 DGKA (0.55) DGKALMNAPAMCES2CES1
SCHEMBL9466093 0.86 DGKA (0.55) DGKALMNAPAMCES2CES1
SCHEMBL1634749 0.85 LMNA (0.59) DGKALMNAPAMCES2CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 206 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024032093-A1 HYDROPHOBIC SOLID-STATE ELECTROLYTE PREPARED BY USING DRY METHOD, AS WELL AS PREPARATION METHOD THEREFOR, AND USE THEREOF 宜宾南木纳米科技有限公司 2024-02-15 WO claimed
CN-111364112-A Deodorizing fiber 南亚塑胶工业股份有限公司 2020-07-03 CN claimed
EP-0320826-B1 RUBBER-COATED GASKET NICHIAS CORPORATION (JP) 1993-05-19 EP claimed
US-4956226-A METAL SHEET SANDWICHED BETWEEN LAYERS OF NITRILE RUBBER CONTAINING A FLAKY FILLER AND AN ALKYL TITANATE NICHIAS CORPORATION (JP) 1990-09-11 US claimed
EP-0320826-A2 Rubber-coated gasket NICHIAS CORPORATION (JP) 1989-06-21 EP claimed
EP-0059348-B1 AN ELECTROCONDUCTIVE PASTE TO BE BAKED ON CERAMIC BODIES TO PROVIDE CAPACITORS, VARISTORS OR THE LIKE Taiyo Yuden Co., Ltd. (JP) 1985-09-04 EP claimed
US-4460622-A COMPOSED OF ZINC AND ORGANOTITANIUM COMPOUND TAIYO YUDEN CO., LTD. (JP) 1984-07-17 US claimed
EP-0059348-A1 An electroconductive paste to be baked on ceramic bodies to provide capacitors, varistors or the like Taiyo Yuden Co., Ltd. (JP) 1982-09-08 EP claimed
US-20250320392-A1 MULTILAYER FILM USING SOLVENTLESS ADHESIVE, METHOD FOR PRODUCING SAME, AND PACKAGING CONTAINER TOYO SEIKAN CO., LTD. (JP) 2025-10-16 US disclosed
US-12378454-B2 Adhesive, laminate, and packaging material DIC CORPORATION (JP) 2025-08-05 US disclosed
US-12338376-B2 Adhesive, laminated film, and production method for laminated film DIC CORPORATION (JP) 2025-06-24 US disclosed
WO-2025121146-A1 METHOD FOR PRODUCING POLYURETHANE POLYISOCYANATE DIC株式会社 2025-06-12 WO disclosed
EP-4559678-A1 METHOD FOR PRODUCING MULTILAYER FILM, AND MULTILAYER FILM Toyo Seikan Co., Ltd. (JP) 2025-05-28 EP disclosed
WO-2025084144-A1 TWO-COMPONENT CURABLE ADHESIVE, LAMINATED BODY, AND PACKING MATERIAL DIC株式会社 2025-04-24 WO disclosed
EP-0074573-A1 Method for making carbon/metal composite pretreating the carbon with tetraisopropyltitanate TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) 1983-03-23 EP disclosed
EP-0064211-A2 A method of forming electrodes on ceramic bodies to provide electronic components Taiyo Yuden Co., Ltd. (JP) 1982-11-10 EP disclosed
EP-0059852-A1 An electroconductive paste to be baked on ceramic bodies to provide capacitors, varistors or the like Taiyo Yuden Co., Ltd. (JP) 1982-09-15 EP disclosed
EP-0059852-A1 An electroconductive paste to be baked on ceramic bodies to provide capacitors, varistors or the like Taiyo Yuden Co., Ltd. (JP) 1982-09-15 EP disclosed
EP-0059348-A1 An electroconductive paste to be baked on ceramic bodies to provide capacitors, varistors or the like Taiyo Yuden Co., Ltd. (JP) 1982-09-08 EP disclosed
EP-0059348-A1 An electroconductive paste to be baked on ceramic bodies to provide capacitors, varistors or the like Taiyo Yuden Co., Ltd. (JP) 1982-09-08 EP disclosed