Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL907240 | 0.92 | CA12 (0.33) | — | |
| SCHEMBL9763753 | 0.88 | ALDH1A1 (0.35) | ALDH1A1 | |
| SCHEMBL26660021 | 0.86 | ALDH1A1 (0.30) | ALDH1A1 | |
| SCHEMBL169489 | 0.84 | — | — | |
| SCHEMBL1615427 | 0.84 | ALDH1A1 (0.33) | ALDH1A1 | |
| SCHEMBL15796949 | 0.83 | — | — | |
| SCHEMBL10339029 | 0.83 | — | — | |
| SCHEMBL19775776 | 0.81 | LMNA (0.32) | — | |
| SCHEMBL26660041 | 0.81 | — | — | |
| SCHEMBL26660049 | 0.79 | LMNA (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3567083-A1 | INSULATING AND HEAT-RADIATING COATING COMPOSITION, AND INSULATING AND HEAT-RADIATING PRODUCT IMPLEMENTED THEREWITH | Amosense Co.,Ltd (KR) | 2019-11-13 | — | — | EP | claimed |
| JP-3086761-A | — | — | None | — | — | JP | disclosed |
| US-12139640-B2 | Insulating and heat-radiating coating composition, and insulating and heat-radiating product implemented therewith | AMOSENSE CO., LTD. (KR) | 2024-11-12 | — | — | US | disclosed |
| US-11805625-B2 | Insulating heat dissipation coating composition and insulating heat dissipation unit formed using the same | AMOGREENTECH CO., LTD. (KR) | 2023-10-31 | — | — | US | disclosed |
| US-11739284-B2 | Composite material | NISSHINBO HOLDINGS INC. (JP) | 2023-08-29 | — | — | US | disclosed |
| CN-114787248-A | Composite material | 日清纺控股株式会社 | 2022-07-22 | — | — | CN | disclosed |
| EP-3567083-B1 | INSULATING AND HEAT-RADIATING COATING COMPOSITION, AND INSULATING AND HEAT-RADIATING PRODUCT IMPLEMENTED THEREWITH | AMOSENSE CO LTD (KR) | 2022-01-26 | — | — | EP | disclosed |
| US-20210284850-A1 | INSULATING AND HEAT-RADIATING COATING COMPOSITION, AND INSULATING AND HEAT-RADIATING PRODUCT IMPLEMENTED THEREWITH | AMOSENSE Co.,Ltd (KR) | 2021-09-16 | — | — | US | disclosed |
| US-20200154608-A1 | INSULATING HEAT DISSIPATION COATING COMPOSITION AND INSULATING HEAT DISSIPATION UNIT FORMED USING THE SAME | AMOGREENTECH CO., LTD. (KR) | 2020-05-14 | — | — | US | disclosed |
| EP-3567083-A1 | INSULATING AND HEAT-RADIATING COATING COMPOSITION, AND INSULATING AND HEAT-RADIATING PRODUCT IMPLEMENTED THEREWITH | Amosense Co.,Ltd (KR) | 2019-11-13 | — | — | EP | disclosed |
| EP-1408097-A1 | HEAT−EXPANDABLE MICROSPHERE AND PROCESS FOR PRODUCING THE SAME | Kureha Chemical Industry Co., Ltd. (JP) | 2004-04-14 | — | — | EP | disclosed |
| EP-1189910-B1 | PROCESS FOR MANUFACTURING ACRYLAMIDOALKYLALKOXYSILANES | CROMPTON CORP (US) | 2003-08-27 | — | — | EP | disclosed |
| EP-1189910-A1 | PROCESS FOR MANUFACTURING ACRYLAMIDOALKYLALKOXYSILANES | Crompton Corporation (US) | 2002-03-27 | — | — | EP | disclosed |
| US-6204403-B1 | REACTING AN AMINOAALKYLALKOXYSILANE WITH ACRYLIC ESTER | CROMPTON CORPORATION | 2001-03-20 | — | — | US | disclosed |
| WO-2000075148-A1 | PROCESS FOR MANUFACTURING ACRYLAMIDOALKYLALKOXYSILANES | CROMPTON CORPORATION (US) | 2000-12-14 | — | — | WO | disclosed |
| US-5153068-A | Discoloration inhibition | SEKISUI FINE CHEMICAL CO., LTD. (JP) | 1992-10-06 | — | — | US | disclosed |
| US-5075459-A | Organosilicon compound | TOSHIBA SILICONE CO., LTD. (JP) | 1991-12-24 | — | — | US | disclosed |
| JP-H0386761-A | PHOTOSENSITIVE MATERIAL AND RESIN-SEALED SEMICONDUCTOR DEVICE | TOSHIBA CORP | 1991-04-11 | — | — | JP | disclosed |
| US-4990641-A | Crosslinking agent, modifier for composites | TOSHIBA SILICONE CO., LTD. (JP) | 1991-02-05 | — | — | US | disclosed |
| US-4927951-A | (METH)ACRYLAMIDE GROUP CONTAINING SILOXANES | TOSHIBA SILICONE CO., LTD. (JP) | 1990-05-22 | — | — | US | disclosed |