SCHEMBL1635147

SCHEMBL1635147

CCCC(=O)CC(=O)OOC(C)CC.CCCC(=O)CC(=O)OOC(C)CC.[Al]

nearest known ligand 0.34

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.34
FAAH O00519 4/20 0.34
CNR1 P21554 1/20 0.34
CNR2 P34972 1/20 0.34
LMNA P02545 2/20 0.31
EPHX2 P34913 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28159164 0.98 ALDH1A1 (0.35) ALDH1A1FAAHCNR1CNR2LMNA
SCHEMBL5974344 0.96 ALDH1A1 (0.34) ALDH1A1FAAHCNR1CNR2LMNA
SCHEMBL25284141 0.96 ALDH1A1 (0.34) ALDH1A1FAAHCNR1CNR2LMNA
SCHEMBL4147702 0.96 ALDH1A1 (0.34) ALDH1A1FAAHCNR1CNR2LMNA
SCHEMBL6138473 0.89 FFAR3 (0.34) FAAHCNR1CNR2
SCHEMBL4138225 0.89 FFAR3 (0.34) FAAHCNR1CNR2
SCHEMBL2475707 0.83 ALDH1A1 (0.38) ALDH1A1FAAHCNR1CNR2LMNA
SCHEMBL28891600 0.83 ALDH1A1 (0.46) ALDH1A1LMNA
SCHEMBL124651 0.81 ALDH1A1 (0.37) ALDH1A1FAAHCNR1CNR2LMNA
SCHEMBL30462935 0.81 ALDH1A1 (0.37) ALDH1A1FAAHCNR1CNR2LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7932295-B2 Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR CORPORATION (JP) 2011-04-26 US disclosed
US-20080246153-A1 ORGANIC SILICA-BASED FILM, METHOD OF FORMING THE SAME, COMPOSITION FOR FORMING INSULATING FILM FOR SEMICONDUCTOR DEVICE, INTERCONNECT STRUCTURE, AND SEMICONDUCTOR DEVICE JSR CORPORATION (JP) 2008-10-09 US disclosed