SCHEMBL16381775

SCHEMBL16381775

Cc1ccc(S(=O)(=O)O/N=C(\C(=O)C(C)(C)C)c2nc3c(ccc4ccccc43)o2)cc1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HKDC1 Q2TB90 1/20 0.36
▸ TDP1 Q9NUW8 2/20 0.34
▸ HSF1 Q00613 1/20 0.34
▸ XDH P47989 1/20 0.34
▸ NLRP3 Q96P20 1/20 0.34
▸ RRM1 P23921 1/20 0.33
▸ KDM4E B2RXH2 4/20 0.32
▸ ALDH1A1 P00352 4/20 0.32
▸ NPSR1 Q6W5P4 1/20 0.32
▸ RXFP1 Q9HBX9 1/20 0.32
▸ SMN1; SMN2 Q16637 3/20 0.32
▸ MEN1 O00255 2/20 0.32
▸ KMT2A Q03164 2/20 0.32
▸ HTT P42858 2/20 0.32
▸ POLB P06746 1/20 0.32
▸ ENPP2 Q13822 1/20 0.32
▸ BCAT1 P54687 1/20 0.32
▸ MAPT P10636 3/20 0.31
▸ LMNA P02545 2/20 0.31
▸ L3MBTL1 Q9Y468 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24745458 1.00 HKDC1 (0.36) HKDC1TDP1HSF1XDHNLRP3
SCHEMBL16745528 0.87 HKDC1 (0.38) HKDC1TDP1HSF1XDHNLRP3
SCHEMBL16745526 0.87 HKDC1 (0.36) HKDC1TDP1HSF1XDHNLRP3
SCHEMBL16745530 0.86 TDP1 (0.38) TDP1HSF1KDM4EALDH1A1SMN1; SMN2
SCHEMBL16381781 0.86 HKDC1 (0.34) HKDC1XDHNLRP3RRM1KDM4E
SCHEMBL16381780 0.83 XDH (0.50) HSF1XDHNLRP3SMN1; SMN2KEAP1
SCHEMBL16745523 0.83 XDH (0.39) XDHNLRP3KDM4EALDH1A1NPSR1
SCHEMBL18649980 0.82 HSF1 (0.37) HKDC1TDP1HSF1XDHNLRP3
SCHEMBL17364363 0.82 TDP1 (0.41) TDP1HSF1KDM4EALDH1A1SMN1; SMN2
SCHEMBL26339085 0.82 HSF1 (0.33) TDP1HSF1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230305403-A1 PATTERN FORMING METHOD, MANUFACTURING METHOD OF CIRCUIT BOARD, AND LAMINATE FUJIFILM CORPORATION (JP) 2023-09-28 — — US disclosed
US-20230245912-A1 TRANSFER FILM, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR CIRCUIT WIRE, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-08-03 — — US disclosed
US-20230213695-A1 LAMINATES, POLARIZING PLATES, AND IMAGE DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2023-07-06 — — US disclosed
US-11692050-B2 Photo-alignment copolymer, binder composition, binder layer, optical laminate, and image display device FUJIFILM CORPORATION (JP) 2023-07-04 — — US disclosed
US-20230167293-A1 COMPOSITION, TRANSFER FILM, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR CIRCUIT WIRE, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-06-01 — — US disclosed
US-20230125445-A1 COMPOSITION, TRANSFER FILM, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR CIRCUIT WIRE, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-04-27 — — US disclosed
US-20230125445-A1 COMPOSITION, TRANSFER FILM, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR CIRCUIT WIRE, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-04-27 — — US disclosed
US-10761251-B2 Resin film, coloring photosensitive composition, resin film production method, color filter, light shielding film, solid-state imaging element, and image display device FUJIFILM CORPORATION (JP) 2020-09-01 — — US disclosed
US-20180196178-A1 RESIN FILM, COLORING PHOTOSENSITIVE COMPOSITION, RESIN FILM PRODUCTION METHOD, COLOR FILTER, LIGHT SHIELDING FILM, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2018-07-12 — — US disclosed
US-20180196178-A1 RESIN FILM, COLORING PHOTOSENSITIVE COMPOSITION, RESIN FILM PRODUCTION METHOD, COLOR FILTER, LIGHT SHIELDING FILM, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2018-07-12 — — US disclosed
US-20160327865-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING RESIN PATTERN, CURED FILM, LIQUID CRYSTAL DISPLAY DEVICE, ORGANIC EL DISPLAY DEVICE, INFRARED CUT FILTER, AND SOLID-STATE IMAGING DEVICE FUJIFILM CORPORATION (JP) 2016-11-10 — — US disclosed
US-20160320529-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING RESIN PATTERN, CURED FILM, LIQUID CRYSTAL DISPLAY DEVICE, ORGANIC EL DISPLAY DEVICE, INFRARED CUT FILTER, AND SOLID-STATE IMAGING DEVICE FUJIFILM CORPORATION (JP) 2016-11-03 — — US disclosed
US-20160320529-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING RESIN PATTERN, CURED FILM, LIQUID CRYSTAL DISPLAY DEVICE, ORGANIC EL DISPLAY DEVICE, INFRARED CUT FILTER, AND SOLID-STATE IMAGING DEVICE FUJIFILM CORPORATION (JP) 2016-11-03 — — US disclosed
US-20160131976-A1 RESIST COMPOSITION FOR SEMICONDUCTOR MANUFACTURING PROCESS; RESIST FILM, RESIST-COATED MASK BLANKS, PHOTOMASK, AND RESIST PATTERNING METHOD USING SAID RESIST COMPOSITION; ELECTRONIC-DEVICE MANUFACTURING METHOD; AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2016-05-12 — — US disclosed
US-20160131976-A1 RESIST COMPOSITION FOR SEMICONDUCTOR MANUFACTURING PROCESS; RESIST FILM, RESIST-COATED MASK BLANKS, PHOTOMASK, AND RESIST PATTERNING METHOD USING SAID RESIST COMPOSITION; ELECTRONIC-DEVICE MANUFACTURING METHOD; AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2016-05-12 — — US disclosed
US-9223211-B2 Photosensitive resin compositions, processes for preparing cured films, the resulting cured films, organic EL display devices and liquid crystal display devices FUJIFILM CORPORATION (JP) 2015-12-29 — — US disclosed
US-9223211-B2 Photosensitive resin compositions, processes for preparing cured films, the resulting cured films, organic EL display devices and liquid crystal display devices FUJIFILM CORPORATION (JP) 2015-12-29 — — US disclosed
US-20150148546-A1 PHOTOSENSITIVE RESIN COMPOSITIONS, PROCESSES FOR PREPARING CURED FILMS, THE RESULTING CURED FILMS, ORGANIC EL DISPLAY DEVICES AND LIQUID CRYSTAL DISPLAY DEVICES FUJIFILM CORPORATION (JP) 2015-05-28 — — US disclosed
US-20150148546-A1 PHOTOSENSITIVE RESIN COMPOSITIONS, PROCESSES FOR PREPARING CURED FILMS, THE RESULTING CURED FILMS, ORGANIC EL DISPLAY DEVICES AND LIQUID CRYSTAL DISPLAY DEVICES FUJIFILM CORPORATION (JP) 2015-05-28 — — US disclosed
WO-2014208647-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED-FILM MANUFACTURING METHOD, CURED FILM, LIQUID-CRYSTAL DISPLAY, AND ORGANIC EL DISPLAY 富士フイルム株式会社 (JP) 2014-12-31 — — WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20150148546-A1 PHOTOSENSITIVE RESIN COMPOSITIONS, PROCESSES FOR PREPARING CURED FILMS, THE RESULTING CURED FILMS, ORGANIC EL DISPLAY DEVICES AND LIQUID CRYSTAL DISPLAY DEVICES LCP1, ARCN1, RARA HKDC1 4569/4885TDP1 1593/4885HSF1 1450/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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