⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6447689 | 1.00 | — | — | |
| SCHEMBL14645640 | 1.00 | — | — | |
| SCHEMBL2567991 | 1.00 | — | — | |
| SCHEMBL16793282 | 1.00 | — | — | |
| SCHEMBL9233111 | 1.00 | — | — | |
| SCHEMBL3804333 | 0.94 | — | — | |
| SCHEMBL707236 | 0.94 | — | — | |
| SCHEMBL400341 | 0.80 | — | — | |
| SCHEMBL25173757 | 0.78 | TSHR (0.44) | — | |
| SCHEMBL15965319 | 0.78 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12624248-B2 | Curable formulations for forming low-k dielectric silicon-containing films using polycarbosilazane | L'AIR LIQUIDE, SOCIETÉ ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCÉDÉS GEORGES CLAUDE (FR) | 2026-05-12 | — | — | US | claimed |
| CN-115038741-B | Curable formulations for forming low k dielectric silicon-containing films using polycarbosilazanes | 乔治洛德方法研究和开发液化空气有限公司 | 2024-04-02 | — | — | CN | claimed |
| US-20230095074-A1 | CURABLE FORMULATIONS FOR FORMING LOW-k DIELECTRIC SILICON-CONTAINING FILMS USING POLYCARBOSILAZANE | AIR LIQUIDE (FR) | 2023-03-30 | — | — | US | claimed |
| US-11499014-B2 | Cureable formulations for forming low-k dielectric silicon-containing films using polycarbosilazane | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude (FR) | 2022-11-15 | — | — | US | claimed |
| EP-4085091-A1 | CURABLE FORMULATIONS FOR FORMING LOW-K DIELECTRIC SILICON-CONTAINING FILMS USING POLYCARBOSILAZANE | L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE (FR) | 2022-11-09 | — | — | EP | claimed |
| CN-115038741-A | Curable formulations for forming low-k dielectric silicon-containing films using polycarbosilazanes | 乔治洛德方法研究和开发液化空气有限公司 | 2022-09-09 | — | — | CN | claimed |
| US-12624248-B2 | Curable formulations for forming low-k dielectric silicon-containing films using polycarbosilazane | L'AIR LIQUIDE, SOCIETÉ ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCÉDÉS GEORGES CLAUDE (FR) | 2026-05-12 | — | — | US | disclosed |
| CN-115038741-B | Curable formulations for forming low k dielectric silicon-containing films using polycarbosilazanes | 乔治洛德方法研究和开发液化空气有限公司 | 2024-04-02 | — | — | CN | disclosed |
| US-20230095074-A1 | CURABLE FORMULATIONS FOR FORMING LOW-k DIELECTRIC SILICON-CONTAINING FILMS USING POLYCARBOSILAZANE | AIR LIQUIDE (FR) | 2023-03-30 | — | — | US | disclosed |
| US-11499014-B2 | Cureable formulations for forming low-k dielectric silicon-containing films using polycarbosilazane | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude (FR) | 2022-11-15 | — | — | US | disclosed |
| EP-4085091-A1 | CURABLE FORMULATIONS FOR FORMING LOW-K DIELECTRIC SILICON-CONTAINING FILMS USING POLYCARBOSILAZANE | L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE (FR) | 2022-11-09 | — | — | EP | disclosed |
| US-20210198429-A1 | CUREABLE FORMULATIONS FOR FORMING LOW-k DIELECTRIC SILICON-CONTAINING FILMS USING POLYCARBOSILAZANE | AMERICAN AIR LIQUIDE, INC. | 2021-07-01 | — | — | US | disclosed |
| CN-108695255-A | Manufacture the method and IC apparatus of IC apparatus | 三星电子株式会社 | 2018-10-23 | — | — | CN | disclosed |
| US-9343293-B2 | Flowable silicon—carbon—oxygen layers for semiconductor processing | APPLIED MATERIALS, INC. (US) | 2016-05-17 | — | — | US | disclosed |
| US-20140302688-A1 | FLOWABLE SILICON-CARBON-OXYGEN LAYERS FOR SEMICONDUCTOR PROCESSING | APPLIED MATERIALS, INC. (US) | 2014-10-09 | — | — | US | disclosed |