⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1262491 | 0.82 | — | — | |
| SCHEMBL16874042 | 0.67 | — | — | |
| SCHEMBL6004088 | 0.67 | — | — | |
| SCHEMBL8168121 | 0.67 | — | — | |
| SCHEMBL995029 | 0.67 | — | — | |
| SCHEMBL214228 | 0.67 | — | — | |
| SCHEMBL17766196 | 0.67 | — | — | |
| SCHEMBL1615687 | 0.67 | — | — | |
| SCHEMBL11430022 | 0.58 | — | — | |
| SCHEMBL11426107 | 0.58 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 132 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113555341-B | Semiconductor element with air gap | 南亚科技股份有限公司 | 2024-05-24 | — | — | CN | claimed |
| US-11621188-B2 | Method for fabricating a semiconductor device with air gaps | NANYA TECHNOLOGY CORPORATION (TW) | 2023-04-04 | — | — | US | claimed |
| US-11355435-B2 | Semiconductor device with air gaps | NANYA TECHNOLOGY CORPORATION (TW) | 2022-06-07 | — | — | US | claimed |
| US-20210335711-A1 | SEMICONDUCTOR DEVICE WITH AIR GAPS | NANYA TECHNOLOGY CORPORATION (TW) | 2021-10-28 | — | — | US | claimed |
| CN-113555341-A | Semiconductor component with air gap | 南亚科技股份有限公司 | 2021-10-26 | — | — | CN | claimed |
| CN-113539950-A | Method for manufacturing semiconductor element | 南亚科技股份有限公司 | 2021-10-22 | — | — | CN | claimed |
| US-20210320030-A1 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE WITH AIR GAPS | NANYA TECHNOLOGY CORPORATION (TW) | 2021-10-14 | — | — | US | claimed |
| US-9613853-B2 | Copper wire and dielectric with air gaps | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2017-04-04 | — | — | US | claimed |
| US-20160035621-A1 | COPPER WIRE AND DIELECTRIC WITH AIR GAPS | ADEIA SEMICONDUCTOR SOLUTIONS LLC | 2016-02-04 | — | — | US | claimed |
| US-9230914-B2 | Copper wire and dielectric with air gaps | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2016-01-05 | — | — | US | claimed |
| US-20150137374-A1 | COPPER WIRE AND DIELECTRIC WITH AIR GAPS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2015-05-21 | — | — | US | claimed |
| US-8986523-B2 | Biosensor capacitor | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2015-03-24 | — | — | US | claimed |
| EP-1211707-B1 | Multiposition micro electromechanical switch | IBM (US) | 2007-08-01 | — | — | EP | claimed |
| US-6869878-B1 | Method of forming a selective barrier layer using a sacrificial layer | ADVANCED MICRO DEVICES, INC. (US) | 2005-03-22 | — | — | US | claimed |
| US-6489857-B2 | Multiposition micro electromechanical switch | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-12-03 | — | — | US | claimed |
| US-6455415-B1 | Method of encapsulated copper (Cu) interconnect formation | ADVANCED MICRO DEVICES, INC. | 2002-09-24 | — | — | US | claimed |
| EP-1211707-A2 | Multiposition micro electromechanical switch | International Business Machines Corporation (US) | 2002-06-05 | — | — | EP | claimed |
| US-20020063610-A1 | Multiposition micro electromechanical switch | WISTRON CORPORATION (TW) | 2002-05-30 | — | — | US | claimed |
| US-6259160-B1 | Apparatus and method of encapsulated copper (Cu) Interconnect formation | ADVANCED MICRO DEVICES, INC. | 2001-07-10 | — | — | US | claimed |
| US-5695810-A | Use of cobalt tungsten phosphide as a barrier material for copper metallization | CORNELL RESEARCH FOUNDATION, INC. (US) | 1997-12-09 | — | — | US | claimed |