⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL707236 | 0.86 | — | — | |
| SCHEMBL14645640 | 0.80 | — | — | |
| SCHEMBL16154019 | 0.80 | — | — | |
| SCHEMBL2567991 | 0.80 | — | — | |
| SCHEMBL16793282 | 0.80 | — | — | |
| SCHEMBL9233111 | 0.80 | — | — | |
| SCHEMBL6447689 | 0.80 | — | — | |
| SCHEMBL3804333 | 0.76 | — | — | |
| SCHEMBL1584953 | 0.68 | — | — | |
| SCHEMBL665764 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 92 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20080265381-A1 | SiCOH DIELECTRIC | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-10-30 | — | — | US | claimed |
| US-20070173071-A1 | SiCOH dielectric | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-07-26 | — | — | US | claimed |
| US-12624248-B2 | Curable formulations for forming low-k dielectric silicon-containing films using polycarbosilazane | L'AIR LIQUIDE, SOCIETÉ ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCÉDÉS GEORGES CLAUDE (FR) | 2026-05-12 | — | — | US | disclosed |
| CN-118696079-A | (Meth) acrylated hyperbranched polymer, preparation method thereof, composition comprising same and electronic device | 3M创新有限公司 | 2024-09-24 | — | — | CN | disclosed |
| CN-115038741-B | Curable formulations for forming low k dielectric silicon-containing films using polycarbosilazanes | 乔治洛德方法研究和开发液化空气有限公司 | 2024-04-02 | — | — | CN | disclosed |
| CN-116390972-A | Hyperbranched polymer, method for producing the same, and curable composition comprising the same | 3M创新有限公司 | 2023-07-04 | — | — | CN | disclosed |
| US-20230095074-A1 | CURABLE FORMULATIONS FOR FORMING LOW-k DIELECTRIC SILICON-CONTAINING FILMS USING POLYCARBOSILAZANE | AIR LIQUIDE (FR) | 2023-03-30 | — | — | US | disclosed |
| US-11499014-B2 | Cureable formulations for forming low-k dielectric silicon-containing films using polycarbosilazane | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude (FR) | 2022-11-15 | — | — | US | disclosed |
| EP-4085091-A1 | CURABLE FORMULATIONS FOR FORMING LOW-K DIELECTRIC SILICON-CONTAINING FILMS USING POLYCARBOSILAZANE | L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE (FR) | 2022-11-09 | — | — | EP | disclosed |
| US-20210198429-A1 | CUREABLE FORMULATIONS FOR FORMING LOW-k DIELECTRIC SILICON-CONTAINING FILMS USING POLYCARBOSILAZANE | AMERICAN AIR LIQUIDE, INC. | 2021-07-01 | — | — | US | disclosed |
| US-20200219765-A1 | INTERCONNECT STRUCTURES CONTAINING PATTERNABLE LOW-K DIELECTRICS AND ANTI-REFLECTIVE COATINGS AND METHOD OF FABRICATING THE SAME | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2020-07-09 | — | — | US | disclosed |
| WO-2008027497-A2 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| US-20080058479-A1 | Composition containing anti-misting component | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| US-20080058491-A1 | Branched polysiloxane composition | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| US-7273723-B2 | Antibiotic-based gene regulation system | FUSSENEGGER MARTIN | 2007-09-25 | — | — | US | disclosed |
| US-20070173071-A1 | SiCOH dielectric | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-07-26 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060165891-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-07-27 | — | — | US | disclosed |
| US-20050194619-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2005-09-08 | — | — | US | disclosed |
| CN-1527366-A | Mechanical property improvement of dense and porous organosilicate materials by ultraviolet radiation | �����Ʒ�뻯ѧ��˾ | 2004-09-08 | — | — | CN | disclosed |