SCHEMBL16210609

SCHEMBL16210609

CCCCCCCCOC(=O)CC(c1ccc(O)c(C(C)(C)C)c1)n1nc2ccccc2n1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 2/20 0.39
GAA P10253 1/20 0.39
XBP1 P17861 1/20 0.39
ATM Q13315 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
KDM4E B2RXH2 2/20 0.36
KDM4A O75164 1/20 0.36
KDM4C Q9H3R0 1/20 0.36
ALDH1A1 P00352 3/20 0.36
HSD17B10 Q99714 2/20 0.36
HPGD P15428 1/20 0.36
TSHR P16473 2/20 0.36
LMNA P02545 1/20 0.36
CNR2 P34972 1/20 0.35
APP P05067 3/20 0.34
TP53 P04637 2/20 0.34
NPC1 O15118 1/20 0.34
RAB9A P51151 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
HSP90AA1 P07900 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL453355 0.90 CNR1 (0.37) NPSR1GAAXBP1ATML3MBTL1
SCHEMBL3969785 0.84 TNF (0.41) KDM4EALDH1A1TSHRRAB9AHSP90AA1
SCHEMBL28605900 0.81 NPSR1 (0.41) NPSR1GAAXBP1ATML3MBTL1
SCHEMBL2836826 0.81 HSP90AA1 (0.38) ALDH1A1HSD17B10TSHRLMNAHSP90AA1
SCHEMBL5617864 0.79 GAA (0.46) NPSR1GAAXBP1ATML3MBTL1
SCHEMBL28729927 0.79 GAA (0.46) NPSR1GAAXBP1ATML3MBTL1
SCHEMBL5313580 0.77 ALDH1A1 (0.44) NPSR1GAAXBP1ATML3MBTL1
SCHEMBL7531465 0.77 ALDH1A1 (0.37) NPSR1GAAL3MBTL1KDM4EALDH1A1
SCHEMBL27510293 0.75 NPSR1 (0.40) NPSR1GAAXBP1ATML3MBTL1
SCHEMBL9956554 0.74 GAA (0.49) NPSR1GAAXBP1ATML3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240174898-A1 PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR ELECTRICAL COMPONENTS WITH THREE-DIMENSIONAL STRUCTURE HYUNDAI MOBIS CO., LTD. (KR) 2024-05-30 US claimed
US-20240174898-A1 PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR ELECTRICAL COMPONENTS WITH THREE-DIMENSIONAL STRUCTURE HYUNDAI MOBIS CO., LTD. (KR) 2024-05-30 US disclosed
CN-114096408-A Resin composition for optical film 斯瓦蒙卢森堡公司 2022-02-25 CN disclosed
CN-105425545-B Positive photosensitive resin composition and use thereof 奇美实业股份有限公司 2019-11-08 CN disclosed
EP-2998359-B1 METHOD FOR IMPROVING THE ELECTRICAL-INSULATING PROPERTY AND THE FOGGING RESISTANCE OF A POLYESTER RESIN COMPOSITION ADEKA CORP (JP) 2019-08-21 EP disclosed
EP-3292176-B1 UV CURABLE COATING COMPOSITIONS FOR ORGANIC OPHTHALMIC LENSES ESSILOR INT (FR) 2019-01-30 EP disclosed
EP-3075784-B1 PROCESS FOR PRODUCING MASTERBATCH ADEKA CORP (JP) 2018-10-03 EP disclosed
US-9890256-B2 Process for producing masterbatch ADEKA CORPORATION (JP) 2018-02-13 US disclosed
US-20160347917-A1 PROCESS FOR PRODUCING MASTERBATCH ADEKA CORPORATION (JP) 2016-12-01 US disclosed
EP-3075784-A1 PROCESS FOR PRODUCING MASTERBATCH Adeka Corporation (JP) 2016-10-05 EP disclosed
US-20160115298-A1 MOLDED ARTICLE, INSULATING MATERIAL COMPRISING SAME, AND METHOD FOR IMPROVING ELECTRICAL-INSULATING PROPERTY OF POLYESTER RESIN COMPOSITION ADEKA CORPORATION (JP) 2016-04-28 US disclosed
EP-2998359-A1 MOLDED ARTICLE, INSULATING MATERIAL COMPRISING SAME, AND METHOD FOR IMPROVING ELECTRICAL-INSULATING PROPERTY OF POLYESTER RESIN COMPOSITION Adeka Corporation (JP) 2016-03-23 EP disclosed
US-9175196-B2 Photocurable adhesive composition and display device comprising same CHEIL INDUSTRIES, INC. (KR) 2015-11-03 US disclosed
US-20140329927-A1 PHOTOCURABLE ADHESIVE COMPOSITION AND DISPLAY DEVICE COMPRISING SAME CHEIL INDUSTRIES, INC. (KR) 2014-11-06 US disclosed