SCHEMBL16374643

SCHEMBL16374643

CCc1ccc(-c2ccc(CC(C)CC)cc2)cc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP17A1 P05093 1/20 0.39
BDKRB2 P30411 3/20 0.38
EGFR P00533 1/20 0.38
UCHL1 P09936 1/20 0.38
TSHR P16473 1/20 0.38
MAPK1 P28482 1/20 0.38
ATM Q13315 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
TP53 P04637 2/20 0.37
TAAR1 Q96RJ0 1/20 0.37
ACACB O00763 1/20 0.37
METAP2 P50579 1/20 0.36
CYP2A6 P11509 1/20 0.35
HRH3 Q9Y5N1 1/20 0.35
LPL P06858 1/20 0.35
LIPG Q9Y5X9 1/20 0.35
SIGMAR1 Q99720 1/20 0.35
SLC6A4 P31645 1/20 0.35
NISCH Q9Y2I1 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15161169 0.93 TP53 (0.42) TSHRMAPK1ATMTDP1L3MBTL1
SCHEMBL18559857 0.85 CYP19A1 (0.41) BDKRB2TAAR1ACACBCYP2A6HRH3
SCHEMBL8061416 0.85 SIGMAR1 (0.47) TAAR1ACACBCYP2A6SIGMAR1SLC6A4
SCHEMBL28048725 0.85 SIGMAR1 (0.47) TAAR1ACACBCYP2A6SIGMAR1SLC6A4
SCHEMBL8687580 0.83 SIGMAR1 (0.41) BDKRB2MAPK1L3MBTL1TAAR1ACACB
SCHEMBL1120020 0.83 TAAR1 (0.53) TSHRMAPK1TDP1TAAR1SIGMAR1
SCHEMBL8687796 0.83 TAAR1 (0.53) TSHRMAPK1TDP1TAAR1SIGMAR1
SCHEMBL8687584 0.83 SIGMAR1 (0.41) BDKRB2MAPK1L3MBTL1TAAR1ACACB
SCHEMBL15706795 0.82 MEN1 (0.47) BDKRB2EGFRUCHL1TSHRMAPK1
SCHEMBL10338370 0.82 BDKRB2 (0.35) BDKRB2HRH3SIGMAR1SLC6A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9902851-B2 Resin composition, prepreg, laminate, and printed wiring board MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2018-02-27 US disclosed
US-8928158-B2 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same CHEIL INDUSTRIES INC. (KR) 2015-01-06 US disclosed