Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3481696 | 0.86 | DNM1 (0.32) | — | |
| SCHEMBL28079113 | 0.84 | OPRM1 (0.39) | — | |
| SCHEMBL28898369 | 0.84 | OPRM1 (0.34) | — | |
| SCHEMBL6303527 | 0.82 | OPRM1 (0.38) | — | |
| SCHEMBL28078988 | 0.82 | OPRM1 (0.38) | — | |
| SCHEMBL6297161 | 0.82 | OPRM1 (0.38) | — | |
| SCHEMBL29126580 | 0.82 | OPRM1 (0.38) | — | |
| SCHEMBL28084759 | 0.82 | OPRM1 (0.38) | — | |
| SCHEMBL29126603 | 0.82 | OPRM1 (0.38) | — | |
| SCHEMBL1313968 | 0.82 | HSD17B10 (0.32) | HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 105 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240270908-A1 | POLYSILSESQUIOXANE COMPOSITION AND CURED PRODUCT | NIPPON SHOKUBAI CO., LTD. (JP) | 2024-08-15 | — | — | US | disclosed |
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| CN-117043276-A | Polysilsesquioxane composition and cured product | 株式会社日本触媒 | 2023-11-10 | — | — | CN | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| WO-2022202800-A1 | POLYSILSESQUIOXANE COMPOSITION AND CURED PRODUCT | 株式会社日本触媒 | 2022-09-29 | — | — | WO | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| US-20220220338-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| US-20220213348-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-07 | — | — | US | disclosed |
| CN-1455933-A | Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof | JSR CORP (JP) | 2003-11-12 | — | — | CN | disclosed |
| US-6548582-B2 | Inorganic particles, binder resin and at least one plasticizer selected from dialk(en)yl ester of alkanedioic acids, or alkoxyalkylylated esters therof, or 1,2-propanediol 1-alkanoates; flexibility | JSR CORPORATION (JP) | 2003-04-15 | — | — | US | disclosed |
| EP-0877003-B1 | Glass paste composition | JSR CORP (JP) | 2002-09-18 | — | — | EP | disclosed |
| US-20020035183-A1 | Inorgaic particle-containing composition, transfer film comprising the same and plasma display panel production process | JSR CORPORATION (JP) | 2002-03-21 | — | — | US | disclosed |
| US-20020016401-A1 | Inorganic particle-containing composition, transfer film comprising the same and plasma display panel production process | JSR CORPORATION (JP) | 2002-02-07 | — | — | US | disclosed |
| US-6339118-B1 | FOR FORMING BARRIER, ELECTRODE, RESISTOR, DIELECTRIC LAYER, PHOSPHOR, COLOR FILTER OR BLACK MATRIX OF PLASMA DISPLAY PANEL | JSR CORPORATION (JP) | 2002-01-15 | — | — | US | disclosed |
| EP-1003199-A2 | Inorganic particle-containing composition, transfer film comprising the same and plasma display panel production process | JSR Corporation (JP) | 2000-05-24 | — | — | EP | disclosed |
| US-6046121-A | MIXTURE COMPRISING GLASS POWDER, HYDROPHILIC ACRYLATE POLYMER BINDER RESIN IN A NONAQUEOUS SOLVENT HAVING BOILING POINT BETWEEN 100 AND 200 DEGREES C., AND A LOW VAPOR PRESSURE | JSR CORPORATION (JP) | 2000-04-04 | — | — | US | disclosed |
| EP-0987228-A2 | Glass paste composition, and transfer film and plasma display panel comprising the same | JSR Corporation (JP) | 2000-03-22 | — | — | EP | disclosed |
| EP-0877003-A2 | Glass paste composition | JSR Corporation (JP) | 1998-11-11 | — | — | EP | disclosed |