SCHEMBL1639742

SCHEMBL1639742

CCO[Si](C)([SiH3])OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7594077 0.79
SCHEMBL699216 0.74
SCHEMBL64126 0.69
SCHEMBL9123116 0.69
SCHEMBL647513 0.69
SCHEMBL648046 0.69
SCHEMBL34977 0.69
SCHEMBL27813 0.69
SCHEMBL17797160 0.69
SCHEMBL5691043 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110648961-B Semiconductor structure and forming method thereof 台湾积体电路制造股份有限公司 2023-05-23 CN claimed
CN-110648961-B Semiconductor structure and forming method thereof 台湾积体电路制造股份有限公司 2023-05-23 CN disclosed
CN-115527988-A Integrated circuit structure and forming method thereof 台湾积体电路制造股份有限公司 2022-12-27 CN disclosed
EP-1391476-B1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO LTD (JP) 2015-12-09 EP disclosed
CN-103547647-A Adhesive composition for laminate and back protective sheet for solar cell TOYO INK SC HOLDINGS CO LTD 2014-01-29 CN disclosed
CN-101970572-B Photocurable composition SEKISUI CHEMICAL CO LTD 2014-01-29 CN disclosed
CN-103534325-A Adhesive agent composition for laminate sheet, and back surface protecting sheet for solar cell TOYO INK SC HOLDINGS CO LTD 2014-01-22 CN disclosed
US-8536242-B2 Photocurable composition SEKISUI CHEMICAL CO., LTD. (JP) 2013-09-17 US disclosed
US-20110097669-A1 PHOTOCURABLE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2011-04-28 US disclosed
US-7312013-B2 Photoreactive composition SEKISUI CHEMICAL CO., LTD. (JP) 2007-12-25 US disclosed
US-20040202956-A1 a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films SEKISUI CHEMICAL CO., LTD. (JP) 2004-10-14 US disclosed
CN-1524104-A Photoreactive composition ��Ԩ��ѧ��ҵ��ʽ���� 2004-08-25 CN disclosed
EP-1391476-A1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2004-02-25 EP disclosed