⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27755156 | 0.94 | — | — | |
| SCHEMBL16154019 | 0.94 | — | — | |
| SCHEMBL2567991 | 0.94 | — | — | |
| SCHEMBL9233111 | 0.94 | — | — | |
| SCHEMBL16793282 | 0.94 | — | — | |
| SCHEMBL14645640 | 0.94 | — | — | |
| SCHEMBL6447689 | 0.94 | — | — | |
| SCHEMBL3804333 | 0.88 | — | — | |
| SCHEMBL400341 | 0.86 | — | — | |
| SCHEMBL3790531 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8765233-B2 | Method for forming low-carbon CVD film for filling trenches | ASM JAPAN K.K. (JP) | 2014-07-01 | — | — | US | claimed |
| US-20100143609-A1 | METHOD FOR FORMING LOW-CARBON CVD FILM FOR FILLING TRENCHES | ASM JAPAN K.K. (JP) | 2010-06-10 | — | — | US | claimed |
| JP-6256526-A | — | — | None | — | — | JP | disclosed |
| CN-115917712-A | Substrate processing apparatus, method for manufacturing semiconductor device, and plasma generating apparatus | 株式会社国际电气 | 2023-04-04 | — | — | CN | disclosed |
| CN-115810542-A | Substrate processing method, method for manufacturing semiconductor device, substrate processing apparatus, and program | 株式会社国际电气 | 2023-03-17 | — | — | CN | disclosed |
| US-20230079925-A1 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING SYSTEM, AND RECORDING MEDIUM | Kokusai Electric Corporation (JP) | 2023-03-16 | — | — | US | disclosed |
| CN-113518834-A | Compositions for silicon-containing films and methods of use thereof | 弗萨姆材料美国有限责任公司 | 2021-10-19 | — | — | CN | disclosed |
| CN-113243042-A | Method for manufacturing semiconductor device, substrate processing apparatus, and program | 株式会社国际电气 | 2021-08-10 | — | — | CN | disclosed |
| CN-113169069-A | Method for manufacturing semiconductor device, substrate processing apparatus, and program | 株式会社国际电气 | 2021-07-23 | — | — | CN | disclosed |
| US-9905413-B2 | Method of manufacturing semiconductor device | HITACHI KOKUSAI ELECTRIC, INC. (JP) | 2018-02-27 | — | — | US | disclosed |
| US-20170178889-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | HITACHI KOKUSAI ELECTRIC INC. (JP) | 2017-06-22 | — | — | US | disclosed |
| WO-2008140762-A2 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT OF REDUCED MOLECULAR WEIGHT AND VISCOSITY | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| US-20080276836-A1 | Composition containing anti-misting component of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| US-20080281055-A1 | Branched polysiloxane of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| WO-2008027497-A2 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| US-20080058479-A1 | Composition containing anti-misting component | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| US-20080058491-A1 | Branched polysiloxane composition | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| WO-2008027494-A2 | COMPOSITION CONTAINING ANTI-MISTING COMPONENT | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| JP-H06256526-A | ORGANIC POLYMER CONTAINING SILICON IN MAIN CHAIN AND ITS PRODUCTION | AGENCY OF IND SCIENCE & TECHNOL | 1994-09-13 | — | — | JP | disclosed |