Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL277640 | 0.84 | THRB (0.42) | THRBLMNA | |
| SCHEMBL27617519 | 0.80 | — | — | |
| SCHEMBL23581082 | 0.79 | THRB (0.38) | THRBLMNA | |
| SCHEMBL3985906 | 0.77 | THRB (0.36) | THRBLMNA | |
| SCHEMBL3920740 | 0.76 | ALDH1A1 (0.33) | THRBLMNA | |
| SCHEMBL1608795 | 0.76 | — | — | |
| SCHEMBL854693 | 0.75 | THRB (0.44) | THRBLMNA | |
| SCHEMBL14633846 | 0.73 | THRB (0.33) | THRBLMNA | |
| SCHEMBL29195105 | 0.73 | HSD17B10 (0.34) | THRBLMNA | |
| SCHEMBL15414786 | 0.73 | ALDH1A1 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 113 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115491002-B | PET composite board and preparation method thereof | 深圳力越新材料有限公司 | 2023-10-27 | — | — | CN | claimed |
| CN-113637173-B | Modified sulfydryl-containing liquid silicone resin, nontoxic, colorless and odorless photocuring liquid silicone rubber, and preparation methods and applications thereof | 深圳先进技术研究院 | 2022-12-20 | — | — | CN | claimed |
| CN-113637173-A | Modified sulfydryl-containing liquid silicone resin, nontoxic, colorless and odorless photocuring liquid silicone rubber, and preparation method and application thereof | 深圳先进技术研究院 | 2021-11-12 | — | — | CN | claimed |
| CN-118599120-B | Method for preparing high-quality dimethyl silicone oil | 江西蓝星星火有机硅有限公司 | 2026-05-15 | — | — | CN | disclosed |
| CN-118599120-A | Method for preparing high-quality dimethyl silicone oil | 江西蓝星星火有机硅有限公司 | 2024-09-06 | — | — | CN | disclosed |
| CN-116075368-B | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2024-06-11 | — | — | CN | disclosed |
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| CN-115491002-B | PET composite board and preparation method thereof | 深圳力越新材料有限公司 | 2023-10-27 | — | — | CN | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| CN-116075368-A | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2023-05-05 | — | — | CN | disclosed |
| US-20060220253-A1 | Porous film, composition and manufacturing method, interlayer dielectric film, and semiconductor device | HAMADA YOSHITAKA | 2006-10-05 | — | — | US | disclosed |
| US-7084505-B2 | Porous film, composition and manufacturing method, interlayer dielectric film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2006-08-01 | — | — | US | disclosed |
| US-20060141693-A1 | Semiconductor multilayer interconnection forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-29 | — | — | US | disclosed |
| EP-1566836-A1 | SEMICONDUCTOR MULTILAYER INTERCONNECTION FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-08-24 | — | — | EP | disclosed |
| US-20050112383-A1 | Undercoating layer material for lithography and wiring forming method using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-05-26 | — | — | US | disclosed |
| US-20050074695-A1 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-07 | — | — | US | disclosed |
| US-20040188846-A1 | Porous film, composition and manufacturing method, interlayer dielectric film, and semiconductor device | PANASONIC CORPORATION (JP) | 2004-09-30 | — | — | US | disclosed |
| US-20040121937-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-06-24 | — | — | US | disclosed |
| US-4831091-A | USING A COORDINATION CATALYST CONTAINING A SILANETRIOL OR -DIOL AS WELL AS AN AROMATIC ESTSER; ODORLESS; STEREOSPECIFIC; PARTICLE SIZES | CHISSO CORPORATION (JP) | 1989-05-16 | — | — | US | disclosed |