SCHEMBL16210606

SCHEMBL16210606

CCCCCCCCOC(=O)CCc1cc(-c2cccc3n[nH]nc23)c(O)c(C(C)(C)C)c1

nearest known ligand 0.42

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.38
P2RY10 O00398 4/20 0.37
KDM4E B2RXH2 1/20 0.36
PLA2G4B P0C869 1/20 0.35
GAA P10253 2/20 0.35
KMT2A Q03164 2/20 0.35
EPHX2 P34913 3/20 0.35
CNR2 P34972 3/20 0.35
GPR174 Q9BXC1 3/20 0.34
GPR34 Q9UPC5 1/20 0.34
ALOX5 P09917 1/20 0.34
CNR1 P21554 1/20 0.33
MEN1 O00255 1/20 0.33
PPARG P37231 1/20 0.33
PPARA Q07869 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6278572 0.84 ALDH1A1 (0.38) ALDH1A1P2RY10KDM4EGAAKMT2A
SCHEMBL21331468 0.84 NAAA (0.40) ALDH1A1KDM4EPLA2G4BKMT2A
SCHEMBL2995152 0.81 CNR2 (0.37) ALDH1A1P2RY10KDM4EGAAKMT2A
SCHEMBL6302454 0.79 ALOX5 (0.43) ALDH1A1P2RY10KDM4ECNR2ALOX5
SCHEMBL17491243 0.79 GAA (0.53) GAAKMT2ACNR2CNR1
SCHEMBL2050437 0.79 GAA (0.53) GAAKMT2ACNR2CNR1
SCHEMBL754404 0.79 GAA (0.53) GAAKMT2ACNR2CNR1
SCHEMBL208070 0.79 GAA (0.53) GAAKMT2ACNR2CNR1
SCHEMBL283853 0.79 GAA (0.53) GAAKMT2ACNR2CNR1
SCHEMBL13899816 0.79 GAA (0.53) GAAKMT2ACNR2CNR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240174898-A1 PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR ELECTRICAL COMPONENTS WITH THREE-DIMENSIONAL STRUCTURE HYUNDAI MOBIS CO., LTD. (KR) 2024-05-30 US claimed
US-20240174898-A1 PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR ELECTRICAL COMPONENTS WITH THREE-DIMENSIONAL STRUCTURE HYUNDAI MOBIS CO., LTD. (KR) 2024-05-30 US disclosed
CN-114096408-A Resin composition for optical film 斯瓦蒙卢森堡公司 2022-02-25 CN disclosed
EP-2998359-B1 METHOD FOR IMPROVING THE ELECTRICAL-INSULATING PROPERTY AND THE FOGGING RESISTANCE OF A POLYESTER RESIN COMPOSITION ADEKA CORP (JP) 2019-08-21 EP disclosed
EP-3292176-B1 UV CURABLE COATING COMPOSITIONS FOR ORGANIC OPHTHALMIC LENSES ESSILOR INT (FR) 2019-01-30 EP disclosed
EP-3075784-B1 PROCESS FOR PRODUCING MASTERBATCH ADEKA CORP (JP) 2018-10-03 EP disclosed
US-9890256-B2 Process for producing masterbatch ADEKA CORPORATION (JP) 2018-02-13 US disclosed
US-20160347917-A1 PROCESS FOR PRODUCING MASTERBATCH ADEKA CORPORATION (JP) 2016-12-01 US disclosed
EP-3075784-A1 PROCESS FOR PRODUCING MASTERBATCH Adeka Corporation (JP) 2016-10-05 EP disclosed
US-20160115298-A1 MOLDED ARTICLE, INSULATING MATERIAL COMPRISING SAME, AND METHOD FOR IMPROVING ELECTRICAL-INSULATING PROPERTY OF POLYESTER RESIN COMPOSITION ADEKA CORPORATION (JP) 2016-04-28 US disclosed
EP-2998359-A1 MOLDED ARTICLE, INSULATING MATERIAL COMPRISING SAME, AND METHOD FOR IMPROVING ELECTRICAL-INSULATING PROPERTY OF POLYESTER RESIN COMPOSITION Adeka Corporation (JP) 2016-03-23 EP disclosed
US-9175196-B2 Photocurable adhesive composition and display device comprising same CHEIL INDUSTRIES, INC. (KR) 2015-11-03 US disclosed
US-20140329927-A1 PHOTOCURABLE ADHESIVE COMPOSITION AND DISPLAY DEVICE COMPRISING SAME CHEIL INDUSTRIES, INC. (KR) 2014-11-06 US disclosed