SCHEMBL1608803

SCHEMBL1608803

CCCCCO[Si](C)(CCCC)OCCCCC

nearest known ligand 0.33

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 8/20 0.33
CA2 P00918 8/20 0.33
CA9 Q16790 8/20 0.33
CA12 O43570 3/20 0.33
THRB P10828 2/20 0.33
ALDH1A1 P00352 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
TSHR P16473 1/20 0.33
MEN1 O00255 1/20 0.33
HTT P42858 1/20 0.33
KMT2A Q03164 1/20 0.33
MAPT P10636 1/20 0.33
LPAR3 Q9UBY5 6/20 0.32
LPAR2 Q9HBW0 5/20 0.32
LPAR1 Q92633 2/20 0.32
CA3 P07451 2/20 0.32
CA4 P22748 2/20 0.32
CA6 P23280 2/20 0.32
CA5A P35218 2/20 0.32
CA7 P43166 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28424236 0.93 THRB (0.38) CA1CA2CA9CA12THRB
SCHEMBL17209128 0.92 THRB (0.35) CA1CA2CA9CA12THRB
SCHEMBL28805966 0.92 ADRB2 (0.38) CA1CA2ALDH1A1TSHR
SCHEMBL19809375 0.90 CA1 (0.33) CA1CA2CA9CA12THRB
SCHEMBL28518202 0.89 LMNA (0.33) CA1CA2CA9CA12THRB
SCHEMBL11332073 0.88 THRB (0.38) CA1CA2CA9CA12THRB
SCHEMBL27904666 0.88 THRB (0.38) CA1CA2CA9CA12THRB
SCHEMBL705364 0.87 ADRB2 (0.38) CA1CA2ALDH1A1TSHR
SCHEMBL1609048 0.87 ADRB2 (0.32) TSHR
SCHEMBL706695 0.87 ADRB2 (0.38) CA1CA2ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116075368-B Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2024-06-11 CN disclosed
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
CN-108389512-B Laminate, flexible device, and method for producing laminate 东京应化工业株式会社 2022-04-15 CN disclosed
CN-108250754-B Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2022-01-25 CN disclosed
CN-107709464-B Silicon-containing resin composition 东京应化工业株式会社 2021-09-28 CN disclosed
CN-112334795-A Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2021-02-05 CN disclosed
CN-107429059-B Energy-sensitive resin composition 东京应化工业株式会社 2020-10-23 CN disclosed
CN-107922733-B Polyimide precursor composition 东京应化工业株式会社 2020-09-11 CN disclosed
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
EP-3275940-B1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-12-18 EP disclosed
US-8475690-B2 Diffusing agent composition, method of forming impurity diffusion layer, and solar battery TOKYO OHKA KOGYO CO., LTD. (JP) 2013-07-02 US disclosed
US-20130109123-A1 DIFFUSING AGENT COMPOSITION AND METHOD OF FORMING IMPURITY DIFFUSION LAYER TOKYO OHKA KOGYO CO., LTD. (JP) 2013-05-02 US disclosed
EP-2573800-A1 DIFFUSION AGENT COMPOSITION, METHOD OF FORMING AN IMPURITY DIFFUSION LAYER, AND SOLAR CELL Tokyo Ohka Kogyo Co., Ltd. (JP) 2013-03-27 EP disclosed
US-20130061922-A1 DIFFUSION AGENT COMPOSITION, METHOD OF FORMING IMPURITY DIFFUSION LAYER, AND SOLAR CELL TOKYO OHKA KOGYO CO., LTD. (JP) 2013-03-14 US disclosed
EP-2472655-A1 Negative electrode base member Tokyo Ohka Kogyo Co., Ltd. (JP) 2012-07-04 EP disclosed
US-20110079262-A1 DIFFUSING AGENT COMPOSITION, METHOD OF FORMING IMPURITY DIFFUSION LAYER, AND SOLAR BATTERY TOKYO OHKA KOGYO CO., LTD. (JP) 2011-04-07 US disclosed
US-20110017291-A1 DIFFUSING AGENT COMPOSITION FOR INK-JET, AND METHOD FOR PRODUCTION OF ELECTRODE OR SOLAR BATTERY USING THE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2011-01-27 US disclosed
US-20100119939-A1 NEGATIVE ELECTRODE BASE MEMBER TOKYO OHKA KOGYO CO., LTD. (JP) 2010-05-13 US disclosed
EP-2131423-A1 NEGATIVE ELECTRODE BASE MEMBER Tokyo Ohka Kogyo Co., Ltd. (JP) 2009-12-09 EP disclosed
US-20080318165-A1 Composition For Forming Antireflective Film And Wiring Forming Method Using Same TOKYO OHKA KOGYO CO., LTD. (JP) 2008-12-25 US disclosed